DE69218207D1 - Anisotropisch leitende klebefolie - Google Patents

Anisotropisch leitende klebefolie

Info

Publication number
DE69218207D1
DE69218207D1 DE69218207T DE69218207T DE69218207D1 DE 69218207 D1 DE69218207 D1 DE 69218207D1 DE 69218207 T DE69218207 T DE 69218207T DE 69218207 T DE69218207 T DE 69218207T DE 69218207 D1 DE69218207 D1 DE 69218207D1
Authority
DE
Germany
Prior art keywords
adhesive film
conductive adhesive
anisotropically conductive
anisotropically
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69218207T
Other languages
English (en)
Other versions
DE69218207T2 (de
Inventor
Kenji Emori
Yoshihiko Tasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of DE69218207D1 publication Critical patent/DE69218207D1/de
Application granted granted Critical
Publication of DE69218207T2 publication Critical patent/DE69218207T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE69218207T 1991-07-12 1992-05-27 Anisotropisch leitende klebefolie Expired - Fee Related DE69218207T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US72908291A 1991-07-12 1991-07-12
PCT/US1992/004411 WO1993001248A1 (en) 1991-07-12 1992-05-27 Anisotropic conductive adhesive film

Publications (2)

Publication Number Publication Date
DE69218207D1 true DE69218207D1 (de) 1997-04-17
DE69218207T2 DE69218207T2 (de) 1997-10-16

Family

ID=24929511

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69218207T Expired - Fee Related DE69218207T2 (de) 1991-07-12 1992-05-27 Anisotropisch leitende klebefolie

Country Status (8)

Country Link
US (1) US5330684A (de)
EP (1) EP0594644B1 (de)
JP (1) JP3231814B2 (de)
CA (1) CA2113090A1 (de)
DE (1) DE69218207T2 (de)
HK (1) HK1006849A1 (de)
SG (1) SG46717A1 (de)
WO (1) WO1993001248A1 (de)

Families Citing this family (62)

