SG43819A1 - High-purity spherical silica and process for producing same - Google Patents
High-purity spherical silica and process for producing sameInfo
- Publication number
- SG43819A1 SG43819A1 SG1996001390A SG1996001390A SG43819A1 SG 43819 A1 SG43819 A1 SG 43819A1 SG 1996001390 A SG1996001390 A SG 1996001390A SG 1996001390 A SG1996001390 A SG 1996001390A SG 43819 A1 SG43819 A1 SG 43819A1
- Authority
- SG
- Singapore
- Prior art keywords
- spherical silica
- producing same
- purity spherical
- purity
- producing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/157—After-treatment of gels
- C01B33/159—Coating or hydrophobisation
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/157—After-treatment of gels
- C01B33/158—Purification; Drying; Dehydrating
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/16—Preparation of silica xerogels
- C01B33/166—Preparation of silica xerogels by acidification of silicate in the presence of an inert organic phase
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/30—Particle morphology extending in three dimensions
- C01P2004/32—Spheres
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/51—Particles with a specific particle size distribution
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/10—Solid density
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Silicon Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18207393 | 1993-06-29 | ||
JP14412494A JP3400548B2 (ja) | 1993-06-29 | 1994-06-03 | 高純度球状シリカの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG43819A1 true SG43819A1 (en) | 1997-11-14 |
Family
ID=26475646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996001390A SG43819A1 (en) | 1993-06-29 | 1994-06-29 | High-purity spherical silica and process for producing same |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3400548B2 (ko) |
KR (1) | KR100279083B1 (ko) |
GB (1) | GB2279944B (ko) |
SG (1) | SG43819A1 (ko) |
TW (1) | TW271432B (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4199885B2 (ja) * | 1999-10-14 | 2008-12-24 | 東ソー・シリカ株式会社 | インクジェット記録シート用非晶質シリカおよびその製造方法 |
JP4822576B2 (ja) * | 2000-05-30 | 2011-11-24 | 京セラ株式会社 | 無機質中空粉体とその製造方法 |
JP4875281B2 (ja) * | 2000-09-27 | 2012-02-15 | 三菱レイヨン株式会社 | 非孔性球状シリカ及びその製造方法 |
JP2003137970A (ja) * | 2001-08-24 | 2003-05-14 | Sanyo Chem Ind Ltd | 電気電子素子用エポキシ樹脂組成物 |
EP1629883B1 (en) * | 2003-05-13 | 2010-07-28 | Asahi Glass Company Ltd. | Process for producing inorganic sphere |
US6955949B2 (en) | 2003-10-16 | 2005-10-18 | Kulicke & Soffa Investments, Inc. | System and method for reducing or eliminating semiconductor device wire sweep |
US6847122B1 (en) * | 2003-10-16 | 2005-01-25 | Kulicke & Soffa Investments, Inc. | System and method for preventing and alleviating short circuiting in a semiconductor device |
US7179688B2 (en) | 2003-10-16 | 2007-02-20 | Kulicke And Soffa Industries, Inc. | Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method |
KR100620215B1 (ko) | 2004-07-29 | 2006-09-08 | 한국원자력연구소 | 스와이프 시료 분석을 위한 실리카기반 표준물질 |
KR100651243B1 (ko) | 2005-03-04 | 2006-11-30 | (주) 에스오씨 | 구형 실리카의 제조 방법 |
JP4707186B2 (ja) * | 2005-10-03 | 2011-06-22 | 株式会社四国総合研究所 | シリカ粉体の製法およびそれによって得られたシリカ粉体 |
JP5042252B2 (ja) * | 2009-02-20 | 2012-10-03 | 学校法人 芝浦工業大学 | ガラス材料の回収方法 |
CN102355946B (zh) * | 2009-03-16 | 2014-06-11 | 巴斯夫欧洲公司 | 基于硅胶的催化剂载体 |
JP6059519B2 (ja) * | 2012-11-28 | 2017-01-11 | 旭硝子株式会社 | シリカ含有粒子の製造方法 |
JP2014105126A (ja) * | 2012-11-28 | 2014-06-09 | Asahi Glass Co Ltd | シリカ含有粒子の製造方法 |
JP6203672B2 (ja) * | 2013-03-29 | 2017-09-27 | 株式会社アドマテックス | 3次元実装型半導体装置、樹脂組成物及びその製造方法 |
JP6196462B2 (ja) * | 2013-04-11 | 2017-09-13 | 株式会社トクヤマ | 多孔質球状金属酸化物 |
JP5865466B2 (ja) * | 2014-11-17 | 2016-02-17 | 株式会社アドマテックス | シリカ粒子材料及びフィラー含有樹脂組成物 |
WO2022210119A1 (ja) * | 2021-03-31 | 2022-10-06 | デンカ株式会社 | 二酸化ケイ素粉末 |
EP4299510A1 (en) * | 2021-03-31 | 2024-01-03 | Denka Company Limited | Metal oxide powder, and method for producing same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2921839A (en) * | 1955-12-23 | 1960-01-19 | Columbia Southern Chem Corp | Silica precipitation method |
JPH01230422A (ja) * | 1988-03-10 | 1989-09-13 | Nippon Chem Ind Co Ltd | 高純度シリカ及びその製造方法 |
CA2087911C (en) * | 1992-01-24 | 1999-06-29 | Kiyoshi Abe | Spherical granules of porous silica or silicate, process for the production thereof, and applications thereof |
JP3410522B2 (ja) * | 1993-09-09 | 2003-05-26 | 水澤化学工業株式会社 | 粒状非晶質シリカの製造方法 |
-
1994
- 1994-06-03 JP JP14412494A patent/JP3400548B2/ja not_active Expired - Lifetime
- 1994-06-09 TW TW083105263A patent/TW271432B/zh not_active IP Right Cessation
- 1994-06-28 KR KR1019940015068A patent/KR100279083B1/ko not_active IP Right Cessation
- 1994-06-29 GB GB9413100A patent/GB2279944B/en not_active Expired - Lifetime
- 1994-06-29 SG SG1996001390A patent/SG43819A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
GB2279944B (en) | 1996-10-02 |
GB2279944A (en) | 1995-01-18 |
KR950000563A (ko) | 1995-01-03 |
KR100279083B1 (ko) | 2001-02-01 |
JP3400548B2 (ja) | 2003-04-28 |
GB9413100D0 (en) | 1994-08-17 |
TW271432B (ko) | 1996-03-01 |
JPH0769617A (ja) | 1995-03-14 |
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