JP4700437B2 - 高圧液噴射式切断装置 - Google Patents
高圧液噴射式切断装置 Download PDFInfo
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- JP4700437B2 JP4700437B2 JP2005235481A JP2005235481A JP4700437B2 JP 4700437 B2 JP4700437 B2 JP 4700437B2 JP 2005235481 A JP2005235481 A JP 2005235481A JP 2005235481 A JP2005235481 A JP 2005235481A JP 4700437 B2 JP4700437 B2 JP 4700437B2
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- Prior art keywords
- abrasive
- tank
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- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000007788 liquid Substances 0.000 title claims description 70
- 238000005520 cutting process Methods 0.000 title claims description 61
- 239000002245 particle Substances 0.000 claims description 76
- 239000003082 abrasive agent Substances 0.000 claims description 59
- 239000000203 mixture Substances 0.000 claims description 53
- 238000011084 recovery Methods 0.000 claims description 50
- 238000003860 storage Methods 0.000 claims description 35
- 238000002347 injection Methods 0.000 claims description 18
- 239000007924 injection Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 17
- 238000005498 polishing Methods 0.000 claims description 12
- 239000007921 spray Substances 0.000 claims description 6
- 238000004062 sedimentation Methods 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 96
- 239000000758 substrate Substances 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 4
- 238000000638 solvent extraction Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
- B24C9/006—Treatment of used abrasive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
- B24C1/045—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass for cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Description
以下に,本発明の第1の実施形態にかかる高圧液噴射式切断装置について説明する。なお,本実施形態にかかる高圧液噴射式切断装置は,例えば,以下に説明するように,研磨材が混入された高圧水の噴流(アブレシブジェット)によって被加工物を切断するウォータージェット切断装置として構成されているが,本発明はかかる例に限定されるものではない。
5 : 被加工物
10 : 高圧液供給手段
15 : 高圧ポンプ
20 : 研磨材混合手段
22 : 研磨材混合液貯留タンク
30 : 噴射ノズル
40 : 保持テーブル
50 : キャッチタンク
60 : 研磨材回収手段
70 : 研磨材選別タンク
71 : 筐体
72 : バッファタンク
73 : 第1の選別部材
74 : 第2の選別部材
75 : 液面測定センサ
91 : 流入口
92 : 流出口
93 : 第2の排出口
94 : 第1の排出口
95 : 第3の排出口
80 : 回収研磨材貯留タンク
J : ウォータージェット
Claims (3)
- 研磨材と液体とが混合された研磨材混合液を貯留する研磨材混合液貯留タンクと;
前記研磨材混合液貯留タンクに高圧液を供給することによって,前記研磨材混合液貯留タンクに貯留されている研磨材混合液を高圧で送出する高圧液供給手段と;
前記研磨材混合液貯留タンクから送出された高圧の研磨材混合液を,被加工物に対して噴射する噴射ノズルと;
前記噴射ノズルから噴射された高圧の研磨材混合液を受け止めるキャッチタンクと;
前記キャッチタンクから移送された研磨材混合液から,再利用可能な所定範囲の粒径の研磨材を回収し,前記回収された研磨材を含む研磨材混合液を前記研磨材混合液貯留タンクに移送する研磨材回収手段と;
を備え,
前記噴射ノズルから噴射された高圧の研磨材混合液によって前記被加工物を切断する高圧液噴射式切断装置において:
前記研磨材回収手段は,
前記キャッチタンクから移送された研磨材混合液を水平方向に流動させて,研磨材の粒径の大きさによって生じる沈降速度の差を利用して,研磨材の粒径に応じて研磨材を選別し,前記再利用可能な所定範囲の粒径の研磨材を回収する研磨材選別タンクを備え,
前記研磨材選別タンクは,
前記研磨材選別タンクの一側上部に設けられた流入口と;
前記研磨材選別タンクの他側上部に設けられた流出口と;
前記研磨材選別タンクの底部における前記流入口側に配設され,前記研磨材選別タンクの底部を分割する仕切部材である第1の選別部材と;
前記研磨材選別タンクの底部における前記流出口側に配設され,前記研磨材選別タンクの底部を分割する仕切部材である第2の選別部材と;
前記研磨材選別タンクの底部における前記第1の選別部材と前記第2の選別部材との間に配設された第1の排出口と;
を有し,
前記キャッチタンクから移送された研磨材混合液が,前記流入口から前記流出口に向けて水平方向に流動する際に,
当該研磨材混合液に含まれる前記再利用可能な所定範囲の上限より粒径が大きい研磨材を前記第1の選別部材よりも前記流入口側に沈降させ,前記再利用可能な所定範囲の粒径の研磨材を前記第1の選別部材と前記第2の選別部材との間に沈降させ,前記再利用可能な所定範囲の下限より粒径が小さい研磨材を前記第2の選別部材よりも前記流出口側に沈降させ,
前記第1の排出口から,前記再利用可能な所定範囲の粒径の研磨材を排出して回収することを特徴とする,請求項1に記載の高圧液噴射式切断装置。 - 前記第1の選別部材と前記第2の選別部材の高さは変更可能であることを特徴とする,請求項2に記載の高圧液噴射式切断装置。
- 前記研磨材選別タンクは,
前記研磨材選別タンクの底部における前記第1の選別部材よりも前記流入口側に配設された第2の排出口と;
前記研磨材選別タンクの底部における前記第2の選別部材よりも前記流出口側に配設された第3の排出口と;
をさらに備え,
前記第2の排出口から前記再利用可能な所定範囲の上限より粒径が大きい研磨材を排出し,前記第3の排出口から前記再利用可能な所定範囲の下限より粒径が小さい研磨材を排出することを特徴とする,請求項1または2に記載の高圧液噴射式切断装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005235481A JP4700437B2 (ja) | 2005-08-15 | 2005-08-15 | 高圧液噴射式切断装置 |
