SG129989A1 - Substrate holding apparatus and substrate polishing apparatus - Google Patents

Substrate holding apparatus and substrate polishing apparatus

Info

Publication number
SG129989A1
SG129989A1 SG200104611-9A SG2001046119A SG129989A1 SG 129989 A1 SG129989 A1 SG 129989A1 SG 2001046119 A SG2001046119 A SG 2001046119A SG 129989 A1 SG129989 A1 SG 129989A1
Authority
SG
Singapore
Prior art keywords
substrate
holder body
substrate holder
retainer ring
polishing
Prior art date
Application number
SG200104611-9A
Other languages
English (en)
Inventor
Yoshihiro Gunji
Hozumi Yasuda
Keisuke Namiki
Hiroshi Yoshida
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000280216A external-priority patent/JP3856634B2/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG129989A1 publication Critical patent/SG129989A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG200104611-9A 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus SG129989A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000231892 2000-07-31
JP2000280216A JP3856634B2 (ja) 2000-09-14 2000-09-14 基板保持装置及び該基板保持装置を備えたポリッシング装置

Publications (1)

Publication Number Publication Date
SG129989A1 true SG129989A1 (en) 2007-03-20

Family

ID=26597077

Family Applications (4)

Application Number Title Priority Date Filing Date
SG200104611-9A SG129989A1 (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
SG200804145-1A SG157258A1 (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
SG200501205A SG125152A1 (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
SG10201706765QA SG10201706765QA (en) 2000-07-31 2014-07-31 Substrate holding apparatus and substrate polishing apparatus

Family Applications After (3)

Application Number Title Priority Date Filing Date
SG200804145-1A SG157258A1 (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
SG200501205A SG125152A1 (en) 2000-07-31 2001-07-31 Substrate holding apparatus and substrate polishing apparatus
SG10201706765QA SG10201706765QA (en) 2000-07-31 2014-07-31 Substrate holding apparatus and substrate polishing apparatus

Country Status (6)

Country Link
US (5) US6890402B2 (fr)
EP (2) EP2085181A1 (fr)
KR (1) KR100876381B1 (fr)
DE (1) DE60138343D1 (fr)
SG (4) SG129989A1 (fr)
TW (1) TW516991B (fr)

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JP6447575B2 (ja) 2016-05-23 2019-01-09 トヨタ自動車株式会社 金属皮膜の成膜方法およびその成膜装置
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KR20200070825A (ko) * 2018-12-10 2020-06-18 삼성전자주식회사 연마 균일도를 제어할 수 있는 화학 기계적 연마 장치
CN110948385B (zh) * 2019-01-08 2020-08-14 华海清科股份有限公司 一种用于化学机械抛光的弹性膜
CN110497545B (zh) * 2019-08-13 2021-06-08 安徽晶天新能源科技有限责任公司 一种太阳能硅片生产加工工艺
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Also Published As

Publication number Publication date
SG10201706765QA (en) 2017-09-28
KR20020010881A (ko) 2002-02-06
US20080047667A1 (en) 2008-02-28
US20080066862A1 (en) 2008-03-20
US20080299880A1 (en) 2008-12-04
EP2085181A1 (fr) 2009-08-05
DE60138343D1 (de) 2009-05-28
EP1177859A3 (fr) 2003-10-15
EP1177859A2 (fr) 2002-02-06
US20050072527A1 (en) 2005-04-07
KR100876381B1 (ko) 2008-12-29
EP1177859B1 (fr) 2009-04-15
SG157258A1 (en) 2009-12-29
SG125152A1 (en) 2006-09-29
US7897007B2 (en) 2011-03-01
TW516991B (en) 2003-01-11
US20020017365A1 (en) 2002-02-14
US6890402B2 (en) 2005-05-10

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