SG148026A1 - Laminate and use thereof - Google Patents

Laminate and use thereof

Info

Publication number
SG148026A1
SG148026A1 SG200501169-7A SG2005011697A SG148026A1 SG 148026 A1 SG148026 A1 SG 148026A1 SG 2005011697 A SG2005011697 A SG 2005011697A SG 148026 A1 SG148026 A1 SG 148026A1
Authority
SG
Singapore
Prior art keywords
layer
etching rate
laminate
inorganic material
resin
Prior art date
Application number
SG200501169-7A
Other languages
English (en)
Inventor
Katsuya Sakayori
Shigeki Kawano
Hiroko Amasaki
Hidetsugu Tazawa
Kazunari Ikeda
Kouhei Ohno
Original Assignee
Dainippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Printing Co Ltd filed Critical Dainippon Printing Co Ltd
Publication of SG148026A1 publication Critical patent/SG148026A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/147—Structure or manufacture of heads, e.g. inductive with cores being composed of metal sheets, i.e. laminated cores with cores composed of isolated magnetic layers, e.g. sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B2220/00—Record carriers by type
    • G11B2220/20—Disc-shaped record carriers
    • G11B2220/23—Disc-shaped record carriers characterised in that the disc has a specific layer structure
    • G11B2220/235—Multilayer discs, i.e. multiple recording layers accessed from the same side
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B2220/00—Record carriers by type
    • G11B2220/20—Disc-shaped record carriers
    • G11B2220/25—Disc-shaped record carriers characterised in that the disc is based on a specific recording technology
    • G11B2220/2508—Magnetic discs
    • G11B2220/2516—Hard disks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Insulating Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
SG200501169-7A 2000-06-21 2001-06-21 Laminate and use thereof SG148026A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000186564 2000-06-21
JP2000232227 2000-07-31
JP2001030249 2001-02-06
JP2001030171 2001-02-06

Publications (1)

Publication Number Publication Date
SG148026A1 true SG148026A1 (en) 2008-12-31

Family

ID=27481376

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200501169-7A SG148026A1 (en) 2000-06-21 2001-06-21 Laminate and use thereof

Country Status (9)

Country Link
US (2) US20040043232A1 (zh)
JP (2) JP5318314B2 (zh)
KR (2) KR100817345B1 (zh)
CN (2) CN101143500B (zh)
AU (1) AU7458201A (zh)
DE (1) DE10192864T1 (zh)
SG (1) SG148026A1 (zh)
TW (4) TW200519973A (zh)
WO (1) WO2001099124A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004073975A1 (ja) * 2003-02-18 2004-09-02 Mitsui Chemicals, Inc. ポリイミド金属積層体
US20080225438A1 (en) * 2005-03-03 2008-09-18 Nippon Steel Chemical Co., Ltd Laminate for Suspension and Method for Producing Same
JP2006244599A (ja) * 2005-03-03 2006-09-14 Nippon Steel Chem Co Ltd サスペンション用積層体およびその製造方法
US20080089072A1 (en) * 2006-10-11 2008-04-17 Alti-Electronics Co., Ltd. High Power Light Emitting Diode Package
DE102009012827A1 (de) * 2009-03-03 2010-10-07 Gebr. Schmid Gmbh & Co. Verfahren zur Texturierung von Siliziumwafern für Solarzellen und Behandlungsflüssigkeit dafür
TWI396482B (zh) * 2010-07-30 2013-05-11 Optromax Electronics Co Ltd 線路基板製程及線路基板結構
TWI521016B (zh) * 2012-07-18 2016-02-11 財團法人工業技術研究院 蝕刻含聚亞醯胺之膜層的方法
KR102282268B1 (ko) * 2014-01-22 2021-07-26 우베 고산 가부시키가이샤 도체층의 형성 방법, 및 그것을 사용한 다층 배선 기판의 제조 방법
WO2015179733A1 (en) * 2014-05-23 2015-11-26 Materion Corporation Air cavity package
CN104485294A (zh) * 2014-12-12 2015-04-01 浙江中纳晶微电子科技有限公司 一种晶圆临时键合及分离方法
JP6973476B2 (ja) * 2017-04-06 2021-12-01 大日本印刷株式会社 ポリイミドフィルム、積層体、及びディスプレイ用表面材
WO2018190179A1 (ja) * 2017-04-10 2018-10-18 大日本印刷株式会社 ポリイミドフィルム、積層体、及びディスプレイ用表面材

