SG72758A1 - Substrate processing system - Google Patents

Substrate processing system

Info

Publication number
SG72758A1
SG72758A1 SG1997003360A SG1997003360A SG72758A1 SG 72758 A1 SG72758 A1 SG 72758A1 SG 1997003360 A SG1997003360 A SG 1997003360A SG 1997003360 A SG1997003360 A SG 1997003360A SG 72758 A1 SG72758 A1 SG 72758A1
Authority
SG
Singapore
Prior art keywords
processing system
substrate processing
substrate
processing
Prior art date
Application number
SG1997003360A
Other languages
English (en)
Inventor
Masami Akimoto
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG72758A1 publication Critical patent/SG72758A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
SG1997003360A 1996-09-13 1997-09-10 Substrate processing system SG72758A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26532996A JP3202929B2 (ja) 1996-09-13 1996-09-13 処理システム

Publications (1)

Publication Number Publication Date
SG72758A1 true SG72758A1 (en) 2000-05-23

Family

ID=17415686

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997003360A SG72758A1 (en) 1996-09-13 1997-09-10 Substrate processing system

Country Status (5)

Country Link
US (1) US5942013A (ko)
JP (1) JP3202929B2 (ko)
KR (1) KR100459957B1 (ko)
SG (1) SG72758A1 (ko)
TW (1) TW336330B (ko)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6034000A (en) * 1997-07-28 2000-03-07 Applied Materials, Inc. Multiple loadlock system
JP3340945B2 (ja) * 1997-08-06 2002-11-05 東京エレクトロン株式会社 塗布現像処理装置
KR100487393B1 (ko) * 1997-10-13 2005-06-16 도쿄 오카 고교 가부시키가이샤 처리장치구축체
JP2001060610A (ja) * 1999-06-17 2001-03-06 Tokyo Electron Ltd 基板搬送装置、処理装置、基板の処理システム、搬送方法、収納装置および収容ボックス
US6293713B1 (en) 1999-07-02 2001-09-25 Tokyo Electron Limited Substrate processing apparatus
JP3635214B2 (ja) 1999-07-05 2005-04-06 東京エレクトロン株式会社 基板処理装置
US6428262B1 (en) * 1999-08-11 2002-08-06 Proteros, Llc Compact load lock system for ion beam processing of foups
US6402400B1 (en) * 1999-10-06 2002-06-11 Tokyo Electron Limited Substrate processing apparatus
US6402401B1 (en) * 1999-10-19 2002-06-11 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
US6402508B2 (en) * 1999-12-09 2002-06-11 Tokyo Electron Limited Heat and cooling treatment apparatus and substrate processing system
US6949143B1 (en) 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
DE10039201A1 (de) * 2000-08-10 2002-02-28 Siemens Ag Verfahren zum Betreiben einer Bestückanlage, Bestückanlage zur Durchführung des Verfahrens und Übergabeeinrichtung für die Bestückanlage
US6379056B1 (en) 2000-09-12 2002-04-30 Tokyo Electron Limited Substrate processing apparatus
KR100960773B1 (ko) * 2000-09-15 2010-06-01 어플라이드 머티어리얼스, 인코포레이티드 처리 장비용 더블 이중 슬롯 로드록
US6790286B2 (en) * 2001-01-18 2004-09-14 Dainippon Screen Mfg. Co. Ltd. Substrate processing apparatus
JP4796040B2 (ja) * 2001-03-09 2011-10-19 東京エレクトロン株式会社 基板処理装置、基板処理方法、および基板製造方法
JP4619562B2 (ja) * 2001-03-27 2011-01-26 東京エレクトロン株式会社 処理装置
JP2002329661A (ja) * 2001-04-27 2002-11-15 Yoshitake Ito 基板処理装置及び基板処理方法及び基板の製造方法
US7316966B2 (en) * 2001-09-21 2008-01-08 Applied Materials, Inc. Method for transferring substrates in a load lock chamber
ATE291830T1 (de) * 2001-12-18 2005-04-15 Marconi Comm Gmbh Vorrichtung und verfahren zur herstellung elektronischer schaltungen
FR2844258B1 (fr) * 2002-09-06 2005-06-03 Recif Sa Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert
TW200505776A (en) * 2003-01-31 2005-02-16 Aviza Tech Inc Transport system having shared load-lock front-end assembly
US7207766B2 (en) * 2003-10-20 2007-04-24 Applied Materials, Inc. Load lock chamber for large area substrate processing system
US7497414B2 (en) * 2004-06-14 2009-03-03 Applied Materials, Inc. Curved slit valve door with flexible coupling
US20060130767A1 (en) * 2004-12-22 2006-06-22 Applied Materials, Inc. Purged vacuum chuck with proximity pins
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7819079B2 (en) * 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
JP2005142590A (ja) * 2005-01-28 2005-06-02 Yoshitake Ito 基板処理装置及び基板処理方法並びに基板の製造方法
US20070006936A1 (en) * 2005-07-07 2007-01-11 Applied Materials, Inc. Load lock chamber with substrate temperature regulation
KR100695231B1 (ko) 2005-11-18 2007-03-14 세메스 주식회사 기판을 처리하는 장치 및 방법
US7845891B2 (en) 2006-01-13 2010-12-07 Applied Materials, Inc. Decoupled chamber body
US7665951B2 (en) 2006-06-02 2010-02-23 Applied Materials, Inc. Multiple slot load lock chamber and method of operation
US7845618B2 (en) 2006-06-28 2010-12-07 Applied Materials, Inc. Valve door with ball coupling
US8124907B2 (en) 2006-08-04 2012-02-28 Applied Materials, Inc. Load lock chamber with decoupled slit valve door seal compartment
KR100904392B1 (ko) * 2007-06-18 2009-06-26 세메스 주식회사 기판 처리 장치
CN101855717B (zh) * 2007-11-09 2011-10-19 佳能安内华股份有限公司 在线型晶圆输送装置
JP4643630B2 (ja) * 2007-11-27 2011-03-02 東京エレクトロン株式会社 処理装置
US8033769B2 (en) * 2007-11-30 2011-10-11 Novellus Systems, Inc. Loadlock designs and methods for using same
JP2008109158A (ja) * 2007-12-28 2008-05-08 Yoshitake Ito 基板処理装置、基板処理方法、基板の製造方法及び電子機器
JP2008166820A (ja) * 2007-12-28 2008-07-17 Yoshitake Ito 基板処理装置、基板処理方法、基板の製造方法及び電子機器
JP2008124502A (ja) * 2008-02-01 2008-05-29 Yoshitake Ito 基板処理装置及び基板処理方法及び基板の製造方法及び電子機器
JP2011119468A (ja) * 2009-12-03 2011-06-16 Tokyo Electron Ltd 被処理体の搬送方法および被処理体処理装置
WO2012150798A2 (ko) * 2011-05-03 2012-11-08 주식회사 테라세미콘 인라인 열처리 장치
CN113257723B (zh) * 2021-07-08 2022-04-22 北京北方华创微电子装备有限公司 半导体工艺设备
KR20230029443A (ko) * 2021-08-24 2023-03-03 주식회사 케이씨텍 기판 세정 라인 및 이를 포함하는 기판 세정 시스템
KR102565999B1 (ko) * 2022-08-04 2023-08-10 안승배 미소부품 운송장치 및 그 제조방법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5030057A (en) * 1987-11-06 1991-07-09 Tel Sagami Limited Semiconductor wafer transferring method and apparatus and boat for thermal treatment of a semiconductor wafer
KR970003907B1 (ko) * 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
JP2704309B2 (ja) * 1990-06-12 1998-01-26 大日本スクリーン製造株式会社 基板処理装置及び基板の熱処理方法
JP2835890B2 (ja) * 1991-09-17 1998-12-14 東京エレクトロン株式会社 処理装置
US5580607A (en) * 1991-07-26 1996-12-03 Tokyo Electron Limited Coating apparatus and method
JP2867194B2 (ja) * 1992-02-05 1999-03-08 東京エレクトロン株式会社 処理装置及び処理方法
KR100221983B1 (ko) * 1993-04-13 1999-09-15 히가시 데쓰로 처리장치
KR100267617B1 (ko) * 1993-04-23 2000-10-16 히가시 데쓰로 진공처리장치 및 진공처리방법
JPH0725410A (ja) * 1993-07-05 1995-01-27 Yodogawa Kasei Kk ガラス基板移載装置
US5626675A (en) * 1993-11-18 1997-05-06 Tokyo Electron Limited Resist processing apparatus, substrate processing apparatus and method of transferring a processed article
US5626913A (en) * 1994-03-09 1997-05-06 Tokyo Electron Limited Resist processing method and apparatus
KR100284559B1 (ko) * 1994-04-04 2001-04-02 다카시마 히로시 처리방법 및 처리장치
TW309503B (ko) * 1995-06-27 1997-07-01 Tokyo Electron Co Ltd
JP3069945B2 (ja) * 1995-07-28 2000-07-24 東京エレクトロン株式会社 処理装置

