SG68033A1 - Semiconductor substrate and process for producing the same - Google Patents
Semiconductor substrate and process for producing the sameInfo
- Publication number
- SG68033A1 SG68033A1 SG1998000614A SG1998000614A SG68033A1 SG 68033 A1 SG68033 A1 SG 68033A1 SG 1998000614 A SG1998000614 A SG 1998000614A SG 1998000614 A SG1998000614 A SG 1998000614A SG 68033 A1 SG68033 A1 SG 68033A1
- Authority
- SG
- Singapore
- Prior art keywords
- porous
- substrate
- image
- layer
- producing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
- H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
- H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7351997 | 1997-03-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG68033A1 true SG68033A1 (en) | 1999-10-19 |
Family
ID=13520585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1998000614A SG68033A1 (en) | 1997-03-26 | 1998-03-25 | Semiconductor substrate and process for producing the same |
Country Status (10)
Country | Link |
---|---|
US (1) | US20030190794A1 (de) |
EP (1) | EP0867919B1 (de) |
KR (1) | KR100356416B1 (de) |
CN (1) | CN1114936C (de) |
AT (1) | ATE275761T1 (de) |
AU (1) | AU742371B2 (de) |
CA (1) | CA2233132C (de) |
DE (1) | DE69826053T2 (de) |
SG (1) | SG68033A1 (de) |
TW (1) | TW376585B (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6143628A (en) * | 1997-03-27 | 2000-11-07 | Canon Kabushiki Kaisha | Semiconductor substrate and method of manufacturing the same |
US8507361B2 (en) * | 2000-11-27 | 2013-08-13 | Soitec | Fabrication of substrates with a useful layer of monocrystalline semiconductor material |
TWI226139B (en) | 2002-01-31 | 2005-01-01 | Osram Opto Semiconductors Gmbh | Method to manufacture a semiconductor-component |
KR101247727B1 (ko) | 2003-01-31 | 2013-03-26 | 오스람 옵토 세미컨덕터스 게엠베하 | 반도체 소자 제조 방법 |
EP1588409A1 (de) * | 2003-01-31 | 2005-10-26 | Osram Opto Semiconductors GmbH | Dünnfilmhalbleiterbauelement und verfahren zu dessen herstel lung |
KR20060017771A (ko) | 2003-05-06 | 2006-02-27 | 캐논 가부시끼가이샤 | 반도체기판, 반도체디바이스, 발광다이오드 및 그 제조방법 |
JP2004335642A (ja) * | 2003-05-06 | 2004-11-25 | Canon Inc | 基板およびその製造方法 |
DE102005047149A1 (de) * | 2005-09-30 | 2007-04-12 | Osram Opto Semiconductors Gmbh | Epitaxiesubstrat, damit hergestelltes Bauelement sowie entsprechende Herstellverfahren |
DE102007021991B4 (de) * | 2007-05-10 | 2015-03-26 | Infineon Technologies Austria Ag | Verfahren zum Herstellen eines Halbleiterbauelements durch Ausbilden einer porösen Zwischenschicht |
KR101443580B1 (ko) * | 2007-05-11 | 2014-10-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Soi구조를 갖는 기판 |
DE102009004559A1 (de) * | 2009-01-14 | 2010-07-22 | Institut Für Solarenergieforschung Gmbh | Verfahren zum Herstellen eines Halbleiterbauelementes, insbesondere einer Solarzelle, auf Basis einer Halbleiterdünnschicht mit einem direkten Halbleitermaterial |
DE102009004560B3 (de) * | 2009-01-14 | 2010-08-26 | Institut Für Solarenergieforschung Gmbh | Verfahren zum Herstellen eines Halbleiterbauelementes, insbesondere einer Solarzelle, auf Basis einer Germaniumdünnschicht |
US8043938B2 (en) * | 2009-05-14 | 2011-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing SOI substrate and SOI substrate |
US9847243B2 (en) | 2009-08-27 | 2017-12-19 | Corning Incorporated | Debonding a glass substrate from carrier using ultrasonic wave |
US8441071B2 (en) * | 2010-01-05 | 2013-05-14 | International Business Machines Corporation | Body contacted transistor with reduced parasitic capacitance |
