TWI693671B - 光罩盒及其夾持件 - Google Patents
光罩盒及其夾持件 Download PDFInfo
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- TWI693671B TWI693671B TW108113284A TW108113284A TWI693671B TW I693671 B TWI693671 B TW I693671B TW 108113284 A TW108113284 A TW 108113284A TW 108113284 A TW108113284 A TW 108113284A TW I693671 B TWI693671 B TW I693671B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
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- Condensed Matter Physics & Semiconductors (AREA)
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- Preparing Plates And Mask In Photomechanical Process (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
本發明提供了一種光罩盒及其夾持件。所述夾持件包含一夾持臂及至少二夾持模組。其中該夾持臂夾設於該光罩盒上,每個該夾持模組設於該夾持臂末端並穿過該光罩盒,且每個該夾持模組包含一外殼、一抵止件及一彈性件。其中該外殼分設於該光罩盒內部及外部,該抵止件設於該外殼中並穿過該光罩盒,而該彈性件與該抵止件連接。
Description
本發明提供了一種光罩盒及其夾持件,由指一種在光罩盒關閉後會夾緊光罩避免其位移的光罩盒及其夾持件。
光罩在現在的半導體工業領域中屬於不可或缺的重要角色,如涉及黃光微影等傳統蝕刻技術甚至到近年來的極紫外光(Extreme Ultraviolet,EUV)曝光技術,光罩的使用仍然具有極重要的價值存在。
傳統上,光罩的傳載或儲存,多半仰賴光罩盒(Reticle Pod)來完成。而光罩盒也因應傳載或儲存等不同需求,分為光罩傳送盒及光罩儲存盒兩大類別。甚至,隨著科技日新月異,極紫外光(Extreme Ultraviolet,EUV)光罩也有其專屬的光罩傳送盒及光罩儲存盒。
而在既有的光罩盒中,對於光罩的保存和放置往往係考量到其承載穩定性的需求。對於極精密的光罩來說,當存放在光罩盒中,最重要的即為保持光罩的潔淨以及極力避免光罩因光罩盒的碰撞或晃動進而損傷。
傳統來說,光罩盒固定光罩的方式多半採用結構被動式的承載方式。然而,被動式的承載方式雖然可以短暫解決光罩固定的問題;然而,長久下來持續性的接觸摩擦,實際上也容易造成光罩盒或光罩的磨損。
因此,如何解決被動式光罩接觸的承載方式,可謂目前半導體產業中待解決的問題之一。
為解決先前技術中所提及的問題,本發明提出了一種光罩盒及其夾持件。所述夾持件主要包含一夾持臂及至少二夾持模組。其中該夾持臂夾設於一光罩盒上,而每個該夾持模組設於該夾持臂末端並穿過該光罩盒。此外,每個夾持模組包含一外殼、一抵止件以及一彈性件。該外殼分設於該光罩盒內部及外部,該抵止件設於該外殼中並穿過該光罩盒。至於該彈性件與該抵止件連接。其中,該彈性件用以復位該抵止件。
更進一步,前述夾持件更可實施於一光罩盒上,本發明所述之光罩盒包含一上蓋、一下蓋以及一夾持件。其中該下蓋與該上蓋蓋合,該夾持件主要包含一夾持臂及至少二夾持模組。其中該夾持臂夾設於一光罩盒上,而每個該夾持模組設於該夾持臂末端並穿過該上蓋。此外,每個夾持模組包含一外殼、一抵止件以及一彈性件。該外殼分設於該上蓋內部及外部,該抵止件設於該外殼中並穿過該上蓋。至於該彈性件與該抵止件連接。其中,該彈性件用以復位該抵止件。
以上對本發明的簡述,目的在於對本發明之數種面向和技術特徵作一基本說明。發明簡述並非對本發明的詳細表述,因此其目的不在特別列舉本發明的關鍵性或重要元件,也不是用來界定本發明的範圍,僅為以簡明的方式呈現本發明的數種概念而已。
100:光罩盒
101:上蓋
102:下蓋
200:夾持件
201:夾持臂
202:夾持模組
2021:抵止件
2022:彈性件
2023:保護件
2024:氣密件
2025:外殼
R:光罩
圖1係本發明實施例之光罩盒外觀結構圖。
圖2係本發明實施例未夾持光罩狀態之橫剖面圖。
圖3係本發明實施例夾持件之細部橫剖面圖。
圖4係本發明實施例已夾持光罩狀態之橫剖面圖。
為能瞭解本發明的技術特徵及實用功效,並可依照說明書的內容來實施,茲進一步以如圖式所示的較佳實施例,詳細說明如後:首先請參照圖1,圖1係本發明實施例之光罩盒外觀結構圖。如圖1所示,本發明實施例將會結合夾持件200及其可應用的光罩盒100進行說明。在本實施例中,夾持件200中的夾持臂201係以ㄇ字型橋接的方式橫跨於光罩盒100之上。其固定方式可以用螺絲栓固等方式固定於光罩盒100上。
