SG42818A1 - Cadium-free and lead-free ticket film paste composition - Google Patents

Cadium-free and lead-free ticket film paste composition

Info

Publication number
SG42818A1
SG42818A1 SG1995002218A SG1995002218A SG42818A1 SG 42818 A1 SG42818 A1 SG 42818A1 SG 1995002218 A SG1995002218 A SG 1995002218A SG 1995002218 A SG1995002218 A SG 1995002218A SG 42818 A1 SG42818 A1 SG 42818A1
Authority
SG
Singapore
Prior art keywords
free
cadium
lead
paste composition
film paste
Prior art date
Application number
SG1995002218A
Other languages
English (en)
Inventor
Jacob Hormadaly
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of SG42818A1 publication Critical patent/SG42818A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Thermistors And Varistors (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Conductive Materials (AREA)
SG1995002218A 1994-12-20 1995-12-19 Cadium-free and lead-free ticket film paste composition SG42818A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/359,768 US5491118A (en) 1994-12-20 1994-12-20 Cadmium-free and lead-free thick film paste composition

Publications (1)

Publication Number Publication Date
SG42818A1 true SG42818A1 (en) 1997-10-17

Family

ID=23415193

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1995002218A SG42818A1 (en) 1994-12-20 1995-12-19 Cadium-free and lead-free ticket film paste composition

Country Status (8)

Country Link
US (1) US5491118A (zh)
EP (1) EP0718855B1 (zh)
JP (1) JP3907725B2 (zh)
KR (1) KR0164666B1 (zh)
CN (1) CN1052096C (zh)
DE (1) DE69514633T2 (zh)
SG (1) SG42818A1 (zh)
TW (1) TW305047B (zh)

