SG164338A1 - A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method - Google Patents

A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method

Info

Publication number
SG164338A1
SG164338A1 SG201000993-4A SG2010009934A SG164338A1 SG 164338 A1 SG164338 A1 SG 164338A1 SG 2010009934 A SG2010009934 A SG 2010009934A SG 164338 A1 SG164338 A1 SG 164338A1
Authority
SG
Singapore
Prior art keywords
substrate
adjusting
speed
projection system
controlling
Prior art date
Application number
SG201000993-4A
Other languages
English (en)
Inventor
Marco Koert Stavenga
Nicolaas Rudolf Kemper
Martinus Hendrikus Antonius Leenders
Paulus Martinus Maria Liebregts
Johannes Catharinus Hubertus Mulkens
Erik Henricus Egidius Catharina Eummelen
Richard Moerman
Michel Riepen
Sergei Shulepov
Gert-Jan Gerardus Johannes Thomas Brands
Koen Steffens
Jan Willem Cromwijk
Ralph Joseph Meijers
Fabrizio Evangelista
David Bessems
Hua Li
Marinus Jochemsen
Pieter Lein Joseph Gunter
Franciscus Wilhelmus Bell
Erik Witberg
Marcus Agnes Johannes Smits
Zhenhua Ma
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG164338A1 publication Critical patent/SG164338A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers
SG201000993-4A 2009-02-19 2010-02-12 A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method SG164338A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15394109P 2009-02-19 2009-02-19
US18749609P 2009-06-16 2009-06-16

Publications (1)

Publication Number Publication Date
SG164338A1 true SG164338A1 (en) 2010-09-29

Family

ID=42263929

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201000993-4A SG164338A1 (en) 2009-02-19 2010-02-12 A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method

Country Status (7)

Country Link
US (1) US8405817B2 (fr)
EP (1) EP2221669A3 (fr)
JP (1) JP5334204B2 (fr)
KR (2) KR101234124B1 (fr)
CN (1) CN101840158B (fr)
SG (1) SG164338A1 (fr)
TW (1) TWI422988B (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2221669A3 (fr) 2009-02-19 2011-02-09 ASML Netherlands B.V. Appareil lithographique, procédé de commande de l'appareil et procédé de fabrication d'un dispositif
NL2004305A (en) 2009-03-13 2010-09-14 Asml Netherlands Bv Substrate table, immersion lithographic apparatus and device manufacturing method.
NL2006818A (en) 2010-07-02 2012-01-03 Asml Netherlands Bv A method of adjusting speed and/or routing of a table movement plan and a lithographic apparatus.
NL2008183A (en) * 2011-02-25 2012-08-28 Asml Netherlands Bv A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method.
US9568828B2 (en) * 2012-10-12 2017-02-14 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
TW201432080A (zh) * 2013-02-01 2014-08-16 Chiuan Yan Technology Co Ltd 負壓無塵型對位機構
CN106716255B (zh) 2014-08-07 2019-06-14 Asml荷兰有限公司 光刻设备和制造器件的方法
NL2016399A (en) * 2015-04-20 2016-10-24 Asml Netherlands Bv Lithographic Apparatus and Method in a Lithographic Process.
JP6663982B2 (ja) * 2015-10-01 2020-03-13 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置及びデバイス製造の方法
CN109716238B (zh) * 2016-09-20 2020-12-25 Asml荷兰有限公司 光刻设备和制造器件的方法
CN110088686B (zh) 2016-12-14 2021-11-16 Asml荷兰有限公司 光刻设备及器件制造方法
EP4167029A1 (fr) * 2021-10-14 2023-04-19 ASML Netherlands B.V. Système d'extraction de fluide, procédé et appareil lithographique