US11/504,042 US20070037495A1 (en) | 2005-08-15 | 2006-08-15 | Abrasive water jet cutting machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005235481A JP4700437B2 (ja) | 2005-08-15 | 2005-08-15 | 高圧液噴射式切断装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007050455A JP2007050455A (ja) | 2007-03-01 |
JP4700437B2 true JP4700437B2 (ja) | 2011-06-15 |
Family
ID=37743131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005235481A Active JP4700437B2 (ja) | 2005-08-15 | 2005-08-15 | 高圧液噴射式切断装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070037495A1 (ja) |
JP (1) | JP4700437B2 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009125830A (ja) * | 2007-11-21 | 2009-06-11 | Towa Corp | 加工水の供給装置及び供給方法 |
KR100943313B1 (ko) * | 2008-04-22 | 2010-02-19 | (주)일신오토클레이브 | 로드셀이 구비된 압력용기를 갖는 워터젯 분사장치 세트 및압력용기 내의 연마제 잔존량 측정 방법 |
JP2010184318A (ja) * | 2009-02-12 | 2010-08-26 | Disco Abrasive Syst Ltd | ウォータージェット加工装置 |
KR101081335B1 (ko) | 2009-05-14 | 2011-11-10 | (주)일신오토클레이브 | 인젝션 믹싱 타입 워터젯 분사장치의 연마재 재순환 시스템 |
US9586306B2 (en) | 2012-08-13 | 2017-03-07 | Omax Corporation | Method and apparatus for monitoring particle laden pneumatic abrasive flow in an abrasive fluid jet cutting system |
JP2014065128A (ja) * | 2012-09-26 | 2014-04-17 | Sugino Machine Ltd | アブレシブウォータージェット加工装置及び加工方法 |
WO2014062050A1 (en) * | 2012-10-19 | 2014-04-24 | Engit Solutions | Water jet cutter |
US9649744B2 (en) * | 2013-07-30 | 2017-05-16 | Omax Corporation | Reducing small colloidal particle concentrations in feed and/or byproduct fluids in the context of waterjet processing |
ITUB20154174A1 (it) * | 2015-10-06 | 2017-04-06 | Nova S R L | Apparecchiatura e metodo per il recupero di materiale di scarto in particolare per macchine di taglio a getto d'acqua |
WO2017193026A1 (en) * | 2016-05-05 | 2017-11-09 | Wazer Inc. | Waterjet systems and methods |
US10471623B2 (en) * | 2016-10-18 | 2019-11-12 | Hmcc Acquireco2, Llc | Waterjet cutting system with variable liquid level |
US11577366B2 (en) | 2016-12-12 | 2023-02-14 | Omax Corporation | Recirculation of wet abrasive material in abrasive waterjet systems and related technology |
KR102450780B1 (ko) * | 2017-03-31 | 2022-10-04 | 안트 어플라이드 뉴 테크놀로지스 아게 | 물-연마제 현탁액 절단 시스템 및 물-연마제 현탁액 절단 방법 |
US11224987B1 (en) | 2018-03-09 | 2022-01-18 | Omax Corporation | Abrasive-collecting container of a waterjet system and related technology |
US20210046610A1 (en) * | 2019-07-29 | 2021-02-18 | Omax Corporation | Measuring abrasive flow rates in a conduit |
WO2021202390A1 (en) | 2020-03-30 | 2021-10-07 | Hypertherm, Inc. | Cylinder for a liquid jet pump with multi-functional interfacing longitudinal ends |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001079443A (ja) * | 1999-09-14 | 2001-03-27 | Toyama Prefecture | ウォータージェット切断排砂の分級回収装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3455062A (en) * | 1967-01-19 | 1969-07-15 | Arthur H Eppler | Abrasive blast system with closed circuit rinse |
KR930008692B1 (ko) * | 1986-02-20 | 1993-09-13 | 가와사끼 쥬고교 가부시기가이샤 | 어브레시브 워터 제트 절단방법 및 장치 |
JPS6316999A (ja) * | 1986-07-08 | 1988-01-23 | 川崎重工業株式会社 | アブレツシブウオ−タジエツト切断装置 |
JPH0624697B2 (ja) * | 1989-01-20 | 1994-04-06 | 修二 池田 | 石材研削装置 |
JP2651559B2 (ja) * | 1993-11-26 | 1997-09-10 | 株式会社荏原製作所 | ウォータジェット加工装置の廃液処理装置 |
FI20010628A (fi) * | 2001-03-27 | 2002-09-28 | Evac Int Oy | Laitteisto jäteaineen puhdistamiseksi |
-
2005
- 2005-08-15 JP JP2005235481A patent/JP4700437B2/ja active Active
-
2006
- 2006-08-15 US US11/504,042 patent/US20070037495A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001079443A (ja) * | 1999-09-14 | 2001-03-27 | Toyama Prefecture | ウォータージェット切断排砂の分級回収装置 |
Also Published As
Publication number | Publication date |
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US20070037495A1 (en) | 2007-02-15 |
JP2007050455A (ja) | 2007-03-01 |
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