SG147390A1 - Semiconductor device package to improve functions of heat sink and ground shield - Google Patents
Semiconductor device package to improve functions of heat sink and ground shieldInfo
- Publication number
- SG147390A1 SG147390A1 SG200802977-9A SG2008029779A SG147390A1 SG 147390 A1 SG147390 A1 SG 147390A1 SG 2008029779 A SG2008029779 A SG 2008029779A SG 147390 A1 SG147390 A1 SG 147390A1
- Authority
- SG
- Singapore
- Prior art keywords
- package
- semiconductor device
- heat sink
- device package
- ground shield
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/736,461 US20080258293A1 (en) | 2007-04-17 | 2007-04-17 | Semiconductor device package to improve functions of heat sink and ground shield |
Publications (1)
Publication Number | Publication Date |
---|---|
SG147390A1 true SG147390A1 (en) | 2008-11-28 |
Family
ID=39809828
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200802977-9A SG147390A1 (en) | 2007-04-17 | 2008-04-17 | Semiconductor device package to improve functions of heat sink and ground shield |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080258293A1 (zh) |
JP (1) | JP2008270810A (zh) |
KR (1) | KR20080093909A (zh) |
CN (1) | CN101295683A (zh) |
DE (1) | DE102008019336A1 (zh) |
SG (1) | SG147390A1 (zh) |
TW (1) | TW200843055A (zh) |
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JP5091456B2 (ja) * | 2006-10-31 | 2012-12-05 | 株式会社村上開明堂 | ドアミラー |
TWI360207B (en) | 2007-10-22 | 2012-03-11 | Advanced Semiconductor Eng | Chip package structure and method of manufacturing |
TWI453877B (zh) * | 2008-11-07 | 2014-09-21 | Advanced Semiconductor Eng | 內埋晶片封裝的結構及製程 |
US7989950B2 (en) | 2008-08-14 | 2011-08-02 | Stats Chippac Ltd. | Integrated circuit packaging system having a cavity |
US8106504B2 (en) * | 2008-09-25 | 2012-01-31 | King Dragon International Inc. | Stacking package structure with chip embedded inside and die having through silicon via and method of the same |
CN101777542B (zh) * | 2009-01-14 | 2011-08-17 | 南茂科技股份有限公司 | 芯片封装构造以及封装方法 |
US8084858B2 (en) * | 2009-04-15 | 2011-12-27 | International Business Machines Corporation | Metal wiring structures for uniform current density in C4 balls |
US8693518B2 (en) * | 2009-09-09 | 2014-04-08 | Merkle International Inc. | High temperature industrial furnace roof system |
US8569894B2 (en) | 2010-01-13 | 2013-10-29 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
US8320134B2 (en) | 2010-02-05 | 2012-11-27 | Advanced Semiconductor Engineering, Inc. | Embedded component substrate and manufacturing methods thereof |
US8310050B2 (en) | 2010-02-10 | 2012-11-13 | Wei-Ming Chen | Electronic device package and fabrication method thereof |
CN102148221B (zh) * | 2010-02-10 | 2013-04-24 | 精材科技股份有限公司 | 电子元件封装体及其制造方法 |
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CN101937885B (zh) * | 2010-08-12 | 2013-03-20 | 日月光半导体制造股份有限公司 | 半导体封装件及其制造方法 |
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US7247932B1 (en) * | 2000-05-19 | 2007-07-24 | Megica Corporation | Chip package with capacitor |
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-
2007
- 2007-04-17 US US11/736,461 patent/US20080258293A1/en not_active Abandoned
- 2007-12-18 TW TW096148523A patent/TW200843055A/zh unknown
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2008
- 2008-04-16 DE DE102008019336A patent/DE102008019336A1/de not_active Withdrawn
- 2008-04-17 JP JP2008107597A patent/JP2008270810A/ja not_active Withdrawn
- 2008-04-17 CN CNA200810092255XA patent/CN101295683A/zh active Pending
- 2008-04-17 KR KR1020080035516A patent/KR20080093909A/ko not_active Application Discontinuation
- 2008-04-17 SG SG200802977-9A patent/SG147390A1/en unknown
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JP2008270810A (ja) | 2008-11-06 |
KR20080093909A (ko) | 2008-10-22 |
US20080258293A1 (en) | 2008-10-23 |
CN101295683A (zh) | 2008-10-29 |
TW200843055A (en) | 2008-11-01 |
DE102008019336A1 (de) | 2008-11-06 |
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