SG67501A1 - Semiconductor device testing apparatus - Google Patents

Semiconductor device testing apparatus

Info

Publication number
SG67501A1
SG67501A1 SG1998001028A SG1998001028A SG67501A1 SG 67501 A1 SG67501 A1 SG 67501A1 SG 1998001028 A SG1998001028 A SG 1998001028A SG 1998001028 A SG1998001028 A SG 1998001028A SG 67501 A1 SG67501 A1 SG 67501A1
Authority
SG
Singapore
Prior art keywords
semiconductor device
testing apparatus
device testing
semiconductor
testing
Prior art date
Application number
SG1998001028A
Other languages
English (en)
Inventor
Hsiao Hayama
Toshio Goto
Yukio Kanno
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of SG67501A1 publication Critical patent/SG67501A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
SG1998001028A 1997-05-12 1998-05-12 Semiconductor device testing apparatus SG67501A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12069097 1997-05-12

Publications (1)

Publication Number Publication Date
SG67501A1 true SG67501A1 (en) 1999-09-21

Family

ID=14792556

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998001028A SG67501A1 (en) 1997-05-12 1998-05-12 Semiconductor device testing apparatus

Country Status (8)

Country Link
US (1) US6104204A (de)
KR (1) KR100299783B1 (de)
CN (1) CN1166956C (de)
DE (1) DE19821194B4 (de)
GB (1) GB2325358B (de)
MY (1) MY115748A (de)
SG (1) SG67501A1 (de)
TW (1) TW362155B (de)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6437586B1 (en) * 1997-11-03 2002-08-20 Micron Technology, Inc. Load board socket adapter and interface method
SG98373A1 (en) * 1998-11-25 2003-09-19 Advantest Corp Device testing apparatus
US6323669B1 (en) * 1999-02-02 2001-11-27 Samsung Electronics Co., Ltd. Apparatus and method for a contact test between an integrated circuit device an a socket
JP3054141B1 (ja) * 1999-03-31 2000-06-19 エム・シー・エレクトロニクス株式会社 Ｉｃデバイスの温度制御装置及び検査装置
US6331781B2 (en) * 1999-10-27 2001-12-18 Credence Systems Corporation Spaced adaptor plate for semiconductor tester
US6657426B1 (en) * 1999-11-10 2003-12-02 Data I/O Corporation Programmer
KR100392229B1 (ko) * 2001-01-09 2003-07-22 미래산업 주식회사 반도체 소자 테스트 핸들러의 인덱스헤드
JP4541571B2 (ja) * 2001-01-23 2010-09-08 キヤノン株式会社 半導体製造装置
US6668570B2 (en) * 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
US6889841B2 (en) * 2001-07-03 2005-05-10 Johnstech International Corporation Interface apparatus for reception and delivery of an integrated circuit package from one location to another
JP4119104B2 (ja) * 2001-07-12 2008-07-16 株式会社アドバンテスト ヒータ付プッシャ、電子部品ハンドリング装置および電子部品の温度制御方法
US7100389B1 (en) 2002-07-16 2006-09-05 Delta Design, Inc. Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test
US6864678B2 (en) * 2002-07-17 2005-03-08 Delta Design, Inc. Nestless plunge mechanism for semiconductor testing
WO2004084276A2 (en) * 2003-03-19 2004-09-30 Wayburn Lewis S Apparatus and method for controlling the temperature of an electronic device
US7026806B2 (en) * 2003-06-30 2006-04-11 International Business Machines Corporation Apparatus for preventing cross talk and interference in semiconductor devices during test
JP4355543B2 (ja) * 2003-09-11 2009-11-04 株式会社アドバンテスト 半導体試験システム
US7394271B2 (en) * 2004-02-27 2008-07-01 Wells-Cti, Llc Temperature sensing and prediction in IC sockets
DE102004051302A1 (de) * 2004-10-20 2006-05-11 Ief Werner Gmbh Vorrichtung zur Temperieren und Prüfen elektronischer und/oder elektromechanischer Bauteile
JP4571534B2 (ja) * 2005-05-12 2010-10-27 株式会社アドバンテスト 試験装置、診断プログラムおよび診断方法
CN100554952C (zh) * 2005-08-03 2009-10-28 鸿劲科技股份有限公司 集成电路检测机
DE102005046814B4 (de) * 2005-09-29 2008-02-14 Ief Werner Gmbh Vorrichtung zum Temperieren und Prüfen elektronischer und/oder elektromechanischer Bauteile