JP5926887B2 (ja) * | 2010-02-03 | 2016-05-25 | 株式会社半導体エネルギー研究所 | Soi基板の作製方法 |
FR2995444B1 (fr) * | 2012-09-10 | 2016-11-25 | Soitec Silicon On Insulator | Procede de detachement d'une couche |
WO2014066740A1 (en) * | 2012-10-26 | 2014-05-01 | Element Six Technologies Us Corporation | Semiconductor devices with improved reliability and operating life and methods of manufacturing the same |
US20180068886A1 (en) * | 2016-09-02 | 2018-03-08 | Qualcomm Incorporated | Porous semiconductor layer transfer for an integrated circuit structure |
JP2019033134A (ja) * | 2017-08-04 | 2019-02-28 | 株式会社ディスコ | ウエーハ生成方法 |
US11211259B2 (en) * | 2018-04-20 | 2021-12-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Structure and method for embedded gettering in a silicon on insulator wafer |
JP2022541172A (ja) * | 2019-07-19 | 2022-09-22 | アイキューイー ピーエルシー | 調整可能な誘電率及び調整可能な熱伝導率を有する半導体材料 |
US11903300B2 (en) * | 2019-11-18 | 2024-02-13 | Universal Display Corporation | Pixel configurations for high resolution OVJP printed OLED displays |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3581514D1 (de) * | 1984-05-29 | 1991-02-28 | Mitsui Toatsu Chemicals | Film zur behandlung von halbleiterwaffeln. |
US4819387A (en) * | 1987-12-16 | 1989-04-11 | Motorola, Inc. | Method of slicing semiconductor crystal |
DE69331816T2 (de) * | 1992-01-31 | 2002-08-29 | Canon Kk | Verfahren zur Herstellung eines Halbleitersubstrats |
KR970009156A (ko) * | 1995-07-07 | 1997-02-24 | 김광호 | 보호모드를 가지는 팩시밀리 시스템 |
CN1076861C (zh) * | 1995-07-21 | 2001-12-26 | 佳能株式会社 | 半导体衬底及其制造方法 |
EP0797258B1 (de) * | 1996-03-18 | 2011-07-20 | Sony Corporation | Herstellungsverfahren von Dünnschichthalbleitern, Solarzellen und lichtemittierenden Dioden |
EP0840381A3 (de) * | 1996-10-31 | 1999-08-04 | Sony Corporation | Dünnschicht-Halbleiter-Vorrichtung und Verfahren und Vorrichtung zu ihrer Herstellung und Dünnschicht-Sonnenzellenmodul und Herstellungsverfahren |
CA2220600C (en) * | 1996-11-15 | 2002-02-12 | Canon Kabushiki Kaisha | Method of manufacturing semiconductor article |
-
1998
- 1998-03-24 EP EP98302187A patent/EP0867919B1/de not_active Expired - Lifetime
- 1998-03-24 TW TW087104398A patent/TW376585B/zh not_active IP Right Cessation
- 1998-03-24 AT AT98302187T patent/ATE275761T1/de not_active IP Right Cessation
- 1998-03-24 DE DE69826053T patent/DE69826053T2/de not_active Expired - Lifetime
- 1998-03-25 SG SG1998000614A patent/SG68033A1/en unknown
- 1998-03-25 CA CA002233132A patent/CA2233132C/en not_active Expired - Fee Related
- 1998-03-25 US US09/047,338 patent/US20030190794A1/en not_active Abandoned
- 1998-03-26 CN CN98114894A patent/CN1114936C/zh not_active Expired - Fee Related
- 1998-03-26 AU AU59666/98A patent/AU742371B2/en not_active Ceased
- 1998-03-26 KR KR1019980010435A patent/KR100356416B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW376585B (en) | 1999-12-11 |
EP0867919B1 (de) | 2004-09-08 |
DE69826053D1 (de) | 2004-10-14 |
EP0867919A3 (de) | 1999-06-16 |
KR19980080688A (ko) | 1998-11-25 |
AU742371B2 (en) | 2002-01-03 |
AU5966698A (en) | 1998-10-01 |
ATE275761T1 (de) | 2004-09-15 |
US20030190794A1 (en) | 2003-10-09 |
CA2233132A1 (en) | 1998-09-26 |
CN1114936C (zh) | 2003-07-16 |
CA2233132C (en) | 2002-04-02 |
KR100356416B1 (ko) | 2002-11-18 |
DE69826053T2 (de) | 2005-09-29 |
CN1200560A (zh) | 1998-12-02 |
EP0867919A2 (de) | 1998-09-30 |
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