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52108496A (en) * 1976-03-09 1977-09-10 Showa Electric Wire & Cable Co Ltd Preparation of polyimide resins
JPS6384117A (ja) * 1986-09-29 1988-04-14 Fuji Xerox Co Ltd ポリイミド樹脂のエツチング方法
JPH0314294A (ja) * 1989-06-13 1991-01-22 Hitachi Ltd ポリイミド樹脂膜のパターン形成方法
JPH05214101A (ja) * 1992-02-06 1993-08-24 Hitachi Ltd 熱可塑型ポリエステルイミドとそれを用いた電子部品および電子装置
US5362550A (en) * 1992-02-19 1994-11-08 Fujitsu Limited Thin film circuit board and its manufacturing process
JPH09169088A (ja) * 1995-12-20 1997-06-30 Kanegafuchi Chem Ind Co Ltd 接着性絶縁フィルム及びその製造方法
US5668247A (en) * 1992-12-16 1997-09-16 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Thermoplastic polyimide, polyamide acid, and thermally fusible laminated film for covering conductive wires
JP2000123512A (ja) * 1998-10-20 2000-04-28 Ube Ind Ltd 磁気ヘッドサスペンションおよびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2040994A1 (en) * 1990-05-08 1991-11-09 David D. Ngo Photoimageable polyimide coating
JP3451401B2 (ja) * 1992-12-16 2003-09-29 鐘淵化学工業株式会社 超電導線材被覆用熱融着性積層フィルム
EP0663417B1 (en) * 1993-08-03 2000-03-29 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Polyimide laminate comprising thermoplastic polyimide polymer or thermoplastic polyimide film, and process for producing the laminate
KR100465047B1 (ko) * 1996-08-19 2005-01-13 신닛테츠가가쿠 가부시키가이샤 Ｈｄｄ 서스펜션용 적층체 및 그의 제조 방법
US6218022B1 (en) 1996-09-20 2001-04-17 Toray Engineering Co., Ltd. Resin etching solution and process for etching polyimide resins
JP3722610B2 (ja) 1998-01-14 2005-11-30 株式会社リコー 半導体装置の製造方法
US6103456A (en) * 1998-07-22 2000-08-15 Siemens Aktiengesellschaft Prevention of photoresist poisoning from dielectric antireflective coating in semiconductor fabrication

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52108496A (en) * 1976-03-09 1977-09-10 Showa Electric Wire & Cable Co Ltd Preparation of polyimide resins
JPS6384117A (ja) * 1986-09-29 1988-04-14 Fuji Xerox Co Ltd ポリイミド樹脂のエツチング方法
JPH0314294A (ja) * 1989-06-13 1991-01-22 Hitachi Ltd ポリイミド樹脂膜のパターン形成方法
JPH05214101A (ja) * 1992-02-06 1993-08-24 Hitachi Ltd 熱可塑型ポリエステルイミドとそれを用いた電子部品および電子装置
US5362550A (en) * 1992-02-19 1994-11-08 Fujitsu Limited Thin film circuit board and its manufacturing process
US5668247A (en) * 1992-12-16 1997-09-16 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Thermoplastic polyimide, polyamide acid, and thermally fusible laminated film for covering conductive wires
JPH09169088A (ja) * 1995-12-20 1997-06-30 Kanegafuchi Chem Ind Co Ltd 接着性絶縁フィルム及びその製造方法
JP2000123512A (ja) * 1998-10-20 2000-04-28 Ube Ind Ltd 磁気ヘッドサスペンションおよびその製造方法

Also Published As

Publication number Publication date
US8252423B2 (en) 2012-08-28
CN1388975A (zh) 2003-01-01
TWI293045B (zh) 2008-02-01
CN101143500B (zh) 2012-02-29
JP5318314B2 (ja) 2013-10-16
KR100817345B1 (ko) 2008-03-26
US20040043232A1 (en) 2004-03-04
TWI293467B (zh) 2008-02-11
TW200519973A (en) 2005-06-16
KR100795617B1 (ko) 2008-01-17
KR20020025989A (ko) 2002-04-04
TW200518118A (en) 2005-06-01
CN101143500A (zh) 2008-03-19
AU7458201A (en) 2002-01-02
JP5278578B2 (ja) 2013-09-04
TWI293177B (zh) 2008-02-01
DE10192864T1 (de) 2002-09-19
TWI293044B (zh) 2008-02-01
WO2001099124A1 (fr) 2001-12-27
CN100350517C (zh) 2007-11-21
TW200427583A (en) 2004-12-16
KR20070007212A (ko) 2007-01-12
US20110076855A1 (en) 2011-03-31
JP2012210813A (ja) 2012-11-01

Similar Documents

Publication Publication Date Title
SG148026A1 (en) Laminate and use thereof
CA2399614A1 (en) Flexible reflective insulating structures
WO2004082925A3 (en) Slider having improved resistance to erosion and wear
WO2005065517A3 (en) Highly textured non-woven composite wipe
CA2435657A1 (en) Decorative laminate assembly and method of producing same
DE60126636D1 (de) Geprägte Papierbahn
AU2001233788A1 (en) Laminated multi-layer card with an inlaid security element in the form of relief structures
CA2220444A1 (en) Multilayer film structures for use in the production of banknotes or the like
EP1413350A4 (en) MULTILAYER, MICROPOROUS FILM
NZ509857A (en) Dispensing article with cell layer having water soluble film contained between exterior layers, one of which is apertured
MXPA03005810A (es) Deslaminacion controlada de estructuras laminadas que tienen encerradas regiones discretas de un material.
AU2001287001A1 (en) Multi-layer and laminate fabric systems
DE3776929D1 (de) Zusammengesetztes laminat mit oberschicht aus naturstein.
WO2004055257A3 (en) Mica sheet and tape
TW200735742A (en) Multilayered wiring board and method for fabricating the same
CA2423363A1 (en) Connector assembly for insulated concrete walls
WO2004062966A3 (en) Molded lightweight foam acoustical barrier and its method of application
EP1375135A3 (en) Laminated structures constructed from adhesively joined sheet material layers
WO2007027404A3 (en) Panel containing bamboo
DE50207785D1 (de) Projektionsschirm aus einem verbundglas
WO2001096488A3 (en) Adhesive compositions and constructions with improved cutting performance
CA2393908A1 (en) Foam sign
USD464017S1 (en) Top of a glove box for a personal watercraft
AU2002231233A1 (en) Water repellant meltblown webs and laminates
EP1273437A4 (en) LAMINATE FILM AND LAMINATE