SG148971A1 - Substrates and methods of using those substrates - Google Patents
Substrates and methods of using those substratesInfo
- Publication number
- SG148971A1 SG148971A1 SG200804823-3A SG2008048233A SG148971A1 SG 148971 A1 SG148971 A1 SG 148971A1 SG 2008048233 A SG2008048233 A SG 2008048233A SG 148971 A1 SG148971 A1 SG 148971A1
- Authority
- SG
- Singapore
- Prior art keywords
- substrates
- contamination
- methods
- substrate
- those
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 7
- 238000000034 method Methods 0.000 title abstract 4
- 238000011109 contamination Methods 0.000 abstract 5
- 238000001459 lithography Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/822,695 US20090014030A1 (en) | 2007-07-09 | 2007-07-09 | Substrates and methods of using those substrates |
Publications (1)
Publication Number | Publication Date |
---|---|
SG148971A1 true SG148971A1 (en) | 2009-01-29 |
Family
ID=39789314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200804823-3A SG148971A1 (en) | 2007-07-09 | 2008-06-25 | Substrates and methods of using those substrates |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090014030A1 (ko) |
EP (1) | EP2015140A1 (ko) |
JP (2) | JP5064317B2 (ko) |
KR (2) | KR101155069B1 (ko) |
CN (2) | CN102305990B (ko) |
SG (1) | SG148971A1 (ko) |
TW (1) | TWI400577B (ko) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7723463B2 (en) * | 2006-04-12 | 2010-05-25 | Battelle Energy Alliance, Llc | Polyphosphazine-based polymer materials |
NL1036069A1 (nl) * | 2007-10-30 | 2009-05-07 | Asml Netherlands Bv | An Immersion Lithography Apparatus. |
JP2010103363A (ja) * | 2008-10-24 | 2010-05-06 | Nec Electronics Corp | 液浸露光装置の洗浄方法、ダミーウェハ、及び液浸露光装置 |
NL2003758A (en) * | 2008-12-04 | 2010-06-07 | Asml Netherlands Bv | A member with a cleaning surface and a method of removing contamination. |
US20110199591A1 (en) * | 2009-10-14 | 2011-08-18 | Nikon Corporation | Exposure apparatus, exposing method, maintenance method and device fabricating method |
NL2009284A (en) * | 2011-09-22 | 2013-10-31 | Asml Netherlands Bv | A cleaning substrate for a lithography apparatus, a cleaning method for a lithography apparatus and a lithography apparatus. |
JP6282260B2 (ja) * | 2012-04-02 | 2018-02-21 | エーエスエムエル ネザーランズ ビー.ブイ. | 微粒子汚染測定方法及び装置 |
US9846365B2 (en) | 2013-08-02 | 2017-12-19 | Asml Netherlands B.V. | Component for a radiation source, associated radiation source and lithographic apparatus |
NL2020847A (en) | 2017-05-25 | 2018-12-04 | Asml Holding Nv | Substrates and methods of using those substrates |
WO2019158380A1 (en) | 2018-02-13 | 2019-08-22 | Asml Netherlands B.V. | Apparatus for and method of in-situ particle removal in a lithography apparatus |
US11431494B2 (en) | 2018-03-15 | 2022-08-30 | Atakama LLC | Passwordless security system for data-at-rest |
US11953838B2 (en) | 2018-11-09 | 2024-04-09 | Asml Holding N.V. | Lithography support cleaning with cleaning substrate having controlled geometry and composition |
US11256181B2 (en) * | 2019-07-31 | 2022-02-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for removing particles in semiconductor manufacturing |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06224105A (ja) * | 1993-01-22 | 1994-08-12 | Kawasaki Steel Corp | 露光装置のステージのゴミ粒子除去方法 |
JP2518528B2 (ja) * | 1993-07-27 | 1996-07-24 | 日本電気株式会社 | 集塵器 |
JP3450584B2 (ja) * | 1996-04-09 | 2003-09-29 | キヤノン株式会社 | 半導体露光装置 |
JPH11162831A (ja) * | 1997-11-21 | 1999-06-18 | Nikon Corp | 投影露光装置及び投影露光方法 |
AU1175799A (en) * | 1997-11-21 | 1999-06-15 | Nikon Corporation | Projection aligner and projection exposure method |
JPH11345846A (ja) * | 1999-02-19 | 1999-12-14 | Japan Electronic Materials Corp | プロ―ブ先端クリ―ニングシ―ト |
DE19963124A1 (de) * | 1999-12-24 | 2001-07-12 | Roland Man Druckmasch | Reinigungsmedium und dessen Verwendung |
KR100756211B1 (ko) * | 2000-05-04 | 2007-09-06 | 비티지 인터내셔널 리미티드 | 나노구조물 |
US6787339B1 (en) * | 2000-10-02 | 2004-09-07 | Motorola, Inc. | Microfluidic devices having embedded metal conductors and methods of fabricating said devices |
JP3981246B2 (ja) * | 2001-05-02 | 2007-09-26 | 日東電工株式会社 | クリーニングシ―ト、クリーニング機能付き搬送部材、及びこれらを用いた基板処理装置のクリーニング方法 |
JP2004063669A (ja) * | 2002-07-26 | 2004-02-26 | Oki Electric Ind Co Ltd | 半導体製造装置クリーニングウエハとその製造方法、およびそれを用いたクリーニング方法 |
US7135728B2 (en) * | 2002-09-30 | 2006-11-14 | Nanosys, Inc. | Large-area nanoenabled macroelectronic substrates and uses therefor |
JP4052966B2 (ja) * | 2003-03-24 | 2008-02-27 | Necエレクトロニクス株式会社 | ウェハ検査装置およびその検査方法 |
ATE449982T1 (de) * | 2003-04-11 | 2009-12-15 | Nikon Corp | Reinigungsverfahren für optik in immersionslithographie |
JP2005277363A (ja) * | 2003-05-23 | 2005-10-06 | Nikon Corp | 露光装置及びデバイス製造方法 |
TWI616932B (zh) * | 2003-05-23 | 2018-03-01 | Nikon Corp | Exposure device and component manufacturing method |
JP4305095B2 (ja) * | 2003-08-29 | 2009-07-29 | 株式会社ニコン | 光学部品の洗浄機構を搭載した液浸投影露光装置及び液浸光学部品洗浄方法 |
CA2544836A1 (en) * | 2003-11-06 | 2005-05-26 | Guo Bin Wang | High-density amine-functionalized surface |
JP3998014B2 (ja) * | 2004-09-29 | 2007-10-24 | セイコーエプソン株式会社 | 半導体装置、実装構造体、電気光学装置、電気光学装置の製造方法及び電子機器 |
US7362412B2 (en) * | 2004-11-18 | 2008-04-22 | International Business Machines Corporation | Method and apparatus for cleaning a semiconductor substrate in an immersion lithography system |
US7807335B2 (en) * | 2005-06-03 | 2010-10-05 | International Business Machines Corporation | Immersion lithography contamination gettering layer |
US20070004182A1 (en) * | 2005-06-30 | 2007-01-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and system for inhibiting immersion lithography defect formation |
US7986395B2 (en) * | 2005-10-24 | 2011-07-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Immersion lithography apparatus and methods |
-
2007
- 2007-07-09 US US11/822,695 patent/US20090014030A1/en not_active Abandoned
-
2008
- 2008-06-25 SG SG200804823-3A patent/SG148971A1/en unknown
- 2008-07-02 JP JP2008173127A patent/JP5064317B2/ja not_active Expired - Fee Related
- 2008-07-03 TW TW097125052A patent/TWI400577B/zh not_active IP Right Cessation
- 2008-07-04 EP EP08252279A patent/EP2015140A1/en not_active Withdrawn
- 2008-07-08 CN CN201110223557.8A patent/CN102305990B/zh not_active Expired - Fee Related
- 2008-07-08 CN CN2008101360329A patent/CN101446770B/zh not_active Expired - Fee Related
- 2008-07-08 KR KR1020080066024A patent/KR101155069B1/ko not_active IP Right Cessation
-
2010
- 2010-07-13 KR KR1020100067433A patent/KR101363424B1/ko not_active IP Right Cessation
-
2011
- 2011-03-24 JP JP2011065516A patent/JP5285107B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009016838A (ja) | 2009-01-22 |
TWI400577B (zh) | 2013-07-01 |
CN101446770A (zh) | 2009-06-03 |
CN101446770B (zh) | 2011-09-28 |
JP5285107B2 (ja) | 2013-09-11 |
CN102305990B (zh) | 2014-05-07 |
KR101363424B1 (ko) | 2014-02-14 |
KR101155069B1 (ko) | 2012-06-15 |
KR20100098478A (ko) | 2010-09-07 |
JP2011159986A (ja) | 2011-08-18 |
TW200925787A (en) | 2009-06-16 |
EP2015140A1 (en) | 2009-01-14 |
US20090014030A1 (en) | 2009-01-15 |
JP5064317B2 (ja) | 2012-10-31 |
CN102305990A (zh) | 2012-01-04 |
KR20090005993A (ko) | 2009-01-14 |
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