SG78282A1 - A method for removing surface contaminants on moulds used in semiconductor packaging tools - Google Patents

A method for removing surface contaminants on moulds used in semiconductor packaging tools

Info

Publication number
SG78282A1
SG78282A1 SG1997004544A SG1997004544A SG78282A1 SG 78282 A1 SG78282 A1 SG 78282A1 SG 1997004544 A SG1997004544 A SG 1997004544A SG 1997004544 A SG1997004544 A SG 1997004544A SG 78282 A1 SG78282 A1 SG 78282A1
Authority
SG
Singapore
Prior art keywords
semiconductor packaging
removing surface
surface contaminants
moulds used
packaging tools
Prior art date
Application number
SG1997004544A
Other languages
English (en)
Inventor
Lu Yong Feng
Song Wen Song
Gow Cheng Pak
Chen Qiong
Tay Huck Wee
Hwa Teik Hing Thomas
Lim Lui Chin Dawn
Jason Ngin Yan Koon
Jason Sim Yak Hui
Original Assignee
Advanced Systems Automation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation filed Critical Advanced Systems Automation
Priority to SG1997004544A priority Critical patent/SG78282A1/en
Priority to TW087106779A priority patent/TW480689B/zh
Priority to MYPI98002099A priority patent/MY136708A/en
Priority to EP98936795A priority patent/EP1039977A4/en
Priority to PCT/SG1998/000058 priority patent/WO1999030845A1/en
Priority to CNB988122863A priority patent/CN1210113C/zh
Priority to JP2000538813A priority patent/JP2002508249A/ja
Publication of SG78282A1 publication Critical patent/SG78282A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cleaning In General (AREA)
  • Laser Beam Processing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG1997004544A 1997-12-18 1997-12-18 A method for removing surface contaminants on moulds used in semiconductor packaging tools SG78282A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
SG1997004544A SG78282A1 (en) 1997-12-18 1997-12-18 A method for removing surface contaminants on moulds used in semiconductor packaging tools
TW087106779A TW480689B (en) 1997-12-18 1998-05-01 An efficient semiconductor packaging process suitable for high-volume production of semiconductor devices
MYPI98002099A MY136708A (en) 1997-12-18 1998-05-08 A method for removing surface contaminants on moulds used in semiconductor packaging tools
EP98936795A EP1039977A4 (en) 1997-12-18 1998-07-06 PROCESS FOR REMOVING SURFACE CONTAMINANTS FROM MOLDS USED ON SEMICONDUCTOR ENCAPSULATION TOOLS
PCT/SG1998/000058 WO1999030845A1 (en) 1997-12-18 1998-07-06 A method for removing surface contaminants on moulds used in semiconductor packaging tools
CNB988122863A CN1210113C (zh) 1997-12-18 1998-07-06 清除半导体封装设备中模具表面污物的方法
JP2000538813A JP2002508249A (ja) 1997-12-18 1998-07-06 半導体パッケージツールで用いられるモールドの表面汚染物を除去するための方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG1997004544A SG78282A1 (en) 1997-12-18 1997-12-18 A method for removing surface contaminants on moulds used in semiconductor packaging tools

Publications (1)

Publication Number Publication Date
SG78282A1 true SG78282A1 (en) 2001-02-20

Family

ID=20429813

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997004544A SG78282A1 (en) 1997-12-18 1997-12-18 A method for removing surface contaminants on moulds used in semiconductor packaging tools

Country Status (7)

