JP4522243B2 - 高圧液噴射式切断装置 - Google Patents
高圧液噴射式切断装置 Download PDFInfo
- Publication number
- JP4522243B2 JP4522243B2 JP2004349022A JP2004349022A JP4522243B2 JP 4522243 B2 JP4522243 B2 JP 4522243B2 JP 2004349022 A JP2004349022 A JP 2004349022A JP 2004349022 A JP2004349022 A JP 2004349022A JP 4522243 B2 JP4522243 B2 JP 4522243B2
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- Prior art keywords
- cutting
- substrate
- cut
- channel
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005520 cutting process Methods 0.000 title claims description 302
- 239000007788 liquid Substances 0.000 title claims description 52
- 238000002347 injection Methods 0.000 claims description 67
- 239000007924 injection Substances 0.000 claims description 67
- 238000009751 slip forming Methods 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 description 194
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 150
- 239000004065 semiconductor Substances 0.000 description 28
- 238000000034 method Methods 0.000 description 27
- 238000000926 separation method Methods 0.000 description 24
- 239000007921 spray Substances 0.000 description 21
- 239000000853 adhesive Substances 0.000 description 19
- 230000001070 adhesive effect Effects 0.000 description 19
- 239000003082 abrasive agent Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 13
- 238000011084 recovery Methods 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 239000002390 adhesive tape Substances 0.000 description 9
- 238000003860 storage Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- -1 vinyl chloride Chemical compound 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Images
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Description
まず,図1に基づいて,本実施形態に係るウォータージェット切断装置の概要について説明する。なお,図1は,本実施形態に係るウォータージェット切断装置10の構成を概略的に示す説明図である。
12 高圧水発生装置
14 研磨材混合装置
15 噴射停止装置
16 噴射ノズル
18 保持テーブル
20 基板
22 金属フレーム
24 パッケージ部分
24−1,24−2,24−3 回路領域
30 支持部材
32 突起部
34 貫通溝
40 テーブル移動装置
42 キャッチタンク
44 研磨材回収装置
50 切断溝
168 ウォータージェット
182 テーブル窓
184 分離保持部材
C 半導体チップ
Lx 第1切断ライン
Ly 第2切断ライン
CH1 第1チャンネル
CH2 第2チャンネル
Claims (3)
- 高圧液噴射手段から噴射される高圧液によって,被切断物の第1チャンネルおよび第2チャンネルを切断することにより,前記被切断物を複数のチップに分割する高圧液噴射式切断装置において:
前記第1チャンネルの切断により前記被切断物に形成された切断溝に係合する突起部が設けられた板状の支持部材を備え,前記突起部を前記切断溝に係合させて前記第1チャンネルが切断された前記被切断物を前記支持部材で支持しながら,高圧液を噴射することにより,前記第2チャンネルを切断することを特徴とする,高圧液噴射式切断装置。 - 前記支持部材は,前記第2チャンネルの一筆書き切断に対応する位置に連続形成された貫通溝を有することを特徴とする,請求項1に記載の高圧液噴射式切断装置。
- 前記第1チャンネルの切断では,
前記高圧液噴射手段によって前記第1チャンネルを構成する複数の切断ラインに沿って高圧液を噴射しながら前記複数の切断ラインを切断し,
隣り合う切断ライン間では,前記被切断物を切断することなく,前記高圧液噴射手段と前記被切断物とを相対移動させることにより,
前記被切断物に略平行に並んだ複数の前記切断溝を形成することを特徴とする,請求項1または2に記載の高圧液噴射式切断装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004349022A JP4522243B2 (ja) | 2004-12-01 | 2004-12-01 | 高圧液噴射式切断装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004349022A JP4522243B2 (ja) | 2004-12-01 | 2004-12-01 | 高圧液噴射式切断装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006150569A JP2006150569A (ja) | 2006-06-15 |
JP4522243B2 true JP4522243B2 (ja) | 2010-08-11 |
Family
ID=36629448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004349022A Active JP4522243B2 (ja) | 2004-12-01 | 2004-12-01 | 高圧液噴射式切断装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4522243B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4885751B2 (ja) * | 2007-01-29 | 2012-02-29 | 広島県 | ウォータージェットによる溝加工方法、熱交換器部材および熱交換器 |
KR101915383B1 (ko) | 2017-02-15 | 2018-11-05 | 인제대학교 산학협력단 | 웨이퍼 흠집용 가이드라인이 형성된 틀 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01121700U (ja) * | 1988-02-15 | 1989-08-17 | ||
JP2005539381A (ja) * | 2002-09-13 | 2005-12-22 | トーワ−インターコン・テクノロジー・インコーポレーテッド | 基板のジェット個別切断 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG132495A1 (en) * | 1998-03-13 | 2007-06-28 | Towa Corp | Nest for dicing, and method and apparatus for cutting tapeless substrate using the same |
-
2004
- 2004-12-01 JP JP2004349022A patent/JP4522243B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01121700U (ja) * | 1988-02-15 | 1989-08-17 | ||
JP2005539381A (ja) * | 2002-09-13 | 2005-12-22 | トーワ−インターコン・テクノロジー・インコーポレーテッド | 基板のジェット個別切断 |
Also Published As
Publication number | Publication date |
---|---|
JP2006150569A (ja) | 2006-06-15 |
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