SG152220A1 - Soldering process - Google Patents

Soldering process

Info

Publication number
SG152220A1
SG152220A1 SG200902277-3A SG2009022773A SG152220A1 SG 152220 A1 SG152220 A1 SG 152220A1 SG 2009022773 A SG2009022773 A SG 2009022773A SG 152220 A1 SG152220 A1 SG 152220A1
Authority
SG
Singapore
Prior art keywords
solder
metal oxide
soldering
layer
bath
Prior art date
Application number
SG200902277-3A
Other languages
English (en)
Inventor
Lawrence C Kay
Erik J Severin
Luis A Aguirre
Original Assignee
P Kay Metal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by P Kay Metal Inc filed Critical P Kay Metal Inc
Publication of SG152220A1 publication Critical patent/SG152220A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture And Refinement Of Metals (AREA)
SG200902277-3A 2004-04-16 2005-04-18 Soldering process SG152220A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US56296404P 2004-04-16 2004-04-16
US60958904P 2004-09-14 2004-09-14

Publications (1)

Publication Number Publication Date
SG152220A1 true SG152220A1 (en) 2009-05-29

Family

ID=35107043

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200902277-3A SG152220A1 (en) 2004-04-16 2005-04-18 Soldering process

Country Status (14)

Country Link
EP (1) EP1748864B1 (ko)
JP (1) JP5021460B2 (ko)
KR (1) KR101297611B1 (ko)
AU (1) AU2005243743A1 (ko)
BR (1) BRPI0509932A (ko)
CA (1) CA2563385C (ko)
HK (1) HK1105918A1 (ko)
HU (1) HUE033419T2 (ko)
IL (1) IL178640A (ko)
MX (1) MXPA06011954A (ko)
PL (1) PL1748864T3 (ko)
RU (1) RU2372175C2 (ko)
SG (1) SG152220A1 (ko)
WO (1) WO2005110657A2 (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2926233B1 (fr) * 2008-01-10 2010-08-13 Air Liquide Dispositif d'alimentation en gaz d'une machine de brasage ou etamage a la vague.
JP4375485B2 (ja) * 2008-02-22 2009-12-02 日本ジョイント株式会社 鉛フリーはんだ合金の製造方法及び半導体装置の製造方法
JP4375491B1 (ja) 2008-06-23 2009-12-02 日本ジョイント株式会社 電子部品のはんだ付け装置およびはんだ付け方法
WO2011022514A1 (en) 2009-08-18 2011-02-24 Ms2 Technologies, Llc Tool for removing solder dross with a receptacle and a lift; method of treating solder dross using such tool
JP6310894B2 (ja) * 2015-09-30 2018-04-11 株式会社タムラ製作所 はんだ組成物および電子基板の製造方法
JP6460198B1 (ja) * 2017-10-11 2019-01-30 千住金属工業株式会社 フラックス及びソルダペースト
JP6540789B1 (ja) 2017-12-29 2019-07-10 千住金属工業株式会社 樹脂組成物及びはんだ付け用フラックス
JP6540788B1 (ja) 2017-12-29 2019-07-10 千住金属工業株式会社 フラックス及びソルダペースト
JP6501003B1 (ja) 2018-01-17 2019-04-17 千住金属工業株式会社 はんだ付け用樹脂組成物、やに入りはんだ、フラックスコートはんだ及び液状フラックス
JP6540833B1 (ja) * 2018-01-17 2019-07-10 千住金属工業株式会社 フラックス及びソルダペースト
CN108471678B (zh) * 2018-04-13 2019-02-22 荆门紫菘电子有限公司 一种电子焊接用单片机基座安装装置
CN113977963B (zh) * 2021-12-02 2022-11-29 山东润德复合材料有限公司 一种基于土工格栅的焊接装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3058441A (en) * 1956-10-02 1962-10-16 Sanders Associates Inc Soldering apparatus and method of soldering electrical conductors
US3445919A (en) * 1968-07-11 1969-05-27 Electronic Eng Co California Method of using a solder contact fluid
US3755886A (en) * 1971-10-22 1973-09-04 Magnavox Co Method for soldering electrical conductors
JPS5276250A (en) * 1975-12-23 1977-06-27 Yoshio Tobari Antioxidant for solder
US4171761A (en) * 1978-03-20 1979-10-23 Rockwell International Corporation Wave solder apparatus
CH660145A5 (de) * 1983-07-15 1987-03-31 Landis & Gyr Ag Verfahren zum schutz der oberflaeche eines loetbads.
US4495007A (en) * 1984-03-12 1985-01-22 At&T Technologies, Inc. Soldering flux
JPH10163617A (ja) * 1996-11-26 1998-06-19 Sony Corp はんだドロスの還元方法および還元装置
JP2001320162A (ja) * 1998-02-27 2001-11-16 Matsushita Electric Ind Co Ltd はんだ回収装置と酸化物の除去方法
EP1378309B1 (en) * 1998-02-27 2008-07-09 Matsushita Electric Industrial Co., Ltd. Method for separating solder and solder oxides
JP2001068848A (ja) * 1999-08-24 2001-03-16 Furukawa Electric Co Ltd:The 半田組成物およびそれを用いた半田供給方法