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4509852A (en) 1980-10-06 1985-04-09 Werner Tabarelli Apparatus for the photolithographic manufacture of integrated circuit elements
AU2747999A (en) 1998-03-26 1999-10-18 Nikon Corporation Projection exposure method and system
AU2611301A (en) * 1999-12-30 2001-07-16 Morphics Technology, Inc. Apparatus and method for calculating and implementing a fibonacci mask for a code generator
TWI260469B (en) * 2001-12-04 2006-08-21 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and method of manufacturing an optical element
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1420300B1 (fr) 2002-11-12 2015-07-29 ASML Netherlands B.V. Appareil lithographique et méthode de fabrication d'un dispositif
CN100470367C (zh) 2002-11-12 2009-03-18 Asml荷兰有限公司 光刻装置和器件制造方法
TWI295414B (en) 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
KR101915921B1 (ko) 2003-08-21 2019-01-07 가부시키가이샤 니콘 노광 장치, 노광 방법 및 디바이스 제조 방법
DE60302897T2 (de) * 2003-09-29 2006-08-03 Asml Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
US7394521B2 (en) 2003-12-23 2008-07-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005067013A1 (fr) 2004-01-05 2005-07-21 Nikon Corporation Appareil et procede d'exposition, dispositif associe
JP4479911B2 (ja) 2004-02-18 2010-06-09 株式会社ニコン 駆動方法、露光方法及び露光装置、並びにデバイス製造方法
US20050248754A1 (en) * 2004-05-05 2005-11-10 Chun-Sheng Wang Wafer aligner with WEE (water edge exposure) function
US7701550B2 (en) 2004-08-19 2010-04-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7161654B2 (en) * 2004-12-02 2007-01-09 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7397533B2 (en) 2004-12-07 2008-07-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006245157A (ja) 2005-03-02 2006-09-14 Canon Inc 露光方法及び露光装置
WO2006106832A1 (fr) 2005-03-30 2006-10-12 Nikon Corporation Procede pour determiner des conditions d’exposition, procede d’exposition, dispositif d’exposition, et appareil de production du dispositif
CN101156226B (zh) * 2005-04-27 2012-03-14 株式会社尼康 曝光方法、曝光装置、组件制造方法、以及膜的评估方法
EP1876637A4 (fr) * 2005-04-28 2010-01-27 Nikon Corp Procédé d exposition, appareil d exposition, et procédé de fabrication du dispositif
JP2007194484A (ja) * 2006-01-20 2007-08-02 Toshiba Corp 液浸露光方法
US7903232B2 (en) 2006-04-12 2011-03-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2007287824A (ja) 2006-04-14 2007-11-01 Nikon Corp 露光装置及びデバイス製造方法
US7567338B2 (en) * 2006-08-30 2009-07-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4357514B2 (ja) * 2006-09-29 2009-11-04 株式会社東芝 液浸露光方法
JP2008124194A (ja) 2006-11-10 2008-05-29 Canon Inc 液浸露光方法および液浸露光装置
JP5089143B2 (ja) 2006-11-20 2012-12-05 キヤノン株式会社 液浸露光装置
US8634053B2 (en) 2006-12-07 2014-01-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2008192854A (ja) * 2007-02-05 2008-08-21 Canon Inc 液浸露光装置
US7755740B2 (en) 2007-02-07 2010-07-13 Canon Kabushiki Kaisha Exposure apparatus
US9529275B2 (en) 2007-02-21 2016-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. Lithography scanner throughput
US7679719B2 (en) 2007-04-05 2010-03-16 Asml Netherlands B.V. Lithographic apparatus having a drive system with coordinate transformation, and device manufacturing method
DE102007025340B4 (de) * 2007-05-31 2019-12-05 Globalfoundries Inc. Immersionslithograpieprozess unter Anwendung einer variablen Abtastgeschwindigkeit und Lithographiesystem
JP2008300771A (ja) 2007-06-04 2008-12-11 Nikon Corp 液浸露光装置、デバイス製造方法、及び露光条件の決定方法
US8953141B2 (en) 2007-12-21 2015-02-10 Asml Netherlands B.V. Immersion lithographic apparatus and device manufacturing method with asymmetric acceleration profile of substrate table to maintain meniscus of immersion liquid
NL1036715A1 (nl) 2008-04-16 2009-10-19 Asml Netherlands Bv Lithographic apparatus.
EP2151717A1 (fr) 2008-08-05 2010-02-10 ASML Holding N.V. Balayage complet de la largeur d'une tranche utilisant un système de photorépétition
EP2221669A3 (fr) 2009-02-19 2011-02-09 ASML Netherlands B.V. Appareil lithographique, procédé de commande de l'appareil et procédé de fabrication d'un dispositif

Also Published As

Publication number Publication date
JP5334204B2 (ja) 2013-11-06
US8405817B2 (en) 2013-03-26
TW201044117A (en) 2010-12-16
KR101596403B1 (ko) 2016-02-22
JP2010219510A (ja) 2010-09-30
EP2221669A2 (fr) 2010-08-25
KR20110134351A (ko) 2011-12-14
US20100214543A1 (en) 2010-08-26
EP2221669A3 (fr) 2011-02-09
TWI422988B (zh) 2014-01-11
CN101840158B (zh) 2013-01-23
KR20100094962A (ko) 2010-08-27
CN101840158A (zh) 2010-09-22
KR101234124B1 (ko) 2013-02-19

Similar Documents

Publication Publication Date Title
SG164338A1 (en) A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method
TW200834267A (en) Process, apparatus and device
SG114755A1 (en) Lithographic apparatus and device manufacturing method
TW200731023A (en) System and method for compensating for radiation induced thermal distortions
WO2010127262A3 (fr) Positionnement thermomécanique pour suivi des radiations
EP2023379A4 (fr) Appareil d'exposition et procédé d'exposition
SG158822A1 (en) Full wafer width scanning using step and scan system
TW200600978A (en) Lithographic apparatus and device manufacturing method
SG146599A1 (en) Lithographic apparatus and method
MX338814B (es) Formacion de imagenes del tejido objetivo quirurgico mediante exploracion no lineal.
WO2008100330A3 (fr) Modification superficielle de surface polymère au moyen d'irradiation par faisceau ionique
TW200628996A (en) Lithographic apparatus, device manufacturing method, and a projection element for use in the lithographic apparatus
WO2007056574A3 (fr) Procedes et dispositif d'imagerie a faible dose
PT1866144T (pt) Aparelho para a conformação de um filme plano numa lente ótica, processo para a funcionalização de uma lente ótica por meio do referido aparelho e a lente ótica obtida deste modo
WO2012133926A3 (fr) Appareil et procédé pour mesurer un profil et procédé de fabrication d'une structure
WO2008058671A3 (fr) Dispositif de projection ayant une propriété de projection améliorée
TW200705133A (en) Lithographic apparatus and device manufacturing method
WO2008006569A3 (fr) Système pour générer un rayonnement électromagnétique et procédé pour faire fonctionner ce système
EP1970934A3 (fr) Appareil d'examen à rayons X et procédé d'examen à rayons X l'utilisant
SG138540A1 (en) Semiconductor cutting device, semiconductor cutting method, semiconductor cutting system, laser cutting device and laser cutting method
TW200628998A (en) Lithographic apparatus and device manufacturing method
TW200700934A (en) Lithographic apparatus, immersion projection apparatus and device manufacturing method
WO2009042462A3 (fr) Techniques pour métrologie optique par faisceaux d'ions
WO2014095266A3 (fr) Support de substrat pour appareil lithographique et appareil lithographique
TW200745792A (en) Stage apparatus, exposure apparatus, stage control method, exposure method and device manufacturing method