SG164338A1 - A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method - Google Patents

A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method

Info

Publication number
SG164338A1
SG164338A1 SG201000993-4A SG2010009934A SG164338A1 SG 164338 A1 SG164338 A1 SG 164338A1 SG 2010009934 A SG2010009934 A SG 2010009934A SG 164338 A1 SG164338 A1 SG 164338A1
Authority
SG
Singapore
Prior art keywords
substrate
adjusting
speed
projection system
controlling
Prior art date
Application number
SG201000993-4A
Other languages
English (en)
Inventor
Marco Koert Stavenga
Nicolaas Rudolf Kemper
Martinus Hendrikus Antonius Leenders
Paulus Martinus Maria Liebregts
Johannes Catharinus Hubertus Mulkens
Erik Henricus Egidius Catharina Eummelen
Richard Moerman
Michel Riepen
Sergei Shulepov
Gert-Jan Gerardus Johannes Thomas Brands
Koen Steffens
Jan Willem Cromwijk
Ralph Joseph Meijers
Fabrizio Evangelista
David Bessems
Hua Li
Marinus Jochemsen
Pieter Lein Joseph Gunter
Franciscus Wilhelmus Bell
Erik Witberg
Marcus Agnes Johannes Smits
Zhenhua Ma
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG164338A1 publication Critical patent/SG164338A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG201000993-4A 2009-02-19 2010-02-12 A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method SG164338A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15394109P 2009-02-19 2009-02-19
US18749609P 2009-06-16 2009-06-16

Publications (1)

Publication Number Publication Date
SG164338A1 true SG164338A1 (en) 2010-09-29

Family

ID=42263929

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201000993-4A SG164338A1 (en) 2009-02-19 2010-02-12 A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method

Country Status (7)

Country Link
US (1) US8405817B2 (ja)
EP (1) EP2221669A3 (ja)
JP (1) JP5334204B2 (ja)
KR (2) KR101234124B1 (ja)
CN (1) CN101840158B (ja)
SG (1) SG164338A1 (ja)
TW (1) TWI422988B (ja)

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EP2221669A3 (en) 2009-02-19 2011-02-09 ASML Netherlands B.V. A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method
NL2004305A (en) 2009-03-13 2010-09-14 Asml Netherlands Bv Substrate table, immersion lithographic apparatus and device manufacturing method.
NL2006818A (en) 2010-07-02 2012-01-03 Asml Netherlands Bv A method of adjusting speed and/or routing of a table movement plan and a lithographic apparatus.
NL2008183A (en) * 2011-02-25 2012-08-28 Asml Netherlands Bv A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method.
US9568828B2 (en) * 2012-10-12 2017-02-14 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
TW201432080A (zh) * 2013-02-01 2014-08-16 Chiuan Yan Technology Co Ltd 負壓無塵型對位機構
US10261422B2 (en) 2014-08-07 2019-04-16 Asml Netherlands B.V. Lithography apparatus and method of manufacturing a device
US10095130B2 (en) * 2015-04-20 2018-10-09 Asml Netherlands B.V. Lithographic apparatus and method in a lithographic process
US10627721B2 (en) 2015-10-01 2020-04-21 Asml Netherlands B.V. Lithography apparatus, and a method of manufacturing a device
CN109716238B (zh) * 2016-09-20 2020-12-25 Asml荷兰有限公司 光刻设备和制造器件的方法
CN110088686B (zh) 2016-12-14 2021-11-16 Asml荷兰有限公司 光刻设备及器件制造方法
EP4167029A1 (en) * 2021-10-14 2023-04-19 ASML Netherlands B.V. A fluid extraction system, method and lithographic apparatus
CN114879453A (zh) * 2022-05-11 2022-08-09 无锡昌德微电子股份有限公司 一种硅芯片双面光刻精细对准装置

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US4509852A (en) 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
US6947468B2 (en) * 1999-12-30 2005-09-20 Infineon Technologies Ag Apparatus and method for calculating and implementing a Fibonacci mask for a code generator
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JP5089143B2 (ja) 2006-11-20 2012-12-05 キヤノン株式会社 液浸露光装置
US8634053B2 (en) 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2008192854A (ja) * 2007-02-05 2008-08-21 Canon Inc 液浸露光装置
US7755740B2 (en) * 2007-02-07 2010-07-13 Canon Kabushiki Kaisha Exposure apparatus
US9529275B2 (en) 2007-02-21 2016-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography scanner throughput
US7679719B2 (en) 2007-04-05 2010-03-16 Asml Netherlands B.V. Lithographic apparatus having a drive system with coordinate transformation, and device manufacturing method
DE102007025340B4 (de) * 2007-05-31 2019-12-05 Globalfoundries Inc. Immersionslithograpieprozess unter Anwendung einer variablen Abtastgeschwindigkeit und Lithographiesystem
JP2008300771A (ja) 2007-06-04 2008-12-11 Nikon Corp 液浸露光装置、デバイス製造方法、及び露光条件の決定方法
US8953141B2 (en) 2007-12-21 2015-02-10 Asml Netherlands B.V. Immersion lithographic apparatus and device manufacturing method with asymmetric acceleration profile of substrate table to maintain meniscus of immersion liquid
NL1036715A1 (nl) 2008-04-16 2009-10-19 Asml Netherlands Bv Lithographic apparatus.
EP2151717A1 (en) 2008-08-05 2010-02-10 ASML Holding N.V. Full wafer width scanning using step and scan system
EP2221669A3 (en) 2009-02-19 2011-02-09 ASML Netherlands B.V. A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method

Also Published As

Publication number Publication date
CN101840158B (zh) 2013-01-23
EP2221669A2 (en) 2010-08-25
TW201044117A (en) 2010-12-16
TWI422988B (zh) 2014-01-11
JP2010219510A (ja) 2010-09-30
KR20110134351A (ko) 2011-12-14
KR101596403B1 (ko) 2016-02-22
US8405817B2 (en) 2013-03-26
CN101840158A (zh) 2010-09-22
EP2221669A3 (en) 2011-02-09
KR20100094962A (ko) 2010-08-27
KR101234124B1 (ko) 2013-02-19
JP5334204B2 (ja) 2013-11-06
US20100214543A1 (en) 2010-08-26

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