此外,對於光罩盒100的種類,其係可為光罩傳送盒、光罩儲存盒或極紫外光光罩盒。本實施例之光罩盒100係選用符合標準機械介面(Standard Mechanical Interface)的光罩傳送盒實施,然實際上對於光罩盒100的種類,本發明並不加以限制。
敬請同時參照圖1-4,圖2係本發明實施例未夾持光罩狀態之橫剖面圖;圖3係本發明實施例夾持件之細部橫剖面圖;圖4係本發明實施例已夾持光罩狀態之橫剖面圖。圖2中虛線方框的部份即為夾持模組202,其放大圖請詳參圖3。換言之,圖1中的光罩盒100和夾持件200的組合即呈現出本實施例的總成。該光罩盒100主要包含上蓋101、下蓋102以及前述夾持件200。下蓋102可與上蓋101蓋合,至於夾持件200同樣由夾持臂201及至少二夾持模組202構成。而每個夾持模組202設於夾持臂201末端並穿過上蓋101,形成本實施例的樣態。
如圖2及圖3所示,本實施例的夾持件200主要包含夾持臂201及至少二夾持模組202。其中夾持臂201夾設於光罩盒100上,而每個夾持模組202設
於夾持臂201末端並穿過光罩盒100的上蓋101。在圖2中,可清晰看到光罩盒100分為兩個部位,包含上蓋101及下蓋102。而夾持件200則以夾持臂201及夾持模組202為主構成。
在本實施例中,夾持臂201係懸空設置於上蓋101之上,形成ㄇ字型架橋。而夾持臂201ㄇ字型架橋結構的末端各設置有一個夾持模組202。在本實施例中,夾持模組202的夾持啟動條件可由使用者依照需求調控。包含機械手臂對於持臂201與夾持模組202施加向內的壓力等皆可做為啟動的條件;亦可在夾持模組202的外部設置手動開關或是由下蓋102和上蓋101蓋合時觸動板機,讓兩個夾持模組202自動啟動。
當然,夾持模組202的啟動條件,也不排除當光罩盒100進行傳載時,由天車吊起或是卡扣於特定機械結構點上時觸發夾持模組202的夾持動作。例如,夾持臂201ㄇ字型架橋結構被吊起時,產生向上拉動的力,藉由此向上拉動的力量牽引ㄇ字型架橋架結構兩側的力臂形成倒梯形,向內側擠壓,使夾持模組202啟動夾持光罩的作動機制。然,本發明對於夾持模組202可觸發的條件並不加以限制。
此外,本實施例中的每個夾持模組202包含外殼2025、抵止件2021以及彈性件2022。且外殼2025分設於光罩盒100上蓋101的內部及外部,抵止件2021則設於外殼2025中並穿過光罩盒100的上蓋101。至於彈性件2022與抵止件2021連接。且該彈性件2022用以復位抵止件2021。接著如圖3所示,在本實施例中,抵止件2021為箭矢狀的設計,且其箭矢之箭鋒端(靠近與光罩R接觸的一端)上更設有保護件2023。本實施例的保護件2023可採用任何具有阻尼效果的耐磨
材料(例如矽膠表面塗佈或覆上鐵氟龍材料),除了能夠有效保護光罩R之外,更能減少有微小顆粒的產生。
至於外殼2025與抵止件2021間更設有氣密件2024,得以讓整個夾持模組202和光罩盒100的上蓋之間保持氣密狀態。本實施例中的彈性件2022係透過螺旋的方式貫穿設於氣密件2024之中,並抵住外殼2025的底端。當抵止件2021無需往前推動抵止光罩R時,彈性件2022可協助抵止件2021復歸到原本的位置,達到被動復位的功效。
最後,請參照圖4,當本發明實施例的夾持模組202啟動時,便會由左右兩側夾持置於光罩盒100中光罩R。透過這個作動機制,可使本發明實施例之光罩盒100僅有在被搬運或是特定條件的狀況下才會有和光罩R之間產生物理接觸,直接解決了傳統被動式光罩盒會長期且持續接觸光罩的問題。
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即依本發明申請專利範圍及說明內容所作之簡單變化與修飾,皆仍屬本發明涵蓋之範圍內。
200:夾持件
201:夾持臂
202:夾持模組
2021:抵止件
2022:彈性件
2023:保護件
2024:氣密件
2025:外殼
R:光罩
Claims (10)
- 一種夾持件,包含: 一夾持臂,夾設於一光罩盒上; 至少二夾持模組,每個該夾持模組設於該夾持臂末端並穿過該光罩盒,每個該夾持模組包含: 一外殼,分設於該光罩盒內部及外部; 一抵止件,設於該外殼中並穿過該光罩盒;以及 一彈性件,與該抵止件連接; 其中,該彈性件用以復位該抵止件。
- 如請求項1所述的夾持件,其中該抵止件上更設有一保護件。
- 如請求項1所述的夾持件,其中該外殼與該抵止件間更設有一氣密件。
- 如請求項1所述的夾持件,其中該抵止件為箭矢狀。
- 一種光罩盒,包含: 一上蓋; 一下蓋,與該上蓋蓋合; 一夾持件,包含: 一夾持臂,夾設於該上蓋; 至少二夾持模組,每個該夾持模組設於該夾持臂末端並穿過該上蓋,每個該夾持模組包含: 一外殼,分設於該上蓋內部及外部; 一抵止件,設於該外殼中並穿過該上蓋;以及 一彈性件,與該抵止件連接; 其中,該彈性件用以復位該抵止件。
- 如請求項5所述的光罩盒,其中該抵止件上更設有一保護件。
- 如請求項5所述的光罩盒,其中該外殼與該抵止件間更設有一氣密件。
- 如請求項5所述的光罩盒,其中該抵止件為箭矢狀。
- 如請求項5所述的光罩盒,其中該至少二夾持模組夾持置於該光罩盒中的一光罩。
