SG160334A1 - Epoxy resin, hardenable resin composition containing the same and use thereof - Google Patents

Epoxy resin, hardenable resin composition containing the same and use thereof

Info

Publication number
SG160334A1
SG160334A1 SG201001206-0A SG2010012060A SG160334A1 SG 160334 A1 SG160334 A1 SG 160334A1 SG 2010012060 A SG2010012060 A SG 2010012060A SG 160334 A1 SG160334 A1 SG 160334A1
Authority
SG
Singapore
Prior art keywords
epoxy resin
resin composition
excelling
low dielectric
heat resistance
Prior art date
Application number
SG201001206-0A
Other languages
English (en)
Inventor
Masataka Nakanishi
Yasumasa Akatsuka
Katsuhiko Oshimi
Takao Sunaga
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of SG160334A1 publication Critical patent/SG160334A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
SG201001206-0A 2005-02-25 2006-02-20 Epoxy resin, hardenable resin composition containing the same and use thereof SG160334A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005051150 2005-02-25
JP2005051959 2005-02-25

Publications (1)

Publication Number Publication Date
SG160334A1 true SG160334A1 (en) 2010-04-29

Family

ID=36927302

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201001206-0A SG160334A1 (en) 2005-02-25 2006-02-20 Epoxy resin, hardenable resin composition containing the same and use thereof

Country Status (8)

Country Link
EP (1) EP1852451A1 (fr)
JP (1) JP5180583B2 (fr)
KR (1) KR101229854B1 (fr)
CN (1) CN101128501B (fr)
CA (1) CA2599153A1 (fr)
SG (1) SG160334A1 (fr)
TW (1) TWI387608B (fr)
WO (1) WO2006090662A1 (fr)