Also Published As

Publication number Publication date
KR19980024626A (ko) 1998-07-06
US5942013A (en) 1999-08-24
JP3202929B2 (ja) 2001-08-27
TW336330B (en) 1998-07-11
KR100459957B1 (ko) 2005-01-17
JPH1092733A (ja) 1998-04-10

Similar Documents

Publication Publication Date Title
SG72758A1 (en) Substrate processing system
SG65015A1 (en) Substrate treatment system
GB9600823D0 (en) Distributed processing
GB9706558D0 (en) Data processing system
SG64441A1 (en) Resist processing system
GB2325110B (en) Voice processing system
GB2325112B (en) Voice processing system
GB2294789B (en) Distributed processing system
EP0717355A3 (en) Parallel processing system
KR20010012685A (ko) 처리 장치
AU2429395A (en) Semiconductor processing systems
GB9609431D0 (en) Data processing
GB2318660B (en) Parallel computer processing system
SG70641A1 (en) Processing system
EP0953182A4 (en) INTELLIGENT HYPERSENSORIC PROCESSING SYSTEM
SG67441A1 (en) Processing system
IL131947A0 (en) Data processing system
NZ325380A (en) Distributed processing
GB9620196D0 (en) Distributed processing
GB2322507B (en) Voice processing system
HK1009864A1 (en) Information processing system
AU4682799A (en) Processing system
GB0005479D0 (en) Data processing system
GB9517048D0 (en) Processing system
GB9825009D0 (en) Processing system