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US6171987B1 (en) 1997-12-29 2001-01-09 Ben-Gurion University Of The Negev Cadmium-free and lead-free glass compositions, thick film formulations containing them and uses thereof
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JP3579836B2 (ja) * 2002-02-28 2004-10-20 小島化学薬品株式会社 固定抵抗器
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JP3992647B2 (ja) * 2003-05-28 2007-10-17 Ｔｄｋ株式会社 抵抗体ペースト、抵抗体および電子部品
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US7339780B2 (en) * 2004-06-09 2008-03-04 Ferro Corporation Copper termination inks containing lead free and cadmium free glasses for capacitors
US7176152B2 (en) * 2004-06-09 2007-02-13 Ferro Corporation Lead-free and cadmium-free conductive copper thick film pastes
US6982864B1 (en) * 2004-06-09 2006-01-03 Ferro Corporation Copper termination inks containing lead free and cadmium free glasses for capacitors
TW200612443A (en) * 2004-09-01 2006-04-16 Tdk Corp Thick-film resistor paste and thick-film resistor
TW200616920A (en) * 2004-09-01 2006-06-01 Tdk Corp Glass composition for thick-film resistor paste, thick-film resistor paste, thick-film resistor, and electronic device
TW200639880A (en) * 2005-02-21 2006-11-16 Tdk Corp Thick-film resistor and its production process
US7326370B2 (en) * 2005-03-09 2008-02-05 E. I. Du Pont De Nemours And Company Black conductive thick film compositions, black electrodes, and methods of forming thereof
US7569165B2 (en) * 2005-03-09 2009-08-04 E. I. Du Pont De Nemours And Company Black conductive compositions, black electrodes, and methods of forming thereof
US7384577B2 (en) * 2005-03-09 2008-06-10 E.I. Du Pont De Nemours And Company Black conductive thick film compositions, black electrodes, and methods of forming thereof
US7326367B2 (en) * 2005-04-25 2008-02-05 E.I. Du Pont De Nemours And Company Thick film conductor paste compositions for LTCC tape in microwave applications
US8093491B2 (en) 2005-06-03 2012-01-10 Ferro Corporation Lead free solar cell contacts
WO2007009232A1 (en) * 2005-07-18 2007-01-25 Datec Coating Corporation Low temperature fired, lead-free thick film heating element
JP2007103594A (ja) * 2005-10-03 2007-04-19 Shoei Chem Ind Co 抵抗体組成物並びに厚膜抵抗体
JP4513769B2 (ja) * 2006-02-28 2010-07-28 パナソニック株式会社 プラズマディスプレイパネル
JP4904888B2 (ja) * 2006-03-31 2012-03-28 株式会社村田製作所 導電性ペースト及びＭｎ系半導体サーミスタ
US7740725B2 (en) 2006-04-05 2010-06-22 E.I. Du Pont De Nemours And Company Thick film conductor paste composition for LTCC tape in microwave applications
JP2009020061A (ja) * 2007-07-13 2009-01-29 Denso Corp 力学量センサ素子
US8309844B2 (en) * 2007-08-29 2012-11-13 Ferro Corporation Thick film pastes for fire through applications in solar cells
US7736546B2 (en) * 2008-01-30 2010-06-15 Basf Se Glass frits
US8308993B2 (en) * 2008-01-30 2012-11-13 Basf Se Conductive inks
US8383011B2 (en) * 2008-01-30 2013-02-26 Basf Se Conductive inks with metallo-organic modifiers
US7608206B1 (en) * 2008-04-18 2009-10-27 E.I. Dupont De Nemours & Company Non-lead resistor composition
EP2274250A1 (en) * 2008-04-18 2011-01-19 E. I. du Pont de Nemours and Company Resistor compositions using a cu-containing glass frit
US8257619B2 (en) * 2008-04-18 2012-09-04 E I Du Pont De Nemours And Company Lead-free resistive composition
JP5281375B2 (ja) * 2008-11-28 2013-09-04 三ツ星ベルト株式会社 抵抗体ペースト、抵抗体膜及び抵抗器
CN102041469B (zh) * 2011-01-22 2012-02-22 太原理工大学 一种铸铁表面喷敷铜粉的方法
CN102450944A (zh) * 2011-05-30 2012-05-16 浙江苏泊尔家电制造有限公司 一种电热炊具
US20130004659A1 (en) * 2011-06-30 2013-01-03 E I Du Pont De Nemours And Company Thick film paste and use thereof
US9783874B2 (en) 2011-06-30 2017-10-10 E I Du Pont De Nemours And Company Thick film paste and use thereof
US8808581B2 (en) * 2011-08-15 2014-08-19 E I Du Pont De Nemours And Company Conductive compositions containing Li2RuO3 and ion-exchanged Li2RuO3 and their use in the manufacture of semiconductor devices
CN102682944A (zh) * 2012-06-04 2012-09-19 句容市博远电子有限公司 Ntc热敏电阻材料
US8815125B2 (en) 2012-06-20 2014-08-26 E. I. Du Pont De Nemours And Company Method of manufacturing a resistor paste
CN103021603A (zh) * 2012-12-27 2013-04-03 青岛艾德森能源科技有限公司 一种环保电阻浆料
CN103489550B (zh) * 2013-09-13 2015-03-04 李琴 无机电阻厚膜、其制备方法和应用
EP3193340A4 (en) 2014-09-12 2018-04-18 Shoei Chemical Inc. Thin film resistive body and production method for same
US9805839B2 (en) 2014-09-12 2017-10-31 Shoei Chemical Inc. Resistive composition
DE102015110607A1 (de) * 2015-07-01 2017-01-05 Epcos Ag Verfahren zur Herstellung eines elektrischen Bauelements
JP6652003B2 (ja) 2016-07-04 2020-02-19 株式会社デンソー 半導体チップおよび半導体装置
CN106477894B (zh) * 2016-11-01 2019-03-12 福州大学 一种含Fe的低温封接玻璃及其制备和使用方法
CN106495487B (zh) * 2016-11-01 2019-03-12 福州大学 一种含Ce的低温封接玻璃及其制备和使用方法
JP6931455B2 (ja) 2017-02-17 2021-09-08 住友金属鉱山株式会社 抵抗体用組成物及びこれを含んだ抵抗体ペーストとそれを用いた厚膜抵抗体
JP6887615B2 (ja) * 2017-03-28 2021-06-16 住友金属鉱山株式会社 ルテニウム酸ビスマス粒子を含有するガラスとその製造方法、厚膜抵抗体組成物並びに厚膜抵抗体ペースト
CN110634637B (zh) * 2017-10-23 2021-06-22 潮州三环（集团）股份有限公司 一种阻值范围为1mω/□～10mω/□的厚膜电阻浆料及其制备方法
JP7251068B2 (ja) 2018-07-31 2023-04-04 住友金属鉱山株式会社 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、及び厚膜抵抗体
CN112768110B (zh) * 2020-12-23 2022-07-01 广东风华高新科技股份有限公司 一种铜浆及片式多层陶瓷电容器

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Also Published As

Publication number Publication date
CN1130795A (zh) 1996-09-11
US5491118A (en) 1996-02-13
DE69514633D1 (de) 2000-02-24
JPH08253342A (ja) 1996-10-01
TW305047B (zh) 1997-05-11
EP0718855B1 (en) 2000-01-19
CN1052096C (zh) 2000-05-03
KR0164666B1 (ko) 1998-12-15
DE69514633T2 (de) 2000-06-21
JP3907725B2 (ja) 2007-04-18
KR960022305A (ko) 1996-07-18
EP0718855A2 (en) 1996-06-26
EP0718855A3 (en) 1997-07-30

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