Country Link
EP (1) EP1039977A4 (zh)
JP (1) JP2002508249A (zh)
CN (1) CN1210113C (zh)
MY (1) MY136708A (zh)
SG (1) SG78282A1 (zh)
TW (1) TW480689B (zh)
WO (1) WO1999030845A1 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4630442B2 (ja) * 2000-10-19 2011-02-09 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP3789349B2 (ja) * 2001-11-16 2006-06-21 Ｔｏｗａ株式会社 樹脂成形用金型のクリーニング方法及び装置
TW552188B (en) * 2001-11-16 2003-09-11 Towa Corp Apparatus and method for evaluating degree of adhesion of adherents to mold surface, apparatus and method for surface treatment of mold surface and method and apparatus for cleaning mold used for molding resin
JP2004230750A (ja) * 2003-01-31 2004-08-19 Sumitomo Heavy Ind Ltd 金型クリーニング方法及び金型クリーニング装置
KR100626037B1 (ko) 2004-11-18 2006-09-20 삼성에스디아이 주식회사 마스크 세정방법
JP2006317726A (ja) * 2005-05-13 2006-11-24 Nec Lcd Technologies Ltd 断線修正方法及びアクティブマトリックス基板の製造方法並びに表示装置
JP5314876B2 (ja) * 2006-11-22 2013-10-16 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
CN104043617A (zh) * 2014-05-19 2014-09-17 南京南车浦镇城轨车辆有限责任公司 金属表面油污激光清洗设备
WO2018054595A1 (de) 2016-09-26 2018-03-29 Saint-Gobain Glass France Vorrichtung und verfahren zur herstellung einer strukturierten funktionellen beschichtung auf einer gebogenen glas-schicht
GB201701607D0 (en) * 2017-01-31 2017-03-15 Advanced Laser Tech Ltd Scanning and cleaning of moulds
CN107377532A (zh) * 2017-08-25 2017-11-24 济南高能清扬激光清洗有限公司 一种橡胶制品模具的复合清洗方法
CN108816960B (zh) * 2018-06-14 2020-06-26 爱阔特(上海)清洗设备制造有限公司 一种半导体光刻板清洗装置
CN108807129B (zh) * 2018-06-21 2020-09-01 北京蜃景光电科技有限公司 镀膜腔室清洗装置及镀膜腔室清洗方法
CN108787631A (zh) * 2018-07-09 2018-11-13 江苏峰钛激光科技有限公司 一种重锈蚀层的激光清洗方法
JP6930946B2 (ja) * 2018-07-10 2021-09-01 Ｔｏｗａ株式会社 成形型クリーニング装置、成形型クリーニング方法、樹脂成形装置、及び樹脂成形品製造方法
JP2020006600A (ja) * 2018-07-10 2020-01-16 Ｔｏｗａ株式会社 成形型クリーニング装置及び方法、樹脂成形装置、並びに樹脂成形品製造方法
CN111375603A (zh) * 2018-12-29 2020-07-07 膳魔师（江苏）家庭制品有限公司 一种保温杯的褪漆方法及装置
CN110303009B (zh) 2019-06-26 2020-10-16 深圳市华星光电技术有限公司 紫外光清洁装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD242760A1 (de) * 1985-11-19 1987-02-11 Akad Wissenschaften Ddr Verfahren zur pruefung der reinheit von substratoberflaechen und zur reinigung derselben
DE3767890D1 (de) * 1986-02-14 1991-03-14 Amoco Corp Behandlung von geformten oberflaechen mit ultraviolettlaser.
DE3721940A1 (de) * 1987-07-02 1989-01-12 Ibm Deutschland Entfernen von partikeln von oberflaechen fester koerper durch laserbeschuss
JPH01122417A (ja) * 1987-11-06 1989-05-15 Rohm Co Ltd 合成樹脂モールド用金型の清掃方法
US5023424A (en) * 1990-01-22 1991-06-11 Tencor Instruments Shock wave particle removal method and apparatus
US5373140A (en) * 1993-03-16 1994-12-13 Vernay Laboratories, Inc. System for cleaning molding equipment using a laser
IT1282722B1 (it) * 1996-03-01 1998-03-31 Pirelli Metodo ed apparato per la pulitura di stampi di vulcanizzazione di articoli in materiale elastomerico

Also Published As

Publication number Publication date
EP1039977A4 (en) 2003-08-13
MY136708A (en) 2008-11-28
CN1210113C (zh) 2005-07-13
EP1039977A1 (en) 2000-10-04
WO1999030845A1 (en) 1999-06-24
CN1282277A (zh) 2001-01-31
JP2002508249A (ja) 2002-03-19
TW480689B (en) 2002-03-21

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