TWM331743U - Photomask pod, photomask transport pod and the supporter thereof - Google Patents
Photomask pod, photomask transport pod and the supporter thereof Download PDFInfo
- Publication number
- TWM331743U TWM331743U TW096213177U TW96213177U TWM331743U TW M331743 U TWM331743 U TW M331743U TW 096213177 U TW096213177 U TW 096213177U TW 96213177 U TW96213177 U TW 96213177U TW M331743 U TWM331743 U TW M331743U
- Authority
- TW
- Taiwan
- Prior art keywords
- cover
- reticle
- photomask
- box
- transfer case
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
Description
M331743 八、新型說明: 【新型所屬之技術領域】 本創作係有關一種光罩盒以及光罩傳送盒,特別是指其中可防止靜電 放電破壞之光罩盒以及傳送盒。 【先前技術】 近代半導體科技發展迅速,其中光學微影技術(0ptical Lith〇graphy)扮演 重要的角色,只要是關於圖形(pattem)定義,皆需仰賴光學微影技術。 光學微影技術在半導體的應用上,是將設計好的線路製作成具有特定 形狀可透光之光罩(photo mask)。利用曝光原理,則光源通過光罩投影至石夕 晶圓(silicon wafer)可曝光顯示特定圖案。由於任何附著於光罩上的塵埃顆粒 (如微粒、粉塵或有機物)都會造成投影成像的品質劣化,用於產生圖形的光 罩必須保持絕對潔淨,因此在-般的晶圓製程中,都提供無塵室(deanr 的環境以避免空氣中的顆粒污染。然而,目前的無塵室也益法達到絕對無 塵狀態。現代的半導體餘皆抗污_鮮伽tidepGd)進行光罩祕 存與運輸,以使光罩保持潔淨。 習知的光罩盒多以高分子材質所構成,此種高分子材質具有成型容 易、價格低廉以及可形成透明體的優點。此種絕緣電阻高的高分子材質容 易因為磨誠_喊生靜電,尤其是無塵㈣作#環境需魏持較低濕 度’使n分子材質的光罩盒非常容減生與累積電荷。此外,在使用光罩 或是將光罩移進献移出光罩盒時,光罩表面也會_擦而產生靜電。光 罩表面的靜電容易吸引空氣中的污染微粒,更甚者還會造成光罩上的金屬 線出現靜電放_ectrostatic discharge,ES_ 電流會引起電花(spark)或電弧(arc),在電花與電弧發生的同時,強大的電流 伴隨著高溫,導致金屬線的氧化與溶解,因而改變了光罩的圖案。 目前針對靜電放電所解決财法有許多,首先是改善作業環境,使空 5 M3 31743 .Μ轉適當聽度、作業人員穿著具接地效應的衣物或使_子扇消除 • ㈣巾的靜電。但疋改變作業環境的具有許多無法綱的變因,沒有辦、去 - 完全解決靜電對光罩的傷害。 彳 • #種方法疋改變光罩盒組成元件的材質,美國專利號US6,513,654提 出,設置具接地功能的光罩支撐件,在光罩盒與配合機台接觸時,光罩支 撐件可將光罩上的電荷導出。另外美國專利號US6,247,5"提出,在光草盒 •的底盤、罩蓋或提把上概導電板,藉此減少電荷的累積。然以上方法均 • 須仰賴導電耕接地時釋出電荷,歧當靜電藉由導電元件釋出時,仍會 • 產生電流,還是會造成放電使得光罩受到損傷。 有蓉於以上缺失,本創作所提供之鮮支撐件或_件,乃針對先前 技術加以改良者。 【新型内容】 基於解決上述先前技術之缺失,本創作所提供之光罩盒,係將與光罩 直接接觸之支撐件或限制件作材質上的改變,利用靜電消散材質做為該支 撐件或限制件之材料,即便靜電消散材質會因為磨擦而產生電荷,但位於 Φ 附近的金屬材料會隨即將電荷導出,避免電荷累積以及靜電放電效應。 本創作之主要目的在於提供一種具有靜電消散材質的光罩支撐件,可 減少電荷累積,並且防止靜電對光罩所造成的傷害。 V 本創作之另一目的在於提供一種具有靜電消散材質的光罩支撐件,此 種材料可持續導出電荷,避免瞬間放電對光罩產生高溫傷害。 本創作之又一目的在於提供一種具有靜電消散材質的光罩限制件,可 減少電荷累積,並且防止靜電對光罩所造成的傷害。 本創作之再一目的在於提供一種具有靜電消散材質的光罩限制件,此 種材料可持續導出電荷,避免瞬間放電對光罩產生高溫傷害。 本創作提供一種光罩盒以及光罩傳送盒,其特徵在於針對與光罩直接 6M331743 VIII. New description: [New technical field] This creation relates to a mask case and a reticle transfer case, in particular to a mask case and a transfer case in which electrostatic discharge damage can be prevented. [Prior Art] Modern semiconductor technology has developed rapidly, and optical lithography (0ptical Lith〇graphy) plays an important role. As long as it is about the definition of graphic, it depends on optical lithography. In the application of semiconductors, optical lithography is to make a designed circuit into a photomask with a specific shape that can transmit light. Using the principle of exposure, the light source is projected through a reticle to a silicon wafer to expose a particular pattern. Since any dust particles (such as particles, dust, or organic matter) attached to the reticle will cause deterioration in the quality of the projection image, the reticle used to produce the pattern must be absolutely clean, so it is provided in the general wafer process. Clean room (deanr's environment to avoid particle pollution in the air. However, the current clean room is also easy to achieve absolute dust-free state. Modern semiconductors are anti-fouling _ fresh tidepGd) for mask storage and transportation To keep the mask clean. Conventional photomasks are mostly made of a polymer material, and the polymer material has the advantages of easy molding, low cost, and transparency. Such a high-density polymer material is easy to use because of the enthusiasm of the