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* Cited by examiner, † Cited by third party
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US9169356B2 (en) * 2005-10-25 2015-10-27 Mitsubishi Gas Chemical Company, Inc. Cyanate ester polymer
JP4926811B2 (ja) * 2006-04-28 2012-05-09 日立化成工業株式会社 樹脂組成物、プリプレグ、積層板及び配線板
CN103342876A (zh) * 2006-04-28 2013-10-09 日立化成工业株式会社 树脂组合物、预渍体、层叠板及布线板
JP2008074934A (ja) * 2006-09-20 2008-04-03 Mitsubishi Gas Chem Co Inc プリプレグの製造方法
TWI443015B (zh) 2007-01-16 2014-07-01 Sumitomo Bakelite Co 絕緣樹脂片積層體、由該絕緣樹脂片積層體所積層而成之多層印刷配線板
WO2008126825A1 (fr) * 2007-04-10 2008-10-23 Sumitomo Bakelite Co., Ltd. Composition de résine, préimprégné, planche stratifiée, tableau de connexions imprimé multicouche et dispositif à semi-conducteur
KR101047924B1 (ko) * 2007-12-28 2011-07-08 주식회사 엘지화학 경화 조성물 및 이를 이용하여 제조된 경화물
KR101564957B1 (ko) * 2008-11-06 2015-11-13 니폰 가야꾸 가부시끼가이샤 페놀 수지 혼합물, 에폭시 수지 혼합물, 에폭시 수지 조성물, 및 경화물
JP5263134B2 (ja) * 2009-12-07 2013-08-14 住友ベークライト株式会社 回路基板用樹脂組成物、プリプレグ、積層板、樹脂シート、多層プリント配線板および半導体装置
TWI421269B (zh) * 2009-12-29 2014-01-01 Swancor Ind Co Ltd Epoxy resin composition
US9453126B2 (en) 2010-10-29 2016-09-27 Mitsubishi Gas Chemical Company, Inc. Cyanate ester compound, curable resin composition containing cyanate ester compound, and cured product thereof
KR101892784B1 (ko) 2011-08-09 2018-08-28 미츠비시 가스 가가쿠 가부시키가이샤 신규한 시안산에스테르 화합물 및 그 제조 방법, 그리고 그 화합물을 함유하는 경화성 수지 조성물 및 그 경화물
CN103987753B (zh) * 2011-12-07 2016-06-08 三菱瓦斯化学株式会社 树脂组合物、预浸料和层叠板
JP2014005375A (ja) * 2012-06-25 2014-01-16 Mitsubishi Chemicals Corp エポキシ樹脂、エポキシ樹脂組成物及び硬化物
KR101350997B1 (ko) * 2012-08-21 2014-01-14 주식회사 신아티앤씨 전기적 특성이 우수한 에폭시 화합물 및 그 제조방법
JP5708612B2 (ja) * 2012-10-16 2015-04-30 三菱瓦斯化学株式会社 プリプレグの製造方法
CN102942834B (zh) * 2012-11-09 2016-01-20 太原科技大学 一种防腐蚀用涂料的制备方法
US20160108230A1 (en) * 2013-05-30 2016-04-21 Shengyi Technology Co., Ltd. Cyanate resin composition and use thereof
JP6671958B2 (ja) * 2013-10-09 2020-03-25 日本化薬株式会社 フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物、プリプレグおよびそれらの硬化物
KR102250971B1 (ko) * 2014-02-07 2021-05-12 닛뽄 가야쿠 가부시키가이샤 에폭시 수지 혼합물, 에폭시 수지 조성물, 그 경화물, 및 반도체 장치
JP6493287B2 (ja) * 2015-05-20 2019-04-03 信越化学工業株式会社 液状樹脂組成物
US20180099484A1 (en) * 2015-06-17 2018-04-12 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed wiring board
US11091839B2 (en) 2016-03-09 2021-08-17 Nippon Steel Corporation Surface-treated steel sheet and method for producing surface-treated steel sheet
WO2018088469A1 (fr) * 2016-11-11 2018-05-17 住友ベークライト株式会社 Composition de résine photosensible, film de résine, film durci, procédé de production d'un dispositif à semi-conducteurs et dispositif à semi-conducteurs
WO2019013040A1 (fr) * 2017-07-10 2019-01-17 Dic株式会社 Stratifié, carte de circuit imprimé mettant en œuvre celui-ci, carte de circuit imprimé souple, et article moulé
JPWO2019198378A1 (ja) * 2018-04-13 2021-02-12 株式会社Moresco 化合物およびその利用
KR102133400B1 (ko) 2018-12-13 2020-07-14 주식회사 제일화성 내수성이 우수한 섬유 함침용 에폭시 수지 조성물
CN110967109B (zh) * 2019-12-23 2022-04-01 成都高斯电子技术有限公司 一种传感器制备液及其应用

Family Cites Families (5)

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Publication number Priority date Publication date Assignee Title
JPH09268219A (ja) * 1996-03-29 1997-10-14 Nippon Kayaku Co Ltd ノボラック型樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2001089550A (ja) * 1999-09-21 2001-04-03 Nippon Kayaku Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP4104107B2 (ja) * 2000-10-05 2008-06-18 日本化薬株式会社 エポキシ樹脂組成物及びその用途
JP4738622B2 (ja) * 2001-04-13 2011-08-03 住友ベークライト株式会社 耐熱性樹脂組成物、これを用いたプリプレグ及び積層板
JP4502195B2 (ja) * 2004-08-27 2010-07-14 日本化薬株式会社 液状エポキシ樹脂、それを含むエポキシ樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
CA2599153A1 (fr) 2006-08-31
WO2006090662A1 (fr) 2006-08-31
EP1852451A1 (fr) 2007-11-07
CN101128501B (zh) 2010-12-08
JP5180583B2 (ja) 2013-04-10
TW200640976A (en) 2006-12-01
KR101229854B1 (ko) 2013-02-05
JPWO2006090662A1 (ja) 2008-07-24
CN101128501A (zh) 2008-02-20
KR20070108384A (ko) 2007-11-09
TWI387608B (zh) 2013-03-01

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