SG46717A1 - Anisotropic conductive adhesive film - Google Patents
Anisotropic conductive adhesive filmInfo
- Publication number
- SG46717A1 SG46717A1 SG1996009227A SG1996009227A SG46717A1 SG 46717 A1 SG46717 A1 SG 46717A1 SG 1996009227 A SG1996009227 A SG 1996009227A SG 1996009227 A SG1996009227 A SG 1996009227A SG 46717 A1 SG46717 A1 SG 46717A1
- Authority
- SG
- Singapore
- Prior art keywords
- adhesive film
- conductive adhesive
- anisotropic conductive
- anisotropic
- film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72908291A | 1991-07-12 | 1991-07-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG46717A1 true SG46717A1 (en) | 1998-02-20 |
Family
ID=24929511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996009227A SG46717A1 (en) | 1991-07-12 | 1992-05-27 | Anisotropic conductive adhesive film |
Country Status (8)
Country | Link |
---|---|
US (1) | US5330684A (ja) |
EP (1) | EP0594644B1 (ja) |
JP (1) | JP3231814B2 (ja) |
CA (1) | CA2113090A1 (ja) |
DE (1) | DE69218207T2 (ja) |
HK (1) | HK1006849A1 (ja) |
SG (1) | SG46717A1 (ja) |
WO (1) | WO1993001248A1 (ja) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5250600A (en) * | 1992-05-28 | 1993-10-05 | Johnson Matthey Inc. | Low temperature flexible die attach adhesive and articles using same |
US5524422A (en) * | 1992-02-28 | 1996-06-11 | Johnson Matthey Inc. | Materials with low moisture outgassing properties and method of reducing moisture content of hermetic packages containing semiconductor devices |
DE4316607A1 (de) * | 1993-05-18 | 1994-11-24 | Wilhelm Endlich | Metallisierte Kunststoff-Faserabschnitte als Füllstoff in Kleb-, Dicht-, Beschichtungs- und Schmierstoffen |
GB9318872D0 (en) * | 1993-09-11 | 1993-10-27 | Unisersity Fo Leeds The | Polymer resin |
KR100389743B1 (ko) * | 1994-01-27 | 2003-10-04 | 록타이트(아일랜드) 리미티드 | 두세트의전도체사이에이방성전도성경로및결합을제공하기위한조성물및방법 |
US5891366A (en) * | 1994-05-10 | 1999-04-06 | Robert Bosch Gmbh | Anisotropically conducting adhesive, and process for producing an anisotropically conducting adhesive |
US5494981A (en) * | 1995-03-03 | 1996-02-27 | Minnesota Mining And Manufacturing Company | Epoxy-cyanate ester compositions that form interpenetrating networks via a Bronsted acid |
US5912377A (en) * | 1995-06-05 | 1999-06-15 | Minnesota Mining And Manufacturing Company | Aromatic cyanate ester silane coupling agents |
US20010028953A1 (en) * | 1998-11-16 | 2001-10-11 | 3M Innovative Properties Company | Adhesive compositions and methods of use |
AU6487996A (en) | 1995-07-10 | 1997-02-10 | Minnesota Mining And Manufacturing Company | Screen printable adhesive compositions |
US5851644A (en) * | 1995-08-01 | 1998-12-22 | Loctite (Ireland) Limited | Films and coatings having anisotropic conductive pathways therein |
US5855821A (en) * | 1995-12-22 | 1999-01-05 | Johnson Matthey, Inc. | Materials for semiconductor device assemblies |
US6008072A (en) * | 1995-12-27 | 1999-12-28 | Industrial Technology Research Institute | Tape automated bonding method |
DE69702498T2 (de) * | 1996-02-15 | 2000-11-30 | Ciba Sc Holding Ag | Vergrösserung des molekulargewichts von polykondensaten |
US6402876B1 (en) | 1997-08-01 | 2002-06-11 | Loctite (R&D) Ireland | Method of forming a monolayer of particles, and products formed thereby |
WO1998006007A1 (en) | 1996-08-01 | 1998-02-12 | Loctite (Ireland) Limited | A method of forming a monolayer of particles, and products formed thereby |
US6977025B2 (en) | 1996-08-01 | 2005-12-20 | Loctite (R&D) Limited | Method of forming a monolayer of particles having at least two different sizes, and products formed thereby |
US5912316A (en) * | 1996-11-08 | 1999-06-15 | Johnson Matthey, Inc. | Flexible interpenetrating networks formed by epoxy-cyanate ester compositions via a polyamide |
