SG47120A1 - Container for a plate-like article - Google Patents

Container for a plate-like article

Info

Publication number
SG47120A1
SG47120A1 SG1996009152A SG1996009152A SG47120A1 SG 47120 A1 SG47120 A1 SG 47120A1 SG 1996009152 A SG1996009152 A SG 1996009152A SG 1996009152 A SG1996009152 A SG 1996009152A SG 47120 A1 SG47120 A1 SG 47120A1
Authority
SG
Singapore
Prior art keywords
article
container
plate
Prior art date
Application number
SG1996009152A
Other languages
English (en)
Inventor
Gen Nakamura
Hiroshi Nakazato
Satoshi Yoshinari
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of SG47120A1 publication Critical patent/SG47120A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D55/00—Accessories for container closures not otherwise provided for
    • B65D55/02—Locking devices; Means for discouraging or indicating unauthorised opening or removal of closure
    • B65D55/12—Devices or means with relatively-moving parts co-operating with abutments on bottle or jar
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Library & Information Science (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
SG1996009152A 1991-07-12 1992-07-10 Container for a plate-like article SG47120A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19735491 1991-07-12
JP16004992A JP3089590B2 (ja) 1991-07-12 1992-05-28 板状物収納容器およびその蓋開口装置

Publications (1)

Publication Number Publication Date
SG47120A1 true SG47120A1 (en) 1998-03-20

Family

ID=26486655

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996009152A SG47120A1 (en) 1991-07-12 1992-07-10 Container for a plate-like article

Country Status (5)

Country Link
US (1) US5314068A (de)
EP (1) EP0522865B1 (de)
JP (1) JP3089590B2 (de)
DE (1) DE69222370T2 (de)
SG (1) SG47120A1 (de)

Families Citing this family (71)

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US5481438A (en) * 1994-09-06 1996-01-02 Shinon Denkisangyo Kabushiki Kaisha Tray for semiconductor devices
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DE19745365A1 (de) * 1997-10-14 1999-01-21 Siemens Ag Halteeinrichtung für integrierte Schaltungen
JP3265252B2 (ja) 1998-01-13 2002-03-11 山形日本電気株式会社 半導体収納治具、ハンドリング方法及び生産システム
US6341695B1 (en) * 1998-05-07 2002-01-29 Texas Instruments Incorporated Containment device for retaining semiconductor wafers
US6216873B1 (en) * 1999-03-19 2001-04-17 Asyst Technologies, Inc. SMIF container including a reticle support structure
US6216421B1 (en) * 1999-07-01 2001-04-17 H-Square Corporation Device for seating and unseating a lid from a carrying cassette
US6338409B1 (en) * 2000-04-13 2002-01-15 International Business Machines Corporation Reticle SMIF pod in situ orientation
US6646720B2 (en) * 2001-09-21 2003-11-11 Intel Corporation Euv reticle carrier with removable pellicle
US7304720B2 (en) * 2002-02-22 2007-12-04 Asml Holding N.V. System for using a two part cover for protecting a reticle
TWI286674B (en) * 2002-12-27 2007-09-11 Asml Netherlands Bv Container for a mask, method of transferring lithographic masks therein and method of scanning a mask in a container
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US6882408B2 (en) * 2003-06-25 2005-04-19 Powerchip Semiconductor Corp. Reticle transferring support and transferring method thereof
JP4601932B2 (ja) * 2003-09-16 2010-12-22 大日本印刷株式会社 基板収納ケース
JP2005123292A (ja) * 2003-10-15 2005-05-12 Canon Inc 収納装置、当該収納装置を用いた露光方法
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JP4581681B2 (ja) * 2004-12-27 2010-11-17 株式会社ニコン レチクル保護装置および露光装置
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JP4644035B2 (ja) * 2005-05-25 2011-03-02 ミライアル株式会社 枚葉収納容器
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SG10201400835QA (en) * 2005-09-27 2014-07-30 Entegris Inc Reticle Pod
JP4789566B2 (ja) * 2005-09-30 2011-10-12 ミライアル株式会社 薄板保持容器及び薄板保持容器用処理装置
JP4903429B2 (ja) * 2005-12-05 2012-03-28 ミライアル株式会社 載置トレイ及び薄板保持容器
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JP4677335B2 (ja) * 2005-12-07 2011-04-27 株式会社レクザム 外観検査装置
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JP5043475B2 (ja) * 2007-03-05 2012-10-10 ミライアル株式会社 半導体ウエハ収納容器
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US8777007B2 (en) * 2012-04-13 2014-07-15 Shenzhen China Star Optoelectronics Technology Co., Ltd. Packaging box for liquid crystal glass
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US8939289B2 (en) * 2012-12-14 2015-01-27 Shenzhen China Star Optoelectronics Technology Co., Ltd Packing box for liquid crystal display panel and waterproof structure thereof
JP6020511B2 (ja) * 2014-05-08 2016-11-02 トヨタ自動車株式会社 ウエハキャリア
CN108107672B (zh) * 2016-11-25 2021-03-02 上海微电子装备（集团）股份有限公司 一种掩模版版盒
US10503082B2 (en) * 2017-07-31 2019-12-10 Taiwan Semiconductor Manufacturing Company, Ltd. Optical reticle load port
US11018037B2 (en) 2017-07-31 2021-05-25 Taiwan Semiconductor Manufacturing Company, Ltd. Optical reticle load port
CN107464770B (zh) * 2017-08-28 2020-10-13 武汉华星光电半导体显示技术有限公司 一种掩模板存储装置
TWI690771B (zh) * 2018-01-11 2020-04-11 家登精密工業股份有限公司 光罩壓抵單元及應用其之極紫外光光罩容器
JP6952627B2 (ja) * 2018-03-09 2021-10-20 株式会社ジェーイーエル 基板収納容器のロック解除機構
JP7283843B2 (ja) * 2018-04-19 2023-05-30 信越ポリマー株式会社 基板収納容器
KR102213411B1 (ko) * 2018-04-27 2021-02-08 스텍 코 엘티디 스냅-샷 케이스들을 개방하기 위한 장치 및 방법
TWI656075B (zh) * 2018-04-27 2019-04-11 友達光電股份有限公司 包裝緩衝結構及具有包裝緩衝結構的包裝容器
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CN109292280B (zh) * 2018-09-11 2021-01-26 京东方科技集团股份有限公司 用于装载薄膜的盒和装载薄膜的方法
TWI680086B (zh) * 2019-02-25 2019-12-21 家登精密工業股份有限公司 光罩盒及其固持件
WO2020170671A1 (ja) 2019-02-22 2020-08-27 村田機械株式会社 蓋開閉装置
CN113454007B (zh) * 2019-02-22 2023-02-17 村田机械株式会社 盖开闭装置
TWI693671B (zh) * 2019-04-16 2020-05-11 家登精密工業股份有限公司 光罩盒及其夾持件
JP7408335B2 (ja) * 2019-10-09 2024-01-05 株式会社ディスコ ワーク収容機構
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EP4258330A1 (de) * 2022-04-08 2023-10-11 Brooks Automation (Germany) GmbH Lagerbox, verfahren und lagervorrichtung zur lagerung eines halbleiterherstellungsartikels
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Also Published As

Publication number Publication date
EP0522865B1 (de) 1997-09-24
US5314068A (en) 1994-05-24
EP0522865A3 (en) 1993-06-02
JPH05175321A (ja) 1993-07-13
EP0522865A2 (de) 1993-01-13
DE69222370D1 (de) 1997-10-30
JP3089590B2 (ja) 2000-09-18
DE69222370T2 (de) 1998-02-05

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