JP4429044B2 - 高圧液噴射式切断装置 - Google Patents
高圧液噴射式切断装置 Download PDFInfo
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- JP4429044B2 JP4429044B2 JP2004065600A JP2004065600A JP4429044B2 JP 4429044 B2 JP4429044 B2 JP 4429044B2 JP 2004065600 A JP2004065600 A JP 2004065600A JP 2004065600 A JP2004065600 A JP 2004065600A JP 4429044 B2 JP4429044 B2 JP 4429044B2
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- Prior art keywords
- abrasive
- water
- catch tank
- pressure liquid
- absorbing member
- Prior art date
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- 238000005520 cutting process Methods 0.000 title claims description 79
- 239000007788 liquid Substances 0.000 title claims description 75
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- 239000007924 injection Substances 0.000 claims description 66
- 238000007599 discharging Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 214
- 230000035939 shock Effects 0.000 description 41
- 238000004064 recycling Methods 0.000 description 40
- 239000003082 abrasive agent Substances 0.000 description 26
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002223 garnet Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
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- 239000002904 solvent Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000011359 shock absorbing material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
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- 229920003002 synthetic resin Polymers 0.000 description 1
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- 239000008399 tap water Substances 0.000 description 1
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Description
以下に,本発明の第1の実施形態にかかるキャッチタンクおよびこれを備えた高圧液噴射式切断装置について説明する。なお,本実施形態にかかる高圧液噴射式切断装置は,例えば,以下に説明するように,研磨材が混入された高圧水の噴流(アブレシブジェット)によって被切断物を切断するウォータージェット切断装置として構成されているが,本発明はかかる例に限定されるものではない。
12 : 高圧水発生装置
14 : 研磨材混合装置
16 : 噴射ノズル
18 : 保持テーブル
20 : 被切断物
22 : テーブル移動装置
30 : キャッチタンク
40 : 研磨材回収装置
60 : 衝撃吸収部材
62 : 係止突起
64 : 爪部
70 : 水位測定センサ
168 : ウォータージェット
302 : 第1傾斜面
304 : 第2傾斜面
306 : 仕切り版
322 : オーバーフロー用排水口
342 : 給水口
362 : 研磨材リサイクル用排水口
A : 堆積した研磨材(研磨材溜まり)
W : 貯留水
Claims (6)
- 高圧液の噴射によって被切断物を切断する高圧液噴射式切断装置であって:
前記被切断物を保持する保持手段と;
前記保持手段によって保持された前記被切断物に対し,研磨材入りの高圧液を噴射する高圧液噴射手段と;
前記高圧液噴射手段から噴射され前記被切断物を貫通した高圧液噴流を受け止めるキャッチタンクと;
を備え,
前記キャッチタンク内には,液体が貯留されており,
前記キャッチタンク内の底部には,前記液体中に前記研磨材が堆積しており,前記高圧液噴流の衝撃を吸収する衝撃吸収部材が,前記堆積した研磨材に埋没するように設けられていることを特徴とする,高圧液噴射式切断装置。 - 前記キャッチタンクの一側面には,前記研磨材を前記液体とともに排出するための研磨材排出口が設けられていることを特徴とする,請求項1に記載の高圧液噴射式切断装置。
- 前記キャッチタンク内の底面は,前記研磨材が前記研磨材排出口側に偏って堆積するような形状を有することを特徴とする,請求項2に記載の高圧液噴射式切断装置。
- 前記キャッチタンク内の底面は,前記研磨材排出口側に向かって下る傾斜面を含み,
前記傾斜面の面積は,前記キャッチタンク内の底面積の少なくとも半分以上を占めることを特徴とする,請求項3に記載の高圧液噴射式切断装置。 - 前記衝撃吸収部材は,前記高圧液噴流が前記液体と衝突することによって生じた前記液体の流れを反射させて前記研磨材排出口に向かわせるような向き及び角度で配設されることを特徴とする,請求項2,3または4のいずれかに記載の高圧液噴射式切断装置。
- 前記高圧液噴射手段および前記キャッチタンクの位置を固定した状態で,前記保持手段を移動させることによって,前記被切断物の切断箇所を変更することを特徴とする,請求項1,2,3,4または5のいずれかに記載の高圧液噴射式切断装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004065600A JP4429044B2 (ja) | 2004-03-09 | 2004-03-09 | 高圧液噴射式切断装置 |
US11/071,109 US7052378B2 (en) | 2004-03-09 | 2005-03-04 | Liquid jet machining apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004065600A JP4429044B2 (ja) | 2004-03-09 | 2004-03-09 | 高圧液噴射式切断装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005254346A JP2005254346A (ja) | 2005-09-22 |
JP4429044B2 true JP4429044B2 (ja) | 2010-03-10 |
Family
ID=35080580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004065600A Expired - Lifetime JP4429044B2 (ja) | 2004-03-09 | 2004-03-09 | 高圧液噴射式切断装置 |
Country Status (1)
Country | Link |
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JP (1) | JP4429044B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5016317B2 (ja) * | 2007-02-02 | 2012-09-05 | 株式会社ディスコ | ウォータージェット加工装置 |
JP2010253610A (ja) * | 2009-04-24 | 2010-11-11 | Disco Abrasive Syst Ltd | ウォータジェット加工装置 |
KR101512567B1 (ko) * | 2013-12-13 | 2015-04-15 | 안준홍 | ? 블라스팅 장치 |
-
2004
- 2004-03-09 JP JP2004065600A patent/JP4429044B2/ja not_active Expired - Lifetime
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JP2005254346A (ja) | 2005-09-22 |
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