SG162686A1 - Wafer electroplating apparatus for reducing edge defects - Google Patents

Wafer electroplating apparatus for reducing edge defects

Info

Publication number
SG162686A1
SG162686A1 SG200908245-4A SG2009082454A SG162686A1 SG 162686 A1 SG162686 A1 SG 162686A1 SG 2009082454 A SG2009082454 A SG 2009082454A SG 162686 A1 SG162686 A1 SG 162686A1
Authority
SG
Singapore
Prior art keywords
apparatuses
contact
contact ring
electroplating apparatus
lipseal
Prior art date
Application number
SG200908245-4A
Other languages
English (en)
Inventor
Vinay Prabhakar
Bryan L Buckalew
Kousik Ganesan
Shantinath Ghongadi
He Zhian
Steven T Mayer
Robert Rash
Jonathan D Reid
Yuichi Takada
James R Zibrida
Original Assignee
Novellus Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novellus Systems Inc filed Critical Novellus Systems Inc
Publication of SG162686A1 publication Critical patent/SG162686A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
SG200908245-4A 2008-12-10 2009-12-09 Wafer electroplating apparatus for reducing edge defects SG162686A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12146008P 2008-12-10 2008-12-10

Publications (1)

Publication Number Publication Date
SG162686A1 true SG162686A1 (en) 2010-07-29

Family

ID=42264466

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200908245-4A SG162686A1 (en) 2008-12-10 2009-12-09 Wafer electroplating apparatus for reducing edge defects

Country Status (6)

Country Link
US (2) US8172992B2 (ja)
JP (2) JP5237924B2 (ja)
KR (1) KR101203223B1 (ja)
CN (1) CN101798698B (ja)
SG (1) SG162686A1 (ja)
TW (1) TWI369418B (ja)

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Also Published As

Publication number Publication date
TW201028503A (en) 2010-08-01
TWI369418B (en) 2012-08-01
US20100155254A1 (en) 2010-06-24
JP5237924B2 (ja) 2013-07-17
JP2013167022A (ja) 2013-08-29
CN101798698B (zh) 2014-01-29
CN101798698A (zh) 2010-08-11
JP2010150659A (ja) 2010-07-08
US8172992B2 (en) 2012-05-08
US20120181170A1 (en) 2012-07-19
KR20100067072A (ko) 2010-06-18
KR101203223B1 (ko) 2012-11-20

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