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US5250600A (en) * 1992-05-28 1993-10-05 Johnson Matthey Inc. Low temperature flexible die attach adhesive and articles using same
US5524422A (en) * 1992-02-28 1996-06-11 Johnson Matthey Inc. Materials with low moisture outgassing properties and method of reducing moisture content of hermetic packages containing semiconductor devices
DE4316607A1 (de) * 1993-05-18 1994-11-24 Wilhelm Endlich Metallisierte Kunststoff-Faserabschnitte als Füllstoff in Kleb-, Dicht-, Beschichtungs- und Schmierstoffen
GB9318872D0 (en) * 1993-09-11 1993-10-27 Unisersity Fo Leeds The Polymer resin
US5769996A (en) * 1994-01-27 1998-06-23 Loctite (Ireland) Limited Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors
JPH10502677A (ja) * 1994-06-29 1998-03-10 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 異方性導電性の接着剤及び異方性導電性の接着剤の製造方法
US5494981A (en) * 1995-03-03 1996-02-27 Minnesota Mining And Manufacturing Company Epoxy-cyanate ester compositions that form interpenetrating networks via a Bronsted acid
US5912377A (en) 1995-06-05 1999-06-15 Minnesota Mining And Manufacturing Company Aromatic cyanate ester silane coupling agents
US20010028953A1 (en) * 1998-11-16 2001-10-11 3M Innovative Properties Company Adhesive compositions and methods of use
WO1997003143A1 (en) 1995-07-10 1997-01-30 Minnesota Mining And Manufacturing Company Screen printable adhesive compositions
US5851644A (en) * 1995-08-01 1998-12-22 Loctite (Ireland) Limited Films and coatings having anisotropic conductive pathways therein
US5855821A (en) * 1995-12-22 1999-01-05 Johnson Matthey, Inc. Materials for semiconductor device assemblies
US6008072A (en) * 1995-12-27 1999-12-28 Industrial Technology Research Institute Tape automated bonding method
DE69702498T2 (de) * 1996-02-15 2000-11-30 Ciba Sc Holding Ag Vergrösserung des molekulargewichts von polykondensaten
US6977025B2 (en) 1996-08-01 2005-12-20 Loctite (R&D) Limited Method of forming a monolayer of particles having at least two different sizes, and products formed thereby
KR100583053B1 (ko) 1996-08-01 2006-09-22 록타이트(아일랜드) 리미티드 입자의단층형성방법및이것으로형성된제품
US6402876B1 (en) 1997-08-01 2002-06-11 Loctite (R&D) Ireland Method of forming a monolayer of particles, and products formed thereby
US5912316A (en) * 1996-11-08 1999-06-15 Johnson Matthey, Inc. Flexible interpenetrating networks formed by epoxy-cyanate ester compositions via a polyamide
US5883193A (en) * 1997-07-01 1999-03-16 Minnesota Mining And Manufacturing Company Adhesive compositions with durability under conditions of high humidity
WO1999005196A1 (en) * 1997-07-24 1999-02-04 Loctite Corporation Thermosetting resin compositions useful as underfill sealants
US20010020071A1 (en) 1997-10-10 2001-09-06 Capote Miguel Albert High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants
JPH11195860A (ja) * 1997-12-27 1999-07-21 Canon Inc 接着部材、該接着部材を備えたマルチチップモジュール、及び該接着部材による接着方法
JPH11307604A (ja) 1998-04-17 1999-11-05 Toshiba Corp プロセスモニタ方法及びプロセス装置
US6632893B2 (en) 1999-05-28 2003-10-14 Henkel Loctite Corporation Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
US6492738B2 (en) 1999-09-02 2002-12-10 Micron Technology, Inc. Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
KR100925361B1 (ko) * 1999-10-22 2009-11-09 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 저온 경화형 이방성 도전 접속재료
JP4739495B2 (ja) * 2000-10-10 2011-08-03 ナミックス株式会社 金属ペースト
AU2002213323A1 (en) * 2000-10-18 2002-05-15 M Cubed Technologies, Inc. Composite adhesive
CN1244112C (zh) * 2000-10-23 2006-03-01 积水化学工业株式会社 涂布颗粒
US6703566B1 (en) 2000-10-25 2004-03-09 Sae Magnetics (H.K.), Ltd. Bonding structure for a hard disk drive suspension using anisotropic conductive film
KR100398314B1 (ko) * 2001-07-19 2003-09-19 한국과학기술원 고접착력 3층 구조 ａｃａ 필름
US6709738B2 (en) 2001-10-15 2004-03-23 3M Innovative Properties Company Coated substrate with energy curable cyanate resin
US20030155656A1 (en) * 2002-01-18 2003-08-21 Chiu Cindy Chia-Wen Anisotropically conductive film
WO2003061949A1 (en) * 2002-01-18 2003-07-31 Avery Dennison Corporation Sheet having microsized architecture
WO2003062133A2 (en) * 2002-01-18 2003-07-31 Avery Dennison Corporation Covered microchamber structures
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
KR100589799B1 (ko) * 2003-05-06 2006-06-14 한화석유화학 주식회사 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품
EP1628363B1 (de) * 2003-06-25 2009-12-16 Hitachi Chemical Company, Ltd. Schaltglied-verbindungsstruktur und herstellungsverfahren dafür
DE102004031188A1 (de) * 2004-06-28 2006-01-19 Tesa Ag Hitzeaktivierbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen
JP2006024751A (ja) * 2004-07-08 2006-01-26 Three M Innovative Properties Co 平面多導体の接続方法及び該接続方法で接続される部分を含む電気電子部品
JP4381272B2 (ja) * 2004-10-01 2009-12-09 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接着剤及びそれを用いた異方性導電接着剤シート
US7763188B2 (en) * 2005-03-04 2010-07-27 International Business Machines Corporation Electrically stable copper filled electrically conductive adhesive
US7888604B2 (en) * 2005-04-11 2011-02-15 3M Innovative Properties Company Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method
US8802214B2 (en) * 2005-06-13 2014-08-12 Trillion Science, Inc. Non-random array anisotropic conductive film (ACF) and manufacturing processes
US7727423B2 (en) * 2006-12-29 2010-06-01 Cheil Industries, Inc. Anisotropic conductive film composition and film including the same
KR100920612B1 (ko) * 2007-11-08 2009-10-08 제일모직주식회사 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성필름
KR101131163B1 (ko) * 2008-12-29 2012-03-28 제일모직주식회사 신뢰성이 향상된 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성 필름
KR101694138B1 (ko) * 2009-01-19 2017-01-09 아지노모토 가부시키가이샤 수지 조성물
WO2011003948A2 (en) * 2009-07-08 2011-01-13 Henkel Ag & Co. Kgaa Electrically conductive adhesives
KR101138799B1 (ko) * 2009-08-20 2012-04-24 제일모직주식회사 이방 도전성 필름용 조성물
JP2012195414A (ja) * 2011-03-16 2012-10-11 Sumitomo Bakelite Co Ltd ダイシングテープ一体型接着シート、多層回路基板、電子部品及び半導体装置
US9475963B2 (en) 2011-09-15 2016-10-25 Trillion Science, Inc. Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes
US9102851B2 (en) 2011-09-15 2015-08-11 Trillion Science, Inc. Microcavity carrier belt and method of manufacture
KR101488916B1 (ko) * 2011-12-23 2015-02-02 제일모직 주식회사 이방성 도전 필름 및 반도체 장치
US9777197B2 (en) 2013-10-23 2017-10-03 Sunray Scientific, Llc UV-curable anisotropic conductive adhesive
US9365749B2 (en) 2013-05-31 2016-06-14 Sunray Scientific, Llc Anisotropic conductive adhesive with reduced migration
JP6179720B2 (ja) * 2013-11-01 2017-08-16 株式会社スリーボンド シアネートエステル樹脂組成物
JP6835477B2 (ja) * 2015-04-30 2021-02-24 日東電工株式会社 透明導電性フィルム用キャリアフィルム及び積層体
RU2601480C1 (ru) * 2015-10-28 2016-11-10 Федеральное государственное унитарное предприятие "Всероссийский научно-исследовательский институт авиационных материалов" (ФГУП "ВИАМ") Высокотемпературный пленочный клей
EP3270386A1 (de) * 2016-07-11 2018-01-17 Heraeus Deutschland GmbH & Co. KG Elektrisch leitende zusammensetzung zur verwendung als elektrisch leitender klebstoff zur mechanischen und elektrischen verbindung elektrischer leiter mit elektrischen kontakten von solarzellen
DE102018101394A1 (de) 2018-01-23 2019-07-25 Prof. Dr. Fischer AG Magnetfeldapplikator mit einem rampenförmigen Signalverlauf der verwendeten Spulenströme
CN108314991A (zh) * 2018-02-12 2018-07-24 成都理工大学 一种耐180℃高温胶粘剂及其制备方法

