SG60195A1 - Process for producing chip and pressure sensitive adhesive sheet for producing chip - Google Patents
Process for producing chip and pressure sensitive adhesive sheet for producing chipInfo
- Publication number
- SG60195A1 SG60195A1 SG1998000271A SG1998000271A SG60195A1 SG 60195 A1 SG60195 A1 SG 60195A1 SG 1998000271 A SG1998000271 A SG 1998000271A SG 1998000271 A SG1998000271 A SG 1998000271A SG 60195 A1 SG60195 A1 SG 60195A1
- Authority
- SG
- Singapore
- Prior art keywords
- producing chip
- sensitive adhesive
- adhesive sheet
- pressure sensitive
- chip
- Prior art date
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2605/00—Vehicles
- B32B2605/08—Cars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/91—Product with molecular orientation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24058—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in respective layers or components in angular relation
- Y10T428/24124—Fibers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31703—Next to cellulosic
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2657197 | 1997-02-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG60195A1 true SG60195A1 (en) | 1999-02-22 |
Family
ID=12197250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1998000271A SG60195A1 (en) | 1997-02-10 | 1998-02-09 | Process for producing chip and pressure sensitive adhesive sheet for producing chip |
Country Status (6)
Country | Link |
---|---|
US (2) | US6312800B1 (de) |
KR (1) | KR100466533B1 (de) |
DE (1) | DE19805146B4 (de) |
GB (1) | GB2322006B (de) |
MY (1) | MY122256A (de) |
SG (1) | SG60195A1 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6235387B1 (en) * | 1998-03-30 | 2001-05-22 | 3M Innovative Properties Company | Semiconductor wafer processing tapes |
JP3410371B2 (ja) * | 1998-08-18 | 2003-05-26 | リンテック株式会社 | ウエハ裏面研削時の表面保護シートおよびその利用方法 |
US6649259B1 (en) * | 2000-02-29 | 2003-11-18 | National Starch And Chemical Investment Holding Corporation | Adhesives for thermally shrinkable films or labels |
US6759121B2 (en) * | 2000-07-13 | 2004-07-06 | 3M Innovative Properties Company | Clear adhesive sheet |
JP4659300B2 (ja) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
JP2002164414A (ja) * | 2000-11-27 | 2002-06-07 | Shinkawa Ltd | 半導体ペレット処理方法及び装置 |
US6715307B2 (en) * | 2001-01-24 | 2004-04-06 | Calsonic Kansei Corporation | Air conditioner for vehicle |
MY137666A (en) * | 2001-04-09 | 2009-02-27 | Nitto Denko Corp | Label sheet for cleaning and conveying member having cleaning function |
JP3978345B2 (ja) * | 2002-02-06 | 2007-09-19 | 日本碍子株式会社 | 切断加工部品保持構造の形成方法および切断加工部品の製造方法 |
ATE518242T1 (de) | 2002-03-12 | 2011-08-15 | Hamamatsu Photonics Kk | Methode zur trennung von substraten |
JP4606741B2 (ja) * | 2002-03-12 | 2011-01-05 | 浜松ホトニクス株式会社 | 加工対象物切断方法 |
TWI326626B (en) | 2002-03-12 | 2010-07-01 | Hamamatsu Photonics Kk | Laser processing method |
JP4107417B2 (ja) | 2002-10-15 | 2008-06-25 | 日東電工株式会社 | チップ状ワークの固定方法 |
TWI520269B (zh) * | 2002-12-03 | 2016-02-01 | Hamamatsu Photonics Kk | Cutting method of semiconductor substrate |