US20070132471A1 (en) * 2005-12-13 2007-06-14 Carlson Gregory F Method and apparatus for testing integrated circuits over a range of temperatures
DE102006005319B4 (de) * 2006-02-06 2010-12-30 Infineon Technologies Ag Heizvorrichtung zum Testen integrierter Bauelemente
US7528617B2 (en) * 2006-03-07 2009-05-05 Testmetrix, Inc. Apparatus having a member to receive a tray(s) that holds semiconductor devices for testing
TWI416136B (zh) * 2006-03-08 2013-11-21 Testmetrix Inc 測試半導體元件的設備及方法
US7965091B2 (en) * 2007-04-30 2011-06-21 Electro Scientific Industries, Inc. Test plate for electronic handler
KR100901523B1 (ko) * 2007-07-16 2009-06-08 (주)테크윙 테스트핸들러용 개방기 및 버퍼테이블
JP5151306B2 (ja) * 2007-08-09 2013-02-27 富士通株式会社 部品供給装置及びその方法
US7857646B2 (en) * 2008-05-02 2010-12-28 Micron Technology, Inc. Electrical testing apparatus having masked sockets and associated systems and methods
KR101507160B1 (ko) * 2008-09-04 2015-03-30 엘지전자 주식회사 영상기기의 패널 테스트 장치 및 이를 이용한 테스트 시스템
JP2010151794A (ja) * 2008-11-27 2010-07-08 Panasonic Corp 電子部品試験装置
KR100935409B1 (ko) 2009-01-15 2010-01-06 주식회사 유니세트 메모리 모듈 성능 시험장치
TWI382193B (zh) * 2009-02-17 2013-01-11 Quanta Comp Inc 測試系統以及測試方法
DE102009045291A1 (de) * 2009-10-02 2011-04-07 Ers Electronic Gmbh Vorrichtung zur Konditionierung von Halbleiterchips und Testverfahren unter Verwendung der Vorrichtung
US8697457B1 (en) * 2011-06-22 2014-04-15 Bae Systems Information And Electronic Systems Integration Inc. Devices and methods for stacking individually tested devices to form multi-chip electronic modules
JP5874427B2 (ja) * 2012-02-14 2016-03-02 セイコーエプソン株式会社 部品検査装置、及び、ハンドラー
JP5977962B2 (ja) * 2012-03-08 2016-08-24 株式会社日立製作所 電磁ノイズ解析方法及び装置
DE102012009796A1 (de) * 2012-05-18 2013-11-21 Micronas Gmbh Testsystem
JP2014215062A (ja) * 2013-04-23 2014-11-17 セイコーエプソン株式会社 ハンドラーおよび検査装置
KR101748239B1 (ko) * 2014-03-25 2017-06-16 가부시키가이샤 어드밴티스트 액추에이터, 핸들러 장치 및 시험 장치
JP2018511806A (ja) * 2015-04-01 2018-04-26 エクセラ・コーポレーションＸｃｅｒｒａ Ｃｏｒｐ． ファラデーケージを用いた集積回路（ｉｃ）テストソケット
US10897840B2 (en) * 2016-06-13 2021-01-19 Advanced Semiconductor Engineering Korea, Inc. Shield box, shield box assembly and apparatus for testing a semiconductor device
CN106483343A (zh) * 2016-11-03 2017-03-08 苏州创瑞机电科技有限公司 带加热功能的手动直针测试插座
CN106680548B (zh) * 2016-12-30 2019-08-30 深圳市矽电半导体设备有限公司 定位机构
JP7245639B2 (ja) 2018-12-14 2023-03-24 株式会社アドバンテスト センサ試験装置
CN109921374B (zh) * 2019-03-06 2021-06-22 江苏和网源电气有限公司 一种微电网电压保护装置
US12007433B2 (en) * 2021-01-26 2024-06-11 Changxin Memory Technologies, Inc. Mechanical arm and mechanical arm assembly, test system and method, storage medium and electronic device
CN113238136A (zh) * 2021-05-25 2021-08-10 陈海彬 一种低功耗的屏蔽栅半导体功率器件测试装置
FR3125885B1 (fr) * 2021-07-29 2023-07-28 St Microelectronics Grenoble 2 Dispositif et procédé de test de puces électroniques
CN113640605A (zh) * 2021-08-17 2021-11-12 常隆塑胶科技(苏州)有限公司 一种基于复合材料导电性能用测试装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3408565A (en) * 1966-03-02 1968-10-29 Philco Ford Corp Apparatus for sequentially testing electrical components under controlled environmental conditions including a component support mating test head
US4782291A (en) * 1985-10-04 1988-11-01 Blandin Bruce A Method and apparatus for the testing of active or passive electrical devices in a sub-zero environment
US5198752A (en) * 1987-09-02 1993-03-30 Tokyo Electron Limited Electric probing-test machine having a cooling system
US4904934A (en) * 1987-10-21 1990-02-27 Mitsubishi Denki Kabushiki Kaisha Testing apparatus for semiconductor devices
US4926118A (en) * 1988-02-22 1990-05-15 Sym-Tek Systems, Inc. Test station
JP2544015Y2 (ja) * 1990-10-15 1997-08-13 株式会社アドバンテスト Ｉｃ試験装置