Also Published As

Publication number Publication date
WO2005110657A2 (en) 2005-11-24
KR20070006901A (ko) 2007-01-11
JP5021460B2 (ja) 2012-09-05
JP2007532321A (ja) 2007-11-15
EP1748864B1 (en) 2017-06-07
RU2372175C2 (ru) 2009-11-10
CA2563385C (en) 2012-02-21
EP1748864A2 (en) 2007-02-07
AU2005243743A1 (en) 2005-11-24
RU2006140378A (ru) 2008-05-27
BRPI0509932A (pt) 2007-09-25
IL178640A (en) 2011-10-31
HUE033419T2 (en) 2017-11-28
CA2563385A1 (en) 2005-11-24
KR101297611B1 (ko) 2013-08-19
HK1105918A1 (en) 2008-02-29
PL1748864T3 (pl) 2017-12-29
MXPA06011954A (es) 2007-03-26
WO2005110657A3 (en) 2006-01-12
IL178640A0 (en) 2007-02-11

Similar Documents

Publication Publication Date Title
TW200610122A (en) Soldering process
SG152220A1 (en) Soldering process
RU2004103629A (ru) Припой, по существу не содержащий свинец, и способ его получения
MY151120A (en) Solder pastes with resin-free fluxing agent
KR20090088359A (ko) 납프리 땜납용 플럭스와 납땜 방법
JP2007532321A5 (ko)
JP4694251B2 (ja) 無鉛半田付け用の銅または銅合金の表面処理剤及びその利用
KR0177185B1 (ko) 브리지 발생을 감소시키기 위한 납땜방법
EP1405687A3 (en) Method and device for flow soldering
JP2005354043A (ja) 電子回路基板の製造方法
DE60127911D1 (de) Verfahren zum steuern des kupfergehalts in einem weichlöttauchbad
JP2004047827A (ja) プリント回路板の製造方法
US8109432B2 (en) Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board
CN102166692B (zh) 一种无卤素助焊剂
MY146383A (en) Soldering process
WO2008012165A3 (de) Verfahren und wellenlötanlage zum löten von bauteilen auf ober- und unterseite einer leiterplatte
JP5478708B2 (ja) 間隙腐食から保護するための有機ポリマーコーティング
EP1293283A3 (en) Method for local application of solder to preselected areas on a printed circuit board
CN106413282B (zh) 一种电子线路板的局部波峰焊工艺
KR101795876B1 (ko) 연성인쇄회로기판(ｆｐｃｂ)의 땜납 플럭스 세정제 조성물 및 세정 방법
DE60126979D1 (de) Verfahren zur herstellung einer lötung zwischen metallischen kugeln eines elektronischen bauelements und kontaktflecken einer schaltung und lötofen dafür
CN105555056A (zh) 一种线路板浸焊工艺
TH98677B (th) กระบวนการบัดกรี
TH98677A (th) กระบวนการบัดกรี
JPS63286292A (ja) 導体板製造における融剤及び再融解液としてのアルキレンオキシド付加物