- 如請求項5所述的光罩盒,其中該光罩盒為光罩傳送盒、光罩儲存盒或極紫外光光罩盒。
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TW108113284A TWI693671B (zh) | 2019-04-16 | 2019-04-16 | 光罩盒及其夾持件 |
CN201910394739.8A CN111830781B (zh) | 2019-04-16 | 2019-05-13 | 光罩盒及其夹持件 |
US16/451,004 US11430682B2 (en) | 2019-04-16 | 2019-06-24 | Reticle pod and gripping unit thereof |
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TWD209117S (zh) * | 2019-08-02 | 2021-01-01 | 家登精密工業股份有限公司 | 光罩傳送盒之上蓋 |
TWD209927S (zh) * | 2019-08-02 | 2021-02-21 | 家登精密工業股份有限公司 | 光罩傳送盒之上蓋 |
TWI803860B (zh) * | 2020-04-30 | 2023-06-01 | 美商恩特葛瑞斯股份有限公司 | 光罩盒密封 |
TWI819840B (zh) * | 2022-10-11 | 2023-10-21 | 家碩科技股份有限公司 | 光罩內盒的夾持具 |
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US20180210349A1 (en) * | 2017-01-25 | 2018-07-26 | Gudeng Precision Industrial Co, Ltd | EUV Reticle Pod |
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JP3089590B2 (ja) * | 1991-07-12 | 2000-09-18 | キヤノン株式会社 | 板状物収納容器およびその蓋開口装置 |
JP2000340642A (ja) * | 1999-05-27 | 2000-12-08 | Nikon Corp | 基板収納ケース及びこれを用いる露光装置 |
JP2010118535A (ja) * | 2008-11-13 | 2010-05-27 | Muratec Automation Co Ltd | 運搬装置 |
CN201980572U (zh) * | 2011-02-14 | 2011-09-21 | 中勤实业股份有限公司 | 光罩盒的减震结构 |
SG11201408295UA (en) * | 2012-06-14 | 2015-01-29 | Murata Machinery Ltd | Lid opening/closing device |
CN203486280U (zh) * | 2013-08-05 | 2014-03-19 | 玮懋科技材料股份公司 | 光罩收纳盒结构 |
CN203707099U (zh) * | 2014-02-27 | 2014-07-09 | 耀连科技有限公司 | 隔离式搬运盒的抵持构件 |
US10418263B2 (en) * | 2018-01-20 | 2019-09-17 | Boris Kesil | Overhead transportation system for transporting objects between multiple work stations |
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- 2019-04-16 TW TW108113284A patent/TWI693671B/zh active
- 2019-05-13 CN CN201910394739.8A patent/CN111830781B/zh active Active
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US20180210349A1 (en) * | 2017-01-25 | 2018-07-26 | Gudeng Precision Industrial Co, Ltd | EUV Reticle Pod |
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US20200335362A1 (en) | 2020-10-22 |
CN111830781A (zh) | 2020-10-27 |
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US11430682B2 (en) | 2022-08-30 |
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