FR2559953B1 - Mandrin de serrage pour plaquette semi-conductrice - Google Patents

Mandrin de serrage pour plaquette semi-conductrice

Info

Publication number
FR2559953B1
FR2559953B1 FR8502253A FR8502253A FR2559953B1 FR 2559953 B1 FR2559953 B1 FR 2559953B1 FR 8502253 A FR8502253 A FR 8502253A FR 8502253 A FR8502253 A FR 8502253A FR 2559953 B1 FR2559953 B1 FR 2559953B1
Authority
FR
France
Prior art keywords
semiconductor wafer
tightening chuck
chuck
tightening
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8502253A
Other languages
English (en)
Other versions
FR2559953A1 (fr
Inventor
Morgan Jay Morley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GCA Corp
Original Assignee
GCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GCA Corp filed Critical GCA Corp
Publication of FR2559953A1 publication Critical patent/FR2559953A1/fr
Application granted granted Critical
Publication of FR2559953B1 publication Critical patent/FR2559953B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/11—Vacuum
FR8502253A 1984-02-17 1985-02-15 Mandrin de serrage pour plaquette semi-conductrice Expired FR2559953B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/581,058 US4603466A (en) 1984-02-17 1984-02-17 Wafer chuck

Publications (2)

Publication Number Publication Date
FR2559953A1 FR2559953A1 (fr) 1985-08-23
FR2559953B1 true FR2559953B1 (fr) 1988-12-09

Family

ID=24323734

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8502253A Expired FR2559953B1 (fr) 1984-02-17 1985-02-15 Mandrin de serrage pour plaquette semi-conductrice

Country Status (5)

Country Link
US (1) US4603466A (fr)
JP (1) JPS60239039A (fr)
DE (1) DE3505178C2 (fr)
FR (1) FR2559953B1 (fr)
GB (1) GB2154793A (fr)

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US5609148A (en) * 1995-03-31 1997-03-11 Siemens Aktiengesellschaft Method and apparatus for dicing semiconductor wafers
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US5936829A (en) * 1997-01-02 1999-08-10 Cvc Products, Inc. Thermally conductive chuck for vacuum processor
US5856906A (en) * 1997-05-12 1999-01-05 Applied Materials, Inc. Backside gas quick dump apparatus for a semiconductor wafer processing system
TW524873B (en) 1997-07-11 2003-03-21 Applied Materials Inc Improved substrate supporting apparatus and processing chamber
JPH1174164A (ja) 1997-08-27 1999-03-16 Canon Inc 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法
US6138745A (en) 1997-09-26 2000-10-31 Cvc Products, Inc. Two-stage sealing system for thermally conductive chuck
US6205870B1 (en) 1997-10-10 2001-03-27 Applied Komatsu Technology, Inc. Automated substrate processing systems and methods
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US5948986A (en) * 1997-12-26 1999-09-07 Applied Materials, Inc. Monitoring of wafer presence and position in semiconductor processing operations
US6168697B1 (en) * 1998-03-10 2001-01-02 Trusi Technologies Llc Holders suitable to hold articles during processing and article processing methods
US6095582A (en) * 1998-03-11 2000-08-01 Trusi Technologies, Llc Article holders and holding methods
US6030275A (en) * 1998-03-17 2000-02-29 International Business Machines Corporation Variable control of carrier curvature with direct feedback loop
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TWI272689B (en) * 2001-02-16 2007-02-01 Tokyo Electron Ltd Method and apparatus for transferring heat from a substrate to a chuck
US6628503B2 (en) 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
US6709721B2 (en) 2001-03-28 2004-03-23 Applied Materials Inc. Purge heater design and process development for the improvement of low k film properties
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US7055229B2 (en) * 2003-12-31 2006-06-06 Intel Corporation Support system for semiconductor wafers and methods thereof
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DE102009005182A1 (de) * 2009-01-15 2010-07-29 Suss Microtec Test Systems Gmbh Chuck und Verfahren zur Aufnahme und Halterung dünner Testsubstrate
US10611608B2 (en) 2014-04-28 2020-04-07 Liftra Ip Aps Method and device for automatic control of the position of a burden suspended in a main wire on a crane
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Also Published As

Publication number Publication date
GB2154793A (en) 1985-09-11
GB8503509D0 (en) 1985-03-13
FR2559953A1 (fr) 1985-08-23
JPH0543185B2 (fr) 1993-06-30
DE3505178C2 (de) 1994-09-29
JPS60239039A (ja) 1985-11-27
US4603466A (en) 1986-08-05
DE3505178A1 (de) 1985-08-22

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Legal Events

Date Code Title Description
ST Notification of lapse