grinding, especially the dust-free (four), the environment needs to maintain a lower humidity, so that the mask of the n-molecular material is very reduced and accumulated. In addition, when the reticle is used or the reticle is moved into the reticle, the surface of the reticle is also rubbed to generate static electricity. The static electricity on the surface of the reticle is easy to attract the polluting particles in the air, and even more so, the static electricity discharge of the metal wire on the reticle occurs. The ES_ current causes spark or arc (arc). At the same time as the arc occurs, a strong current is accompanied by a high temperature, which causes oxidation and dissolution of the metal wires, thus changing the pattern of the reticle. At present, there are many financial solutions for electrostatic discharge. The first is to improve the working environment, to make the appropriate sound, to wear the clothes with grounding effect, or to eliminate the static electricity of the (4) towel. However, there are many unreasonable causes of changing the working environment, and there is no need to do or go - completely solve the damage of static electricity to the mask.彳•#方法方法疋Change the material of the components of the reticle box. US Pat. No. 6,513,654 proposes to provide a reticle support with a grounding function. When the reticle box is in contact with the mating machine, the reticle support can be The charge on the mask is derived. In addition, U.S. Patent No. 6,247,5" proposes to electrically conductive the plate on the chassis, cover or handle of the straw box, thereby reducing the accumulation of electric charge. However, all of the above methods must rely on the conductive ground to release the charge. When the static electricity is released by the conductive element, it will still generate current or cause the discharge to damage the mask. In addition to the above missing, the fresh support or _ pieces provided by this creation are aimed at improving the prior art. [New content] Based on the solution to the above-mentioned prior art, the photomask box provided by the present invention changes the material of the support member or the restriction member which is in direct contact with the reticle, and uses the static dissipative material as the support member or The material of the limiting member, even if the static dissipative material generates electric charge due to friction, the metal material located near Φ will be discharged immediately, avoiding charge accumulation and electrostatic discharge effect. The main purpose of this creation is to provide a reticle support with a static dissipative material that reduces charge buildup and prevents static damage to the reticle. V Another object of this creation is to provide a reticle support with a static dissipative material that can continue to conduct charge to prevent high temperature damage to the reticle due to transient discharge. Another object of the present invention is to provide a reticle restriction member having a static dissipative material, which can reduce charge accumulation and prevent damage caused by static electricity to the reticle. A further object of the present invention is to provide a reticle restriction member having a static dissipative material which can continuously derive a charge to prevent high temperature damage to the reticle by instantaneous discharge. The present invention provides a photomask case and a reticle transfer case, which are characterized in that they are directed to the reticle directly.
