SG128504A1 - Dielectric substrate with holes and method of manufacture - Google Patents

Dielectric substrate with holes and method of manufacture

Info

Publication number
SG128504A1
SG128504A1 SG200504031A SG200504031A SG128504A1 SG 128504 A1 SG128504 A1 SG 128504A1 SG 200504031 A SG200504031 A SG 200504031A SG 200504031 A SG200504031 A SG 200504031A SG 128504 A1 SG128504 A1 SG 128504A1
Authority
SG
Singapore
Prior art keywords
dielectric substrate
photoresist
holes
substrate
present
Prior art date
Application number
SG200504031A
Other languages
English (en)
Inventor
Vincent Yong Chin Lee
Yi Liang Fu
Tatsunori Koyanagi
Yoshiyuki Ohkura
Masahiko Ito
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to SG200809388-2A priority Critical patent/SG149040A1/en
Priority to SG200504031A priority patent/SG128504A1/en
Priority to JP2008518281A priority patent/JP2008544550A/ja
Priority to US11/917,445 priority patent/US20100051324A1/en
Priority to CA002613282A priority patent/CA2613282A1/en
Priority to EP06773555A priority patent/EP1894451A1/en
Priority to CN2006800227964A priority patent/CN101248708B/zh
Priority to PCT/US2006/023832 priority patent/WO2007001995A1/en
Priority to KR1020077029909A priority patent/KR20080017381A/ko
Publication of SG128504A1 publication Critical patent/SG128504A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
SG200504031A 2005-06-22 2005-06-22 Dielectric substrate with holes and method of manufacture SG128504A1 (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
SG200809388-2A SG149040A1 (en) 2005-06-22 2005-06-22 Dielectric substrate with holes and method of manufacture
SG200504031A SG128504A1 (en) 2005-06-22 2005-06-22 Dielectric substrate with holes and method of manufacture
JP2008518281A JP2008544550A (ja) 2005-06-22 2006-06-20 ホールを有する誘電体基板及び製造分野における方法
US11/917,445 US20100051324A1 (en) 2005-06-22 2006-06-20 Dielectric substrate with holes and method of manufacture
CA002613282A CA2613282A1 (en) 2005-06-22 2006-06-20 Dielectric substrate with holes and method of manufacture
EP06773555A EP1894451A1 (en) 2005-06-22 2006-06-20 Dielectric substrate with holes and method of manufacture
CN2006800227964A CN101248708B (zh) 2005-06-22 2006-06-20 具有孔的介质基板和制造方法
PCT/US2006/023832 WO2007001995A1 (en) 2005-06-22 2006-06-20 Dielectric substrate with holes and method of manufacture
KR1020077029909A KR20080017381A (ko) 2005-06-22 2006-06-20 홀을 갖는 유전체 기판 및 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200504031A SG128504A1 (en) 2005-06-22 2005-06-22 Dielectric substrate with holes and method of manufacture

Publications (1)

Publication Number Publication Date
SG128504A1 true SG128504A1 (en) 2007-01-30

Family

ID=37057055

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200504031A SG128504A1 (en) 2005-06-22 2005-06-22 Dielectric substrate with holes and method of manufacture
SG200809388-2A SG149040A1 (en) 2005-06-22 2005-06-22 Dielectric substrate with holes and method of manufacture

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG200809388-2A SG149040A1 (en) 2005-06-22 2005-06-22 Dielectric substrate with holes and method of manufacture

Country Status (8)

Country Link
US (1) US20100051324A1 (enExample)
EP (1) EP1894451A1 (enExample)
JP (1) JP2008544550A (enExample)
KR (1) KR20080017381A (enExample)
CN (1) CN101248708B (enExample)
CA (1) CA2613282A1 (enExample)
SG (2) SG128504A1 (enExample)
WO (1) WO2007001995A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102223764A (zh) * 2010-04-16 2011-10-19 富葵精密组件(深圳)有限公司 软性电路板的制作方法
CN103190204B (zh) 2010-11-03 2016-11-16 3M创新有限公司 具有无引线接合管芯的柔性led器件
CN102162991A (zh) * 2011-04-02 2011-08-24 深南电路有限公司 阻焊曝光底片及线路板制作工艺
KR102031967B1 (ko) * 2013-05-07 2019-10-14 엘지이노텍 주식회사 발광 소자 패키지
JP2016197178A (ja) * 2015-04-03 2016-11-24 株式会社ジャパンディスプレイ 表示装置
CN111667770B (zh) * 2020-07-15 2021-10-08 武汉华星光电技术有限公司 柔性显示装置
KR102890451B1 (ko) * 2021-03-04 2025-11-24 삼성전자 주식회사 연성회로기판 및 이를 포함하는 전자 장치

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4720915A (en) * 1986-03-25 1988-01-26 True Grid, Ltd. Printed circuit board and process for its manufacture
JPH04342148A (ja) * 1991-05-20 1992-11-27 Toshiba Corp テープキャリア
EP0700630B1 (de) * 1994-03-23 2003-02-05 Dyconex AG Folienleiterplatten und verfahren zu deren herstellung
JPH08186336A (ja) * 1994-12-28 1996-07-16 Mitsubishi Electric Corp 回路基板、駆動回路モジュール及びそれを用いた液晶表示装置並びにそれらの製造方法
US5759744A (en) * 1995-02-24 1998-06-02 University Of New Mexico Methods and apparatus for lithography of sparse arrays of sub-micrometer features
JP2869969B2 (ja) * 1995-04-28 1999-03-10 ソニーケミカル株式会社 フレキシブル回路基板の製造方法
KR100199368B1 (ko) * 1996-06-21 1999-06-15 김영환 반도체 소자 제조용 콘택 마스크
JP3238369B2 (ja) * 1998-04-10 2001-12-10 ソニーケミカル株式会社 フォトレジスト用組成物、及びフレキシブルプリント配線板の製造方法
JP3327252B2 (ja) * 1999-05-20 2002-09-24 日本電気株式会社 テープキャリア、ｔｃｐおよび液晶表示装置
TW436933B (en) * 1999-12-30 2001-05-28 Taiwan Semiconductor Mfg Method for defining a pattern
KR100333627B1 (ko) * 2000-04-11 2002-04-22 구자홍 다층 인쇄회로기판 및 그 제조방법
US20030039893A1 (en) * 2001-08-22 2003-02-27 Jeff Farnsworth Exposed phase edge mask method for generating periodic structures with subwavelength feature
JP2004014880A (ja) * 2002-06-07 2004-01-15 Sumitomo Metal Mining Co Ltd フレキシブル配線基板およびその製造方法
US6905621B2 (en) * 2002-10-10 2005-06-14 Taiwan Semiconductor Manufacturing Co., Ltd. Method for preventing the etch transfer of sidelobes in contact hole patterns

Also Published As

Publication number Publication date
JP2008544550A (ja) 2008-12-04
CA2613282A1 (en) 2007-01-04
EP1894451A1 (en) 2008-03-05
SG149040A1 (en) 2009-01-29
CN101248708A (zh) 2008-08-20
CN101248708B (zh) 2013-02-13
KR20080017381A (ko) 2008-02-26
WO2007001995A1 (en) 2007-01-04
US20100051324A1 (en) 2010-03-04

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