US5883193A (en) * | 1997-07-01 | 1999-03-16 | Minnesota Mining And Manufacturing Company | Adhesive compositions with durability under conditions of high humidity |
DE69833865T2 (de) | 1997-07-24 | 2006-10-05 | Henkel Corp., Rocky Hill | Hitzehärtende harzzusammensetzungen verwendbar als unterfüllungs dichtungsmassen |
US20010020071A1 (en) | 1997-10-10 | 2001-09-06 | Capote Miguel Albert | High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
JPH11195860A (ja) * | 1997-12-27 | 1999-07-21 | Canon Inc | 接着部材、該接着部材を備えたマルチチップモジュール、及び該接着部材による接着方法 |
JPH11307604A (ja) | 1998-04-17 | 1999-11-05 | Toshiba Corp | プロセスモニタ方法及びプロセス装置 |
US6632893B2 (en) | 1999-05-28 | 2003-10-14 | Henkel Loctite Corporation | Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners |
US6492738B2 (en) | 1999-09-02 | 2002-12-10 | Micron Technology, Inc. | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer |
KR100925361B1 (ko) * | 1999-10-22 | 2009-11-09 | 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 | 저온 경화형 이방성 도전 접속재료 |
JP4739495B2 (ja) * | 2000-10-10 | 2011-08-03 | ナミックス株式会社 | 金属ペースト |
US6841615B2 (en) * | 2000-10-18 | 2005-01-11 | M Cubed Technologies, Inc. | Composite Adhesive |
CA2425983A1 (en) * | 2000-10-23 | 2003-04-15 | Sekisui Chemical Co., Ltd. | Coated particle |
US6703566B1 (en) | 2000-10-25 | 2004-03-09 | Sae Magnetics (H.K.), Ltd. | Bonding structure for a hard disk drive suspension using anisotropic conductive film |
KR100398314B1 (ko) * | 2001-07-19 | 2003-09-19 | 한국과학기술원 | 고접착력 3층 구조 aca 필름 |
US6709738B2 (en) | 2001-10-15 | 2004-03-23 | 3M Innovative Properties Company | Coated substrate with energy curable cyanate resin |
US20040126538A1 (en) * | 2002-01-18 | 2004-07-01 | Corcoran Craig S. | Sheet having microsized architecture |
US20030155656A1 (en) * | 2002-01-18 | 2003-08-21 | Chiu Cindy Chia-Wen | Anisotropically conductive film |
EP1467945A2 (en) * | 2002-01-18 | 2004-10-20 | Avery Dennison Corporation | Covered microchamber structures |
US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
KR100589799B1 (ko) * | 2003-05-06 | 2006-06-14 | 한화석유화학 주식회사 | 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품 |
KR100732017B1 (ko) | 2003-06-25 | 2007-06-25 | 히다치 가세고교 가부시끼가이샤 | 회로접속재료, 이것을 이용한 필름상 회로접속재료,회로부재의 접속구조 및 그 제조방법 |
DE102004031188A1 (de) * | 2004-06-28 | 2006-01-19 | Tesa Ag | Hitzeaktivierbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen |
JP2006024751A (ja) * | 2004-07-08 | 2006-01-26 | Three M Innovative Properties Co | 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品 |
JP4381272B2 (ja) * | 2004-10-01 | 2009-12-09 | ソニーケミカル&インフォメーションデバイス株式会社 | 異方性導電接着剤及びそれを用いた異方性導電接着剤シート |
US7763188B2 (en) * | 2005-03-04 | 2010-07-27 | International Business Machines Corporation | Electrically stable copper filled electrically conductive adhesive |
CN101194540B (zh) * | 2005-04-11 | 2010-06-16 | 3M创新有限公司 | 导电产品的连接方法和具有由该连接方法连接的部分的电气或电子元件 |
US8802214B2 (en) * | 2005-06-13 | 2014-08-12 | Trillion Science, Inc. | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
US7727423B2 (en) * | 2006-12-29 | 2010-06-01 | Cheil Industries, Inc. | Anisotropic conductive film composition and film including the same |
KR100920612B1 (ko) * | 2007-11-08 | 2009-10-08 | 제일모직주식회사 | 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성필름 |
KR101131163B1 (ko) * | 2008-12-29 | 2012-03-28 | 제일모직주식회사 | 신뢰성이 향상된 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성 필름 |
KR101694138B1 (ko) * | 2009-01-19 | 2017-01-09 | 아지노모토 가부시키가이샤 | 수지 조성물 |
CA2766859A1 (en) | 2009-07-08 | 2011-01-13 | Henkel Ag & Co. Kgaa | Electrically conductive adhesives |
