SG173447A1 - Semiconductor chip with reinforcement layer - Google Patents

Semiconductor chip with reinforcement layer Download PDF

Info

Publication number
SG173447A1
SG173447A1 SG2011053386A SG2011053386A SG173447A1 SG 173447 A1 SG173447 A1 SG 173447A1 SG 2011053386 A SG2011053386 A SG 2011053386A SG 2011053386 A SG2011053386 A SG 2011053386A SG 173447 A1 SG173447 A1 SG 173447A1
Authority
SG
Singapore
Prior art keywords
semiconductor chip
channel
frame portion
polymer layer
forming
Prior art date
Application number
SG2011053386A
Other languages
English (en)
Inventor
Michael Su
Frank Kuechenmeister
Jaime Bravo
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of SG173447A1 publication Critical patent/SG173447A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
SG2011053386A 2009-02-18 2010-02-17 Semiconductor chip with reinforcement layer SG173447A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/388,092 US7897433B2 (en) 2009-02-18 2009-02-18 Semiconductor chip with reinforcement layer and method of making the same
PCT/US2010/024462 WO2010096473A2 (en) 2009-02-18 2010-02-17 Semiconductor chip with reinforcement layer

Publications (1)

Publication Number Publication Date
SG173447A1 true SG173447A1 (en) 2011-09-29

Family

ID=42224974

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2011053386A SG173447A1 (en) 2009-02-18 2010-02-17 Semiconductor chip with reinforcement layer

Country Status (7)

Country Link
US (1) US7897433B2 (https=)
EP (1) EP2399284B1 (https=)
JP (1) JP5576885B2 (https=)
KR (1) KR101308100B1 (https=)
CN (1) CN102318051B (https=)
SG (1) SG173447A1 (https=)
WO (1) WO2010096473A2 (https=)

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US8476115B2 (en) 2011-05-03 2013-07-02 Stats Chippac, Ltd. Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material
US8624404B1 (en) 2012-06-25 2014-01-07 Advanced Micro Devices, Inc. Integrated circuit package having offset vias
US8937009B2 (en) 2013-04-25 2015-01-20 International Business Machines Corporation Far back end of the line metallization method and structures
TWI467711B (zh) * 2013-09-10 2015-01-01 頎邦科技股份有限公司 半導體結構
US9466547B1 (en) 2015-06-09 2016-10-11 Globalfoundries Inc. Passivation layer topography
US9589920B2 (en) * 2015-07-01 2017-03-07 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Chip package
US9779940B2 (en) * 2015-07-01 2017-10-03 Zhuahai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Chip package
US20200251683A1 (en) * 2019-01-31 2020-08-06 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Organic light emitting diode display panel and preparation method thereof
EP3800660B1 (en) 2019-10-02 2025-02-19 STMicroelectronics S.r.l. Silicon carbide power device with improved robustness and corresponding manufacturing process
US11990408B2 (en) * 2020-03-27 2024-05-21 Intel Corporation WLCSP reliability improvement for package edges including package shielding
KR102798789B1 (ko) 2020-07-09 2025-04-22 삼성전자주식회사 반도체 패키지
CN114141614B (zh) 2020-09-04 2025-11-04 意法半导体股份有限公司 电子设备元件制造方法、相关元件、电子设备和电子装置
JP7758501B2 (ja) 2020-09-04 2025-10-22 エスティーマイクロエレクトロニクス エス．アール．エル． 信頼性を改善した電子装置の要素の製造方法、及び関連要素、電子装置、及び電子機器
JP2026510132A (ja) 2022-10-31 2026-04-01 キョーセラ・エーブイエックス・コンポーネンツ・コーポレーション 多層コンデンサ

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Also Published As

Publication number Publication date
CN102318051A (zh) 2012-01-11
JP5576885B2 (ja) 2014-08-20
WO2010096473A3 (en) 2011-02-03
KR101308100B1 (ko) 2013-09-12
US20100207281A1 (en) 2010-08-19
EP2399284B1 (en) 2015-06-17
US7897433B2 (en) 2011-03-01
EP2399284A2 (en) 2011-12-28
CN102318051B (zh) 2014-02-26
KR20110126707A (ko) 2011-11-23
WO2010096473A2 (en) 2010-08-26
JP2012518282A (ja) 2012-08-09

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