FR2852250B1 (fr) * | 2003-03-11 | 2009-07-24 | Jean Luc Jouvin | Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau |
CN1758985A (zh) | 2003-03-12 | 2006-04-12 | 浜松光子学株式会社 | 激光加工方法 |
JP4283596B2 (ja) * | 2003-05-29 | 2009-06-24 | 日東電工株式会社 | チップ状ワークの固定方法 |
WO2005057644A1 (ja) * | 2003-12-15 | 2005-06-23 | The Furukawa Electric Co., Ltd. | ウェハ加工用テープおよびその製造方法 |
US7135385B1 (en) | 2004-04-23 | 2006-11-14 | National Semiconductor Corporation | Semiconductor devices having a back surface protective coating |
TWI387631B (zh) * | 2004-05-18 | 2013-03-01 | Hitachi Chemical Co Ltd | 黏著片與使用此黏著片之半導體裝置以及其製造方法 |
US7101620B1 (en) | 2004-09-07 | 2006-09-05 | National Semiconductor Corporation | Thermal release wafer mount tape with B-stage adhesive |
TWI333672B (en) * | 2005-03-29 | 2010-11-21 | Furukawa Electric Co Ltd | Wafer-dicing adhesive tape and method of producing chips using the same |
JP4707548B2 (ja) * | 2005-12-08 | 2011-06-22 | 富士通セミコンダクター株式会社 | 半導体装置、及び半導体装置の製造方法 |
WO2007122438A1 (en) * | 2006-04-21 | 2007-11-01 | Infineon Technologies Ag | A method for producing a thin semiconductor chip |
US8030138B1 (en) | 2006-07-10 | 2011-10-04 | National Semiconductor Corporation | Methods and systems of packaging integrated circuits |
EP2063460A4 (de) * | 2006-09-12 | 2011-08-03 | Nitto Denko Corp | Zerteilungs-/chipbondfilm |
KR101271225B1 (ko) * | 2006-10-31 | 2013-06-03 | 삼성디스플레이 주식회사 | 발광 다이오드 칩 및 발광 다이오드 광원 모듈의 제조 방법 |
KR100886732B1 (ko) * | 2006-11-10 | 2009-03-04 | 닛토덴코 가부시키가이샤 | 자동 롤링 적층 시트 및 자동 롤링 감압성 접착제 시트 |
JP2008235398A (ja) * | 2007-03-19 | 2008-10-02 | Disco Abrasive Syst Ltd | デバイスの製造方法 |
CN106564668A (zh) | 2007-04-05 | 2017-04-19 | 艾利丹尼森公司 | 压敏收缩标签 |
US8282754B2 (en) | 2007-04-05 | 2012-10-09 | Avery Dennison Corporation | Pressure sensitive shrink label |
US20110198024A1 (en) * | 2007-04-05 | 2011-08-18 | Avery Dennison Corporation | Systems and Processes for Applying Heat Transfer Labels |
US7749809B2 (en) * | 2007-12-17 | 2010-07-06 | National Semiconductor Corporation | Methods and systems for packaging integrated circuits |
US8048781B2 (en) * | 2008-01-24 | 2011-11-01 | National Semiconductor Corporation | Methods and systems for packaging integrated circuits |
WO2009131792A1 (en) * | 2008-04-22 | 2009-10-29 | 3M Innovative Properties Company | Adhesive article |
US20100015329A1 (en) * | 2008-07-16 | 2010-01-21 | National Semiconductor Corporation | Methods and systems for packaging integrated circuits with thin metal contacts |
KR101019756B1 (ko) * | 2009-12-24 | 2011-03-09 | 제일모직주식회사 | 비자외선형 다이접착필름 및 제조방법 |
JP5914360B2 (ja) | 2010-01-28 | 2016-05-11 | エーブリー デニソン コーポレイションAvery Dennison Corporation | ラベル貼付機ベルトシステム |
TWI546934B (zh) * | 2014-10-20 | 2016-08-21 | Playnitride Inc | Led陣列擴張方法及led陣列單元 |
JP6741529B2 (ja) * | 2016-09-09 | 2020-08-19 | 株式会社ディスコ | チップ間隔維持方法 |
CN112552832A (zh) * | 2020-12-10 | 2021-03-26 | 广东盈通新材料有限公司 | 一种感压型热封胶带及其制备方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL284964A (de) * | 1961-11-10 | 1900-01-01 | ||
JPH0616524B2 (ja) * | 1984-03-12 | 1994-03-02 | 日東電工株式会社 | 半導体ウエハ固定用接着薄板 |
