SG132495A1 - Nest for dicing, and method and apparatus for cutting tapeless substrate using the same - Google Patents
Nest for dicing, and method and apparatus for cutting tapeless substrate using the sameInfo
- Publication number
- SG132495A1 SG132495A1 SG200205233-0A SG2002052330A SG132495A1 SG 132495 A1 SG132495 A1 SG 132495A1 SG 2002052330 A SG2002052330 A SG 2002052330A SG 132495 A1 SG132495 A1 SG 132495A1
- Authority
- SG
- Singapore
- Prior art keywords
- nest
- substrate
- dicing
- cutting
- same
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Nonmetal Cutting Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7785098P | 1998-03-13 | 1998-03-13 | |
US09/156,961 US6165232A (en) | 1998-03-13 | 1998-09-18 | Method and apparatus for securely holding a substrate during dicing |
US09/156,593 US6187654B1 (en) | 1998-03-13 | 1998-09-18 | Techniques for maintaining alignment of cut dies during substrate dicing |
Publications (1)
Publication Number | Publication Date |
---|---|
SG132495A1 true SG132495A1 (en) | 2007-06-28 |
Family
ID=27373176
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200204921A SG102690A1 (en) | 1998-03-13 | 1999-03-05 | Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
SG200205233-0A SG132495A1 (en) | 1998-03-13 | 1999-03-05 | Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
SG9901289A SG84524A1 (en) | 1998-03-13 | 1999-03-05 | Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200204921A SG102690A1 (en) | 1998-03-13 | 1999-03-05 | Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9901289A SG84524A1 (en) | 1998-03-13 | 1999-03-05 | Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0942458B1 (de) |
JP (1) | JP3065070B2 (de) |
CN (1) | CN1154160C (de) |
AT (1) | ATE373872T1 (de) |
DE (1) | DE69937128T2 (de) |
SG (3) | SG102690A1 (de) |
TW (1) | TW391916B (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4388640B2 (ja) * | 1999-09-10 | 2009-12-24 | 株式会社ディスコ | Csp基板保持部材及び該csp基板保持部材が載置されるcsp基板用テーブル |
US6471525B1 (en) * | 2000-08-24 | 2002-10-29 | High Connection Density, Inc. | Shielded carrier for land grid array connectors and a process for fabricating same |
WO2002026441A1 (en) * | 2000-09-27 | 2002-04-04 | Strasbaugh, Inc. | Tool for applying resilient tape to chuck used for grinding or polishing wafers |
KR100441790B1 (ko) * | 2001-03-22 | 2004-07-27 | 에이에스엠 어쌤블리 오토메이션 리미티드 | 픽업 및 재치 장치와 그 방법 |
US7267037B2 (en) * | 2001-05-05 | 2007-09-11 | David Walter Smith | Bidirectional singulation saw and method |
JP4649067B2 (ja) * | 2001-06-22 | 2011-03-09 | アピックヤマダ株式会社 | ダイシング治具 |
JP4287090B2 (ja) * | 2002-01-15 | 2009-07-01 | Towa株式会社 | 樹脂封止済基板の切断用治具 |
JP4592289B2 (ja) * | 2004-01-07 | 2010-12-01 | 日東電工株式会社 | 半導体ウエハの不要物除去方法 |
JP4522243B2 (ja) * | 2004-12-01 | 2010-08-11 | 株式会社ディスコ | 高圧液噴射式切断装置 |
SG126801A1 (en) * | 2005-04-28 | 2006-11-29 | Rokko Systems Pte Ltd | Improved net block assembly |
GB2434913A (en) * | 2006-02-02 | 2007-08-08 | Xsil Technology Ltd | Support for wafer singulation |
SG136833A1 (en) * | 2006-05-02 | 2007-11-29 | Rokko Systems Pte Ltd | An improved net table |
US10746752B2 (en) | 2009-11-13 | 2020-08-18 | Ventana Medical Systems, Inc. | Opposables and automated specimen processing systems with opposables |
JP6050626B2 (ja) * | 2012-07-03 | 2016-12-21 | 株式会社ディスコ | 切削装置のチャックテーブル機構 |
AU2013370575B2 (en) * | 2012-12-26 | 2016-05-26 | Ventana Medical Systems, Inc. | Automated specimen processing systems and methods of aligning and transporting specimen-bearing microscope slides |
CN103086318B (zh) * | 2013-01-11 | 2015-05-13 | 烟台睿创微纳技术有限公司 | 一种mems硅晶圆片划片切割和结构释放方法 |
JP6312554B2 (ja) * | 2014-08-13 | 2018-04-18 | 株式会社ディスコ | パッケージ基板の加工方法 |
CN104409386B (zh) * | 2014-10-20 | 2018-05-15 | 上海技美电子科技有限公司 | 晶圆裂片装置 |
TWI560794B (en) * | 2015-04-23 | 2016-12-01 | Advanced Semiconductor Eng | Semiconductor element carrier, method for attaching a semiconductor element to a carrier, and semiconductor process |
CN106042019B (zh) * | 2016-05-19 | 2018-04-10 | 张帆 | 一种打印机墨盒的小海绵切割方法 |
JP6626413B2 (ja) * | 2016-06-29 | 2019-12-25 | 東京応化工業株式会社 | 支持体分離方法、および基板処理方法 |
JP6804154B2 (ja) * | 2017-03-09 | 2020-12-23 | 株式会社ディスコ | パッケージ基板の加工方法及び切削装置 |
CN107009265A (zh) * | 2017-03-28 | 2017-08-04 | 江苏京创先进电子科技有限公司 | 切割机真空吸盘工作台装置及其工作过程 |
JP7383220B2 (ja) * | 2019-07-02 | 2023-11-20 | Toppanホールディングス株式会社 | 基板断裁装置 |
KR102295435B1 (ko) * | 2020-03-12 | 2021-08-31 | 에이엠티 주식회사 | 미세 피치를 갖는 디바이스의 얼라인 및 테스트장치 그리고 디바이스의 얼라인방법 |
