SG43819A1 - High-purity spherical silica and process for producing same - Google Patents

High-purity spherical silica and process for producing same

Info

Publication number
SG43819A1
SG43819A1 SG1996001390A SG1996001390A SG43819A1 SG 43819 A1 SG43819 A1 SG 43819A1 SG 1996001390 A SG1996001390 A SG 1996001390A SG 1996001390 A SG1996001390 A SG 1996001390A SG 43819 A1 SG43819 A1 SG 43819A1
Authority
SG
Singapore
Prior art keywords
spherical silica
producing same
purity spherical
purity
producing
Prior art date
Application number
SG1996001390A
Other languages
English (en)
Inventor
Yasuhiro Unehara
Kouichi Orii
Original Assignee
Nitto Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Chemical Industry Co Ltd filed Critical Nitto Chemical Industry Co Ltd
Publication of SG43819A1 publication Critical patent/SG43819A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/157—After-treatment of gels
    • C01B33/159—Coating or hydrophobisation
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/157—After-treatment of gels
    • C01B33/158—Purification; Drying; Dehydrating
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/16—Preparation of silica xerogels
    • C01B33/166—Preparation of silica xerogels by acidification of silicate in the presence of an inert organic phase
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/10—Solid density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Silicon Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
SG1996001390A 1993-06-29 1994-06-29 High-purity spherical silica and process for producing same SG43819A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18207393 1993-06-29
JP14412494A JP3400548B2 (ja) 1993-06-29 1994-06-03 高純度球状シリカの製造方法

Publications (1)

Publication Number Publication Date
SG43819A1 true SG43819A1 (en) 1997-11-14

Family

ID=26475646

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996001390A SG43819A1 (en) 1993-06-29 1994-06-29 High-purity spherical silica and process for producing same

Country Status (5)

Country Link
JP (1) JP3400548B2 (ko)
KR (1) KR100279083B1 (ko)
GB (1) GB2279944B (ko)
SG (1) SG43819A1 (ko)
TW (1) TW271432B (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4199885B2 (ja) * 1999-10-14 2008-12-24 東ソー・シリカ株式会社 インクジェット記録シート用非晶質シリカおよびその製造方法
JP4822576B2 (ja) * 2000-05-30 2011-11-24 京セラ株式会社 無機質中空粉体とその製造方法
JP4875281B2 (ja) * 2000-09-27 2012-02-15 三菱レイヨン株式会社 非孔性球状シリカ及びその製造方法
JP2003137970A (ja) * 2001-08-24 2003-05-14 Sanyo Chem Ind Ltd 電気電子素子用エポキシ樹脂組成物
EP1629883B1 (en) * 2003-05-13 2010-07-28 Asahi Glass Company Ltd. Process for producing inorganic sphere
US6955949B2 (en) 2003-10-16 2005-10-18 Kulicke & Soffa Investments, Inc. System and method for reducing or eliminating semiconductor device wire sweep
US6847122B1 (en) * 2003-10-16 2005-01-25 Kulicke & Soffa Investments, Inc. System and method for preventing and alleviating short circuiting in a semiconductor device
US7179688B2 (en) 2003-10-16 2007-02-20 Kulicke And Soffa Industries, Inc. Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method
KR100620215B1 (ko) 2004-07-29 2006-09-08 한국원자력연구소 스와이프 시료 분석을 위한 실리카기반 표준물질
KR100651243B1 (ko) 2005-03-04 2006-11-30 (주) 에스오씨 구형 실리카의 제조 방법
JP4707186B2 (ja) * 2005-10-03 2011-06-22 株式会社四国総合研究所 シリカ粉体の製法およびそれによって得られたシリカ粉体
JP5042252B2 (ja) * 2009-02-20 2012-10-03 学校法人 芝浦工業大学 ガラス材料の回収方法
CN102355946B (zh) * 2009-03-16 2014-06-11 巴斯夫欧洲公司 基于硅胶的催化剂载体
JP6059519B2 (ja) * 2012-11-28 2017-01-11 旭硝子株式会社 シリカ含有粒子の製造方法
JP2014105126A (ja) * 2012-11-28 2014-06-09 Asahi Glass Co Ltd シリカ含有粒子の製造方法
JP6203672B2 (ja) * 2013-03-29 2017-09-27 株式会社アドマテックス ３次元実装型半導体装置、樹脂組成物及びその製造方法
JP6196462B2 (ja) * 2013-04-11 2017-09-13 株式会社トクヤマ 多孔質球状金属酸化物
JP5865466B2 (ja) * 2014-11-17 2016-02-17 株式会社アドマテックス シリカ粒子材料及びフィラー含有樹脂組成物
WO2022210119A1 (ja) * 2021-03-31 2022-10-06 デンカ株式会社 二酸化ケイ素粉末
EP4299510A1 (en) * 2021-03-31 2024-01-03 Denka Company Limited Metal oxide powder, and method for producing same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2921839A (en) * 1955-12-23 1960-01-19 Columbia Southern Chem Corp Silica precipitation method
JPH01230422A (ja) * 1988-03-10 1989-09-13 Nippon Chem Ind Co Ltd 高純度シリカ及びその製造方法
CA2087911C (en) * 1992-01-24 1999-06-29 Kiyoshi Abe Spherical granules of porous silica or silicate, process for the production thereof, and applications thereof
JP3410522B2 (ja) * 1993-09-09 2003-05-26 水澤化学工業株式会社 粒状非晶質シリカの製造方法

Also Published As

Publication number Publication date
GB2279944B (en) 1996-10-02
GB2279944A (en) 1995-01-18
KR950000563A (ko) 1995-01-03
KR100279083B1 (ko) 2001-02-01
JP3400548B2 (ja) 2003-04-28
GB9413100D0 (en) 1994-08-17
TW271432B (ko) 1996-03-01
JPH0769617A (ja) 1995-03-14

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