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JPS604552A (ja) * 1983-06-23 1985-01-11 Mitsubishi Gas Chem Co Inc 導電性組成物
US4780507A (en) * 1985-04-09 1988-10-25 Mitsubishi Gas Chemical Co. Inc. Curable thermosetting cyanate ester composition
DE3613006A1 (de) * 1985-04-17 1986-10-23 Mitsubishi Gas Chemical Co., Inc., Tokio/Tokyo Starre harzform
JPS62181379A (ja) * 1986-02-05 1987-08-08 Sekisui Chem Co Ltd 異方導電性接着シ−ト
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
JPS6386781A (ja) * 1986-09-30 1988-04-18 Sekisui Chem Co Ltd 異方導電性接着シ−ト
EP0266986A3 (de) * 1986-11-06 1989-09-06 Amoco Corporation Aromatische Cyanatester, Polyepoxidverbindungen und thermoplastische Polymere enthaltende Harzzusammensetzungen und damit hergestellte Prepregs
US5143785A (en) * 1990-08-20 1992-09-01 Minnesota Mining And Manufacturing Company Cyanate ester adhesives for electronic applications

Also Published As

Publication number Publication date
CA2113090A1 (en) 1993-01-21
HK1006849A1 (en) 1999-03-19
EP0594644B1 (de) 1997-03-12
US5330684A (en) 1994-07-19
DE69218207T2 (de) 1997-10-16
WO1993001248A1 (en) 1993-01-21
EP0594644A1 (de) 1994-05-04
JP3231814B2 (ja) 2001-11-26
SG46717A1 (en) 1998-02-20
JPH0528828A (ja) 1993-02-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee