SG148958A1 - Systems and methods for curing a deposited layer on a substrate - Google Patents
Systems and methods for curing a deposited layer on a substrateInfo
- Publication number
- SG148958A1 SG148958A1 SG200804612-0A SG2008046120A SG148958A1 SG 148958 A1 SG148958 A1 SG 148958A1 SG 2008046120 A SG2008046120 A SG 2008046120A SG 148958 A1 SG148958 A1 SG 148958A1
- Authority
- SG
- Singapore
- Prior art keywords
- curing
- deposited layer
- substrate
- controlling
- systems
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 3
- 238000005286 illumination Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/06—Surface hardening
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Computer Hardware Design (AREA)
- Metallurgy (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Semiconductor Lasers (AREA)
- Formation Of Insulating Films (AREA)
- Drying Of Semiconductors (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Laser Beam Processing (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/771,722 US20090004368A1 (en) | 2007-06-29 | 2007-06-29 | Systems and methods for curing a deposited layer on a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
SG148958A1 true SG148958A1 (en) | 2009-01-29 |
Family
ID=39916529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200804612-0A SG148958A1 (en) | 2007-06-29 | 2008-06-18 | Systems and methods for curing a deposited layer on a substrate |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090004368A1 (ja) |
EP (1) | EP2009969A3 (ja) |
JP (2) | JP2009076859A (ja) |
KR (1) | KR20090004483A (ja) |
CN (1) | CN101337219A (ja) |
SG (1) | SG148958A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101083320B1 (ko) * | 2011-03-11 | 2011-11-14 | 한국기계연구원 | 경화 시스템 및 그 방법 |
WO2013006158A1 (en) | 2011-07-01 | 2013-01-10 | Hewlett-Packard Development Company, L.P. | Curing apparatus, image forming apparatus, and articles of manufacture |
US9586226B2 (en) * | 2014-04-30 | 2017-03-07 | Kateeva, Inc. | Gas cushion apparatus and techniques for substrate coating |
CN109507768A (zh) * | 2018-11-29 | 2019-03-22 | 交通运输部公路科学研究所 | 微尺度光学结构加工装置 |
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JPH0795538B2 (ja) * | 1986-05-02 | 1995-10-11 | 旭硝子株式会社 | レ−ザ−アニ−ル装置 |
JPH0730362B2 (ja) * | 1987-03-20 | 1995-04-05 | 株式会社日立製作所 | 電子部品及びその製造方法 |
US5302954A (en) * | 1987-12-04 | 1994-04-12 | Magellan Corporation (Australia) Pty. Ltd. | Identification apparatus and methods |
DE3741916C2 (de) * | 1987-12-10 | 1996-07-18 | Resma Gmbh Fuegetechnik Indust | Verfahren zum Aushärten von Klebstoffen auf Kunststoffbasis |
US5656229A (en) * | 1990-02-20 | 1997-08-12 | Nikon Corporation | Method for removing a thin film layer |
US5204823A (en) * | 1991-03-20 | 1993-04-20 | Calcomp Inc. | Method and apparatus for high-speed layer thickness curing in 3-D model making |
US5300756A (en) * | 1991-10-22 | 1994-04-05 | General Scanning, Inc. | Method for severing integrated-circuit connection paths by a phase-plate-adjusted laser beam |
JPH05133375A (ja) * | 1991-11-14 | 1993-05-28 | Matsushita Electric Ind Co Ltd | 電動圧縮機 |
US5264061A (en) * | 1992-10-22 | 1993-11-23 | Motorola, Inc. | Method of forming a three-dimensional printed circuit assembly |
JPH0766536A (ja) * | 1993-08-30 | 1995-03-10 | Fujitsu Ten Ltd | 配線の印刷方法及び該方法に使用する印刷装置 |
GB9520888D0 (en) * | 1995-10-12 | 1995-12-13 | Philips Electronics Nv | Electronic devices comprising thin-film circuitry |
EP0791706B1 (en) * | 1996-01-31 | 2004-07-14 | Texas Instruments Deutschland Gmbh | Improvements in or relating to full-wave rectifiers |
JP4346684B2 (ja) * | 1996-04-17 | 2009-10-21 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 基板上への焼結体の製造方法 |
JP3085451B2 (ja) * | 1996-04-22 | 2000-09-11 | 富士通株式会社 | 製造ラインおよびそれによって製造される多層プリント配線基板 |
JPH1098251A (ja) * | 1996-09-23 | 1998-04-14 | Matsushita Electric Ind Co Ltd | 蒸着された金属配線および誘電配線のuvレーザーアニーリングおよび洗浄 |
DE02079791T1 (de) * | 1997-09-11 | 2004-04-15 | Precision Dynamics Corp., San Fernando | RF-ID Etikett mit einem integriertem Schaltkreis aus organischen Materialen |
US6121130A (en) * | 1998-11-16 | 2000-09-19 | Chartered Semiconductor Manufacturing Ltd. | Laser curing of spin-on dielectric thin films |
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US6524346B1 (en) * | 1999-02-26 | 2003-02-25 | Micron Technology, Inc. | Stereolithographic method for applying materials to electronic component substrates and resulting structures |
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GB2432714A (en) * | 2005-10-06 | 2007-05-30 | Seiko Epson Corp | Thin film transistor and method for fabricating an electronic device |
US7622378B2 (en) * | 2005-11-09 | 2009-11-24 | Tokyo Electron Limited | Multi-step system and method for curing a dielectric film |
US8956457B2 (en) * | 2006-09-08 | 2015-02-17 | Tokyo Electron Limited | Thermal processing system for curing dielectric films |
US7599048B2 (en) * | 2007-02-09 | 2009-10-06 | Wafermasters, Inc. | Optical emission spectroscopy process monitoring and material characterization |
-
2007
- 2007-06-29 US US11/771,722 patent/US20090004368A1/en not_active Abandoned
-
2008
- 2008-05-29 KR KR1020080049966A patent/KR20090004483A/ko not_active Application Discontinuation
- 2008-06-18 EP EP08252094A patent/EP2009969A3/en not_active Withdrawn
- 2008-06-18 SG SG200804612-0A patent/SG148958A1/en unknown
- 2008-06-24 JP JP2008164040A patent/JP2009076859A/ja active Pending
- 2008-06-30 CN CNA2008101295461A patent/CN101337219A/zh active Pending
-
2012
- 2012-02-13 JP JP2012028826A patent/JP2012182448A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US20090004368A1 (en) | 2009-01-01 |
CN101337219A (zh) | 2009-01-07 |
EP2009969A2 (en) | 2008-12-31 |
JP2009076859A (ja) | 2009-04-09 |
KR20090004483A (ko) | 2009-01-12 |
JP2012182448A (ja) | 2012-09-20 |
EP2009969A3 (en) | 2010-11-17 |
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