Claims (1)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096213177U TWM331743U (en) | 2007-08-10 | 2007-08-10 | Photomask pod, photomask transport pod and the supporter thereof |
US12/110,276 US20090038985A1 (en) | 2007-08-10 | 2008-04-25 | Photomask pod, photomask transport pod and supporter thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096213177U TWM331743U (en) | 2007-08-10 | 2007-08-10 | Photomask pod, photomask transport pod and the supporter thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM331743U true TWM331743U (en) | 2008-05-01 |
Family
ID=40345465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096213177U TWM331743U (en) | 2007-08-10 | 2007-08-10 | Photomask pod, photomask transport pod and the supporter thereof |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090038985A1 (en) |
TW (1) | TWM331743U (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5772261B2 (en) * | 2011-06-10 | 2015-09-02 | 株式会社ニコン | Mask protection device, transfer device, exposure device, and device manufacturing method |
US9715175B2 (en) | 2012-06-15 | 2017-07-25 | Nikon Corporation | Mask protection device, exposure apparatus, and method for manufacturing device |
TWI728722B (en) * | 2019-10-16 | 2021-05-21 | 家登精密工業股份有限公司 | Reticle retaining system |
TWI770791B (en) * | 2021-01-28 | 2022-07-11 | 家登精密工業股份有限公司 | Reticle pod with quickly assembling support mechanism |
US11901207B2 (en) * | 2021-06-18 | 2024-02-13 | Taiwan Semiconductor Manufacturing Company Limited | Semiconductor wafer processing system and method |
US11687011B2 (en) * | 2021-08-30 | 2023-06-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reticle carrier and associated methods |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
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US3615006A (en) * | 1969-06-26 | 1971-10-26 | Ibm | Storage container |
US4494651A (en) * | 1983-04-19 | 1985-01-22 | W. R. Grace & Co., Cryovac Div. | Electrically conductive anti-static work station |
US4776462A (en) * | 1985-09-27 | 1988-10-11 | Canon Kabushiki Kaisha | Container for a sheet-like article |
JP3089590B2 (en) * | 1991-07-12 | 2000-09-18 | キヤノン株式会社 | Plate-shaped container and lid opening device |
JP3200776B2 (en) * | 1992-08-06 | 2001-08-20 | 大日本印刷株式会社 | PCB holding case |
JPH0752661B2 (en) * | 1992-12-01 | 1995-06-05 | 山一電機株式会社 | IC carrier |
JPH08236605A (en) * | 1995-02-28 | 1996-09-13 | Komatsu Electron Metals Co Ltd | Semiconductor wafer case |
US6216873B1 (en) * | 1999-03-19 | 2001-04-17 | Asyst Technologies, Inc. | SMIF container including a reticle support structure |
US6247599B1 (en) * | 2000-01-14 | 2001-06-19 | Taiwan Semiconductor Manufacturing Company, Ltd | Electrostatic discharge-free container equipped with metal shield |
DE60134179D1 (en) * | 2000-07-10 | 2008-07-03 | Entegris Inc | SMIF CONTAINERS WITH ELECTROSTATIC CHARGES OF LEADING SUPPORT STRUCTURE FOR RETICIAL WASTE |
WO2004032208A1 (en) * | 2002-10-01 | 2004-04-15 | Microtome Precision, Inc. | Reduction of electric-field-induced damage in field-sensitive articles |
TWI224719B (en) * | 2003-05-28 | 2004-12-01 | Gudeng Prec Ind Co Ltd | Reinforced structure device of mask frame |
TWI262164B (en) * | 2004-12-15 | 2006-09-21 | Gudeng Prec Ind Co Ltd | Airtight semiconductor transferring container |
US7400383B2 (en) * | 2005-04-04 | 2008-07-15 | Entegris, Inc. | Environmental control in a reticle SMIF pod |
TW200808628A (en) * | 2006-08-09 | 2008-02-16 | Gudeng Prec Ind Co Ltd | Filling device of conveying box |
TWI303618B (en) * | 2006-08-10 | 2008-12-01 | Gudeng Prec Industral Co Ltd | Metal photomask box |
-
2007
- 2007-08-10 TW TW096213177U patent/TWM331743U/en not_active IP Right Cessation
-
2008
- 2008-04-25 US US12/110,276 patent/US20090038985A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20090038985A1 (en) | 2009-02-12 |
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Legal Events
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MC4K | Revocation of granted utility model |