SG60090G - Method of making a semiconductor device - Google Patents
Method of making a semiconductor deviceInfo
- Publication number
- SG60090G SG60090G SG60090A SG60090A SG60090G SG 60090 G SG60090 G SG 60090G SG 60090 A SG60090 A SG 60090A SG 60090 A SG60090 A SG 60090A SG 60090 G SG60090 G SG 60090G
- Authority
- SG
- Singapore
- Prior art keywords
- making
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76229—Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76232—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls
- H01L21/76235—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials of trenches having a shape other than rectangular or V-shape, e.g. rounded corners, oblique or rounded trench walls trench shape altered by a local oxidation of silicon process step, e.g. trench corner rounding by LOCOS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76237—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials introducing impurities in trench side or bottom walls, e.g. for forming channel stoppers or alter isolation behavior
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10596586 | 1986-05-09 | ||
JP22770986 | 1986-09-26 | ||
JP62053453A JPS63184352A (ja) | 1986-05-09 | 1987-03-09 | 半導体装置の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG60090G true SG60090G (en) | 1990-09-07 |
Family
ID=27294953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG60090A SG60090G (en) | 1986-05-09 | 1990-07-19 | Method of making a semiconductor device |
Country Status (6)
Country | Link |
---|---|
DE (1) | DE3715092A1 (fr) |
FR (1) | FR2598557B1 (fr) |
GB (1) | GB2190241B (fr) |
HK (1) | HK28791A (fr) |
NL (1) | NL190591C (fr) |
SG (1) | SG60090G (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1189143B (it) * | 1986-05-16 | 1988-01-28 | Sgs Microelettronica Spa | Procedimento per la realizzazione dell'isolamento di circuiti integrati a elevatissima scala d'integrazione,in particolare in tecnologia mos e cmos |
JPH0442948A (ja) * | 1990-06-06 | 1992-02-13 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
KR920020676A (ko) * | 1991-04-09 | 1992-11-21 | 김광호 | 반도체 장치의 소자분리 방법 |
JPH0574927A (ja) * | 1991-09-13 | 1993-03-26 | Nec Corp | 半導体装置の製造方法 |
KR0147630B1 (ko) * | 1995-04-21 | 1998-11-02 | 김광호 | 반도체 장치의 소자분리방법 |
KR980006053A (ko) * | 1996-06-26 | 1998-03-30 | 문정환 | 반도체장치의 격리막 형성방법 |
CN102683290A (zh) * | 2011-03-08 | 2012-09-19 | 无锡华润上华半导体有限公司 | Rom器件及其制造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL170348C (nl) * | 1970-07-10 | 1982-10-18 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting, waarbij op een oppervlak van een halfgeleiderlichaam een tegen dotering en tegen thermische oxydatie maskerend masker wordt aangebracht, de door de vensters in het masker vrijgelaten delen van het oppervlak worden onderworpen aan een etsbehandeling voor het vormen van verdiepingen en het halfgeleiderlichaam met het masker wordt onderworpen aan een thermische oxydatiebehandeling voor het vormen van een oxydepatroon dat de verdiepingen althans ten dele opvult. |
JPS5578540A (en) * | 1978-12-08 | 1980-06-13 | Hitachi Ltd | Manufacture of semiconductor device |
US4238278A (en) * | 1979-06-14 | 1980-12-09 | International Business Machines Corporation | Polycrystalline silicon oxidation method for making shallow and deep isolation trenches |
JPS5694646A (en) * | 1979-12-28 | 1981-07-31 | Fujitsu Ltd | Forming method for oxidized film |
JPS5694647A (en) * | 1979-12-28 | 1981-07-31 | Fujitsu Ltd | Forming method for oxidized film |
US4394196A (en) * | 1980-07-16 | 1983-07-19 | Tokyo Shibaura Denki Kabushiki Kaisha | Method of etching, refilling and etching dielectric grooves for isolating micron size device regions |
JPS5893342A (ja) * | 1981-11-30 | 1983-06-03 | Toshiba Corp | 半導体装置の製造方法 |
US4435446A (en) * | 1982-11-15 | 1984-03-06 | Hewlett-Packard Company | Edge seal with polysilicon in LOCOS process |
JPS6054453A (ja) * | 1983-09-05 | 1985-03-28 | Oki Electric Ind Co Ltd | 半導体集積回路装置の製造方法 |
-
1987
- 1987-04-27 FR FR878705903A patent/FR2598557B1/fr not_active Expired - Lifetime
- 1987-04-30 GB GB8710281A patent/GB2190241B/en not_active Expired
- 1987-05-06 DE DE19873715092 patent/DE3715092A1/de active Granted
- 1987-05-08 NL NL8701087A patent/NL190591C/xx not_active IP Right Cessation
-
1990
- 1990-07-19 SG SG60090A patent/SG60090G/en unknown
-
1991
- 1991-04-18 HK HK287/91A patent/HK28791A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
HK28791A (en) | 1991-04-26 |
GB8710281D0 (en) | 1987-06-03 |
NL190591B (nl) | 1993-12-01 |
FR2598557B1 (fr) | 1990-03-30 |
NL8701087A (nl) | 1987-12-01 |
FR2598557A1 (fr) | 1987-11-13 |
DE3715092C2 (fr) | 1993-07-29 |
DE3715092A1 (de) | 1987-11-12 |
GB2190241A (en) | 1987-11-11 |
GB2190241B (en) | 1989-12-13 |
NL190591C (nl) | 1994-05-02 |
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