KR102535517B1 (ko) * | 2021-04-22 | 2023-05-26 | (주)샘테크 | 기판 분리 장치 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3809050A (en) * | 1971-01-13 | 1974-05-07 | Cogar Corp | Mounting block for semiconductor wafers |
US4004955A (en) * | 1973-05-24 | 1977-01-25 | General Motors Corporation | Positive selective nickel alignment system |
US4046985A (en) * | 1974-11-25 | 1977-09-06 | International Business Machines Corporation | Semiconductor wafer alignment apparatus |
US3976288A (en) * | 1975-11-24 | 1976-08-24 | Ibm Corporation | Semiconductor wafer dicing fixture |
US4296542A (en) * | 1980-07-11 | 1981-10-27 | Presco, Inc. | Control of small parts in a manufacturing operation |
US4600936A (en) * | 1983-07-12 | 1986-07-15 | International Business Machines Corporation | Chip registration mechanism |
US5618759A (en) * | 1995-05-31 | 1997-04-08 | Texas Instruments Incorporated | Methods of and apparatus for immobilizing semiconductor wafers during sawing thereof |
JP3496347B2 (ja) * | 1995-07-13 | 2004-02-09 | 株式会社デンソー | 半導体装置及びその製造方法 |
-
1999
- 1999-03-05 SG SG200204921A patent/SG102690A1/en unknown
- 1999-03-05 SG SG200205233-0A patent/SG132495A1/en unknown
- 1999-03-05 SG SG9901289A patent/SG84524A1/en unknown
- 1999-03-08 DE DE69937128T patent/DE69937128T2/de not_active Expired - Fee Related
- 1999-03-08 AT AT99301715T patent/ATE373872T1/de not_active IP Right Cessation
- 1999-03-08 EP EP99301715A patent/EP0942458B1/de not_active Expired - Lifetime
- 1999-03-10 JP JP11063220A patent/JP3065070B2/ja not_active Expired - Fee Related
- 1999-03-12 TW TW088103835A patent/TW391916B/zh not_active IP Right Cessation
- 1999-03-12 CN CNB991039912A patent/CN1154160C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3065070B2 (ja) | 2000-07-12 |
EP0942458A3 (de) | 2003-08-20 |
DE69937128D1 (de) | 2007-10-31 |
TW391916B (en) | 2000-06-01 |
JPH11330007A (ja) | 1999-11-30 |
SG102690A1 (en) | 2004-03-26 |
SG84524A1 (en) | 2001-11-20 |
CN1154160C (zh) | 2004-06-16 |
ATE373872T1 (de) | 2007-10-15 |
EP0942458A2 (de) | 1999-09-15 |
DE69937128T2 (de) | 2008-06-19 |
CN1229267A (zh) | 1999-09-22 |
EP0942458B1 (de) | 2007-09-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG132495A1 (en) | Nest for dicing, and method and apparatus for cutting tapeless substrate using the same | |
MY123280A (en) | Method and apparatus for securely holding a substrate during dicing. | |
EP0182218A3 (en) | Method for dicing semiconductor wafer | |
AU559159B2 (en) | Carrier film for dicing semiconductor wafers | |
AU5823399A (en) | An apparatus for holding a semiconductor wafer | |
EP0603514A3 (de) | Verfahren zur Verringerung der Dicke eines Halbleiterplättchens. | |
EP0157675A3 (en) | Spinning device for processing a substrate, in particular a semiconductor wafer | |
EP0711853A4 (de) | Verfahren zum züchten von galliumnitridhalbleiterkristallen und vorrichtung | |
GB2186117B (en) | Monolithically integrated semiconductor device containing bipolar junction,cmosand dmos transistors and low leakage diodes and a method for its fabrication | |
IL106711A0 (en) | Apparatus for providing consistent,non-jamming registration of semiconductor wafers | |
GB2198413B (en) | Transporting robot for semiconductor wafers | |
EP0186201A3 (en) | Semiconductor wafer dicing machine | |
EP0383215A3 (de) | Epitaxialstruktur für lichtemittierende Halbleiteranordnungen und lichtemittierende Halbleiteranordnung mit dieser Struktur | |
EP0681186A3 (de) | Verfahren zum Abstasten eines Halbleiterwafers. | |
EP0163413A3 (en) | Apparatus for transferring semi-conductor wafers | |
DE68914479T2 (de) | Randbelichtungsverfahren für Halbleiterscheiben. | |
EP0650181A3 (de) | Klammer mit Waferabwurf für Vorrichtungen zur Bearbeitung von Halbleiter-Wafer. | |
EP0984489A4 (de) | Verfahren und vorrichtung zum spaltung von halbleiterscheiben | |
FR2559953B1 (fr) | Mandrin de serrage pour plaquette semi-conductrice | |
EP0792955A3 (de) | Saphir Einkristall, seine Anwendung als Substrat in einem Halbleiterlaserdiode und Verfahren zu ihrer Herstellung | |
EP0673545A4 (de) | Verfahren und einrichtung zum ätzen von halbleiterwarfern. | |
TW200514188A (en) | Mounting device and mounting method | |
TW344093B (en) | Method for manufacturing completely circular semiconductor wafers | |
SG82654A1 (en) | Two-piece clamp ring for holding semiconductor wafer or other workpiece | |
KR880701459A (ko) | 실리콘 웨이퍼에 바이어스를 형성하기 위한 플래너공정 |