Also Published As

Publication number Publication date
MY115748A (en) 2003-08-30
TW362155B (en) 1999-06-21
GB2325358A (en) 1998-11-18
GB2325358B (en) 1999-06-16
DE19821194A1 (de) 1998-11-26
GB9810033D0 (en) 1998-07-08
CN1166956C (zh) 2004-09-15
CN1205438A (zh) 1999-01-20
DE19821194B4 (de) 2005-09-22
KR100299783B1 (ko) 2001-09-06
US6104204A (en) 2000-08-15
KR19980086966A (ko) 1998-12-05

Similar Documents

Publication Publication Date Title
GB2325358B (en) Semiconductor device testing apparatus
SG98373A1 (en) Device testing apparatus
SG102568A1 (en) Semiconductor device test apparatus
AU3785097A (en) Semiconductor device testing apparatus
SG87862A1 (en) Electric device testing apparatus
SG81996A1 (en) Electronic device testing apparatus
GB9724457D0 (en) Test apparatus
SG108211A1 (en) Ic testing apparatus
GB9719408D0 (en) Comparator for semiconductor testing device
GB2338311B (en) IC testing apparatus
GB2328515B (en) Testing apparatus
GB9724458D0 (en) Test apparatus
GB2318187B (en) IC Testing Device
SG79979A1 (en) Semiconductor integrated circuit testing apparatus
SG79967A1 (en) Ic testing apparatus
GB9811795D0 (en) Test apparatus
GB2323930B (en) Testing apparatus
SG90717A1 (en) Semiconductor device testing apparatus
SG79250A1 (en) Ic testing apparatus
SG81269A1 (en) Ic testing apparatus
EP1144237A4 (de) Apparat zum testen einer mehrfachlenkanlage
GB9705946D0 (en) Testing apparatus
TW392847U (en) Semiconductor element testing device
SG102529A1 (en) Semiconductor device manufacturing apparatus
SG97766A1 (en) Burn-in testing device