SG146517A1 - Method of manufacturing bonded wafer - Google Patents

Method of manufacturing bonded wafer

Info

Publication number
SG146517A1
SG146517A1 SG200718646-3A SG2007186463A SG146517A1 SG 146517 A1 SG146517 A1 SG 146517A1 SG 2007186463 A SG2007186463 A SG 2007186463A SG 146517 A1 SG146517 A1 SG 146517A1
Authority
SG
Singapore
Prior art keywords
bonded wafer
manufacturing
silicon wafers
manufacturing bonded
wafer
Prior art date
Application number
SG200718646-3A
Other languages
English (en)
Inventor
Nobuyuki Morimoto
Akihiko Endo
Original Assignee
Sumco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumco Corp filed Critical Sumco Corp
Publication of SG146517A1 publication Critical patent/SG146517A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76256—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques using silicon etch back techniques, e.g. BESOI, ELTRAN
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG200718646-3A 2007-03-14 2007-12-13 Method of manufacturing bonded wafer SG146517A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007064482A JP5433927B2 (ja) 2007-03-14 2007-03-14 貼り合わせウェーハの製造方法

Publications (1)

Publication Number Publication Date
SG146517A1 true SG146517A1 (en) 2008-10-30

Family

ID=39529749

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200718646-3A SG146517A1 (en) 2007-03-14 2007-12-13 Method of manufacturing bonded wafer

Country Status (6)

Country Link
US (1) US8802540B2 (ko)
EP (1) EP1970949B1 (ko)
JP (1) JP5433927B2 (ko)
KR (1) KR100935397B1 (ko)
CN (1) CN101266917B (ko)
SG (1) SG146517A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5664592B2 (ja) * 2012-04-26 2015-02-04 信越半導体株式会社 貼り合わせウェーハの製造方法
CN111962155B (zh) * 2020-08-06 2022-05-10 济南量子技术研究院 一种介质层辅助的厚片周期极化铁电晶体制备方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0719739B2 (ja) * 1990-09-10 1995-03-06 信越半導体株式会社 接合ウェーハの製造方法
JP3542376B2 (ja) 1994-04-08 2004-07-14 キヤノン株式会社 半導体基板の製造方法
US5603779A (en) * 1995-05-17 1997-02-18 Harris Corporation Bonded wafer and method of fabrication thereof
JP3611142B2 (ja) * 1995-08-29 2005-01-19 三菱住友シリコン株式会社 張り合わせウェーハおよびその製造方法
DE19780446T1 (de) * 1996-04-26 1998-10-01 Sumitomo Sitix Corp Bindungsverfahren für eine Silizium-Halbleiterplatte
JP3422225B2 (ja) 1997-07-08 2003-06-30 三菱住友シリコン株式会社 貼り合わせ半導体基板及びその製造方法
JPH11233476A (ja) * 1997-12-01 1999-08-27 Mitsubishi Electric Corp 半導体基板の処理方法
US6319331B1 (en) * 1997-12-01 2001-11-20 Mitsubishi Denki Kabushiki Kaisha Method for processing semiconductor substrate
FR2775119B1 (fr) * 1998-02-19 2000-04-07 France Telecom Procede pour limiter l'interdiffusion dans un dispositif semi-conducteur a grille composite si/si 1-x ge x, o inferieur a x inferieur ou egal a 1.
JP3385972B2 (ja) * 1998-07-10 2003-03-10 信越半導体株式会社 貼り合わせウェーハの製造方法および貼り合わせウェーハ
US6230720B1 (en) * 1999-08-16 2001-05-15 Memc Electronic Materials, Inc. Single-operation method of cleaning semiconductors after final polishing
US6902987B1 (en) * 2000-02-16 2005-06-07 Ziptronix, Inc. Method for low temperature bonding and bonded structure
US6492283B2 (en) * 2000-02-22 2002-12-10 Asm Microchemistry Oy Method of forming ultrathin oxide layer
CN1510755B (zh) * 2002-12-02 2010-08-25 大见忠弘 半导体器件及其制造方法
US7018909B2 (en) * 2003-02-28 2006-03-28 S.O.I.Tec Silicon On Insulator Technologies S.A. Forming structures that include a relaxed or pseudo-relaxed layer on a substrate
US7071077B2 (en) * 2003-03-26 2006-07-04 S.O.I.Tec Silicon On Insulator Technologies S.A. Method for preparing a bonding surface of a semiconductor layer of a wafer
JP4285244B2 (ja) 2004-01-08 2009-06-24 株式会社Ｓｕｍｃｏ Ｓｏｉウェーハの作製方法
JP2006080314A (ja) * 2004-09-09 2006-03-23 Canon Inc 結合基板の製造方法
US8138061B2 (en) * 2005-01-07 2012-03-20 International Business Machines Corporation Quasi-hydrophobic Si-Si wafer bonding using hydrophilic Si surfaces and dissolution of interfacial bonding oxide
JP2006278893A (ja) * 2005-03-30 2006-10-12 Toshiba Ceramics Co Ltd 貼り合わせウェーハの製造方法
JP4655797B2 (ja) * 2005-07-19 2011-03-23 信越半導体株式会社 直接接合ウエーハの製造方法
JP2007149723A (ja) * 2005-11-24 2007-06-14 Sumco Corp 貼り合わせウェーハの製造方法
JP4940737B2 (ja) * 2006-04-11 2012-05-30 株式会社Ｓｕｍｃｏ 少数キャリア拡散長測定方法およびシリコンウェーハの製造方法

Also Published As

Publication number Publication date
CN101266917B (zh) 2010-09-08
CN101266917A (zh) 2008-09-17
US20080227271A1 (en) 2008-09-18
EP1970949A3 (en) 2011-06-22
JP5433927B2 (ja) 2014-03-05
JP2008227207A (ja) 2008-09-25
US8802540B2 (en) 2014-08-12
EP1970949B1 (en) 2017-03-22
KR100935397B1 (ko) 2010-01-06
EP1970949A2 (en) 2008-09-17
KR20080084555A (ko) 2008-09-19

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