JPH06105753B2 (ja) * | 1984-03-27 | 1994-12-21 | 日東電工株式会社 | 半導体ウエハの処理方法 |
JPS6181652A (ja) * | 1984-09-28 | 1986-04-25 | Shin Etsu Polymer Co Ltd | ダイシングフイルム |
US5187007A (en) | 1985-12-27 | 1993-02-16 | Lintec Corporation | Adhesive sheets |
JPS62153376A (ja) * | 1985-12-27 | 1987-07-08 | F S K Kk | ウェハダイシング用粘着シート |
DE3639266A1 (de) | 1985-12-27 | 1987-07-02 | Fsk K K | Haftfolie |
JP2521459B2 (ja) * | 1987-02-23 | 1996-08-07 | 日東電工株式会社 | 半導体チツプの製造方法 |
US5281473A (en) * | 1987-07-08 | 1994-01-25 | Furakawa Electric Co., Ltd. | Radiation-curable adhesive tape |
JPH0715087B2 (ja) * | 1988-07-21 | 1995-02-22 | リンテック株式会社 | 粘接着テープおよびその使用方法 |
JPH02265258A (ja) * | 1989-04-05 | 1990-10-30 | Fujitsu Ltd | ダイシング装置 |
JPH0353546A (ja) | 1989-07-21 | 1991-03-07 | Mitsubishi Electric Corp | 半導体装置の製造方法およびその製造装置 |
US5538771A (en) * | 1991-06-28 | 1996-07-23 | Furukawa Electric Co., Ltd. | Semiconductor wafer-securing adhesive tape |
KR930006846A (ko) | 1991-09-02 | 1993-04-22 | 사와무라 하루오 | 반도체 웨이퍼의 이면 연삭방법 및 그 방법에 이용하는 점착 테이프 |
US5252694A (en) * | 1992-01-22 | 1993-10-12 | Minnesota Mining And Manufacturing Company | Energy-polymerization adhesive, coating, film and process for making the same |
JP3410202B2 (ja) | 1993-04-28 | 2003-05-26 | 日本テキサス・インスツルメンツ株式会社 | ウェハ貼着用粘着シートおよびこれを用いた半導体装置の製造方法 |
WO1995012895A1 (fr) * | 1993-11-04 | 1995-05-11 | Nitto Denko Corporation | Procede pour produire un element a semi-conducteurs, et feuille auto-adhesive pour coller des tranches |
US5670260A (en) * | 1995-04-21 | 1997-09-23 | Adhesives Research, Inc. | Radiation-cured adhesive film having differential surface adhesion |
TW311927B (de) * | 1995-07-11 | 1997-08-01 | Minnesota Mining & Mfg | |
MY118036A (en) * | 1996-01-22 | 2004-08-30 | Lintec Corp | Wafer dicing/bonding sheet and process for producing semiconductor device |
JP3388674B2 (ja) * | 1996-04-19 | 2003-03-24 | リンテック株式会社 | エネルギー線硬化型感圧接着剤組成物およびその利用方法 |
GB2320615B (en) * | 1996-12-19 | 2001-06-20 | Lintec Corp | Process for producing a chip and pressure sensitive adhesive sheet for said process |
JP3955659B2 (ja) * | 1997-06-12 | 2007-08-08 | リンテック株式会社 | 電子部品のダイボンディング方法およびそれに使用されるダイボンディング装置 |
-
1998
- 1998-02-06 US US09/019,608 patent/US6312800B1/en not_active Expired - Lifetime
- 1998-02-09 DE DE1998105146 patent/DE19805146B4/de not_active Expired - Fee Related
- 1998-02-09 SG SG1998000271A patent/SG60195A1/en unknown
- 1998-02-10 MY MYPI98000530A patent/MY122256A/en unknown
- 1998-02-10 GB GB9802834A patent/GB2322006B/en not_active Expired - Fee Related
- 1998-02-10 KR KR10-1998-0003800A patent/KR100466533B1/ko active IP Right Grant
-
2001
- 2001-08-28 US US09/940,993 patent/US6702910B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
MY122256A (en) | 2006-04-29 |
US6312800B1 (en) | 2001-11-06 |
KR100466533B1 (ko) | 2005-06-20 |
GB2322006A (en) | 1998-08-12 |
GB2322006B (en) | 2002-01-09 |
US6702910B2 (en) | 2004-03-09 |
US20020025432A1 (en) | 2002-02-28 |
GB9802834D0 (en) | 1998-04-08 |
DE19805146A1 (de) | 1998-08-13 |
KR19980071222A (ko) | 1998-10-26 |
DE19805146B4 (de) | 2008-05-29 |
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