KR101138799B1 (ko) * | 2009-08-20 | 2012-04-24 | 제일모직주식회사 | 이방 도전성 필름용 조성물 |
JP2012195414A (ja) * | 2011-03-16 | 2012-10-11 | Sumitomo Bakelite Co Ltd | ダイシングテープ一体型接着シート、多層回路基板、電子部品及び半導体装置 |
US9475963B2 (en) | 2011-09-15 | 2016-10-25 | Trillion Science, Inc. | Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes |
US9102851B2 (en) | 2011-09-15 | 2015-08-11 | Trillion Science, Inc. | Microcavity carrier belt and method of manufacture |
KR101488916B1 (ko) * | 2011-12-23 | 2015-02-02 | 제일모직 주식회사 | 이방성 도전 필름 및 반도체 장치 |
US9777197B2 (en) | 2013-10-23 | 2017-10-03 | Sunray Scientific, Llc | UV-curable anisotropic conductive adhesive |
US9365749B2 (en) | 2013-05-31 | 2016-06-14 | Sunray Scientific, Llc | Anisotropic conductive adhesive with reduced migration |
JP6179720B2 (ja) * | 2013-11-01 | 2017-08-16 | 株式会社スリーボンド | シアネートエステル樹脂組成物 |
JP6835477B2 (ja) * | 2015-04-30 | 2021-02-24 | 日東電工株式会社 | 透明導電性フィルム用キャリアフィルム及び積層体 |
RU2601480C1 (ru) * | 2015-10-28 | 2016-11-10 | Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") | Высокотемпературный пленочный клей |
EP3270386A1 (en) * | 2016-07-11 | 2018-01-17 | Heraeus Deutschland GmbH & Co. KG | Electrically conductive composition for use as an electrically conductive adhesive for mechanically and electrically connecting electrical conductors to electrical contacts of solar cells |
DE102018101394A1 (de) | 2018-01-23 | 2019-07-25 | Prof. Dr. Fischer AG | Magnetfeldapplikator mit einem rampenförmigen Signalverlauf der verwendeten Spulenströme |
CN108314991A (zh) * | 2018-02-12 | 2018-07-24 | 成都理工大学 | 一种耐180℃高温胶粘剂及其制备方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1720663C3 (de) * | 1967-06-01 | 1975-09-18 | Bayer Ag, 5090 Leverkusen | Verfahren zur Herstellung von Kunststoffen |
JPS604552A (ja) * | 1983-06-23 | 1985-01-11 | Mitsubishi Gas Chem Co Inc | 導電性組成物 |
US4780507A (en) * | 1985-04-09 | 1988-10-25 | Mitsubishi Gas Chemical Co. Inc. | Curable thermosetting cyanate ester composition |
DE3613006A1 (de) * | 1985-04-17 | 1986-10-23 | Mitsubishi Gas Chemical Co., Inc., Tokio/Tokyo | Starre harzform |
JPS62181379A (ja) * | 1986-02-05 | 1987-08-08 | Sekisui Chem Co Ltd | 異方導電性接着シ−ト |
US4740657A (en) * | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
JPS6386781A (ja) * | 1986-09-30 | 1988-04-18 | Sekisui Chem Co Ltd | 異方導電性接着シ−ト |
EP0266986A3 (en) * | 1986-11-06 | 1989-09-06 | Amoco Corporation | Resin compositions comprising aromatic cyanate esters, polyepoxide compounds and thermplastic polymers and prepreg made therefrom |
US5143785A (en) * | 1990-08-20 | 1992-09-01 | Minnesota Mining And Manufacturing Company | Cyanate ester adhesives for electronic applications |
-
1991
- 1991-10-09 JP JP26231591A patent/JP3231814B2/ja not_active Expired - Fee Related
-
1992
- 1992-05-27 EP EP92912744A patent/EP0594644B1/en not_active Expired - Lifetime
- 1992-05-27 DE DE69218207T patent/DE69218207T2/de not_active Expired - Fee Related
- 1992-05-27 SG SG1996009227A patent/SG46717A1/en unknown
- 1992-05-27 WO PCT/US1992/004411 patent/WO1993001248A1/en active IP Right Grant
- 1992-05-27 CA CA002113090A patent/CA2113090A1/en not_active Abandoned
- 1992-11-03 US US07/970,806 patent/US5330684A/en not_active Expired - Lifetime
-
1998
- 1998-06-22 HK HK98105981A patent/HK1006849A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE69218207T2 (de) | 1997-10-16 |
DE69218207D1 (de) | 1997-04-17 |
HK1006849A1 (en) | 1999-03-19 |
CA2113090A1 (en) | 1993-01-21 |
US5330684A (en) | 1994-07-19 |
WO1993001248A1 (en) | 1993-01-21 |
JP3231814B2 (ja) | 2001-11-26 |
EP0594644A1 (en) | 1994-05-04 |
JPH0528828A (ja) | 1993-02-05 |
EP0594644B1 (en) | 1997-03-12 |
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