SG125152A1 - Substrate holding apparatus and substrate polishing apparatus - Google Patents
Substrate holding apparatus and substrate polishing apparatusInfo
- Publication number
- SG125152A1 SG125152A1 SG200501205A SG200501205A SG125152A1 SG 125152 A1 SG125152 A1 SG 125152A1 SG 200501205 A SG200501205 A SG 200501205A SG 200501205 A SG200501205 A SG 200501205A SG 125152 A1 SG125152 A1 SG 125152A1
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- polishing
- holding
- holder body
- substrate holding
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000231892 | 2000-07-31 | ||
JP2000280216A JP3856634B2 (ja) | 2000-09-14 | 2000-09-14 | 基板保持装置及び該基板保持装置を備えたポリッシング装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG125152A1 true SG125152A1 (en) | 2006-09-29 |
Family
ID=26597077
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200501205A SG125152A1 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
SG200104611-9A SG129989A1 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
SG200804145-1A SG157258A1 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
SG10201706765QA SG10201706765QA (en) | 2000-07-31 | 2014-07-31 | Substrate holding apparatus and substrate polishing apparatus |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200104611-9A SG129989A1 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
SG200804145-1A SG157258A1 (en) | 2000-07-31 | 2001-07-31 | Substrate holding apparatus and substrate polishing apparatus |
SG10201706765QA SG10201706765QA (en) | 2000-07-31 | 2014-07-31 | Substrate holding apparatus and substrate polishing apparatus |
Country Status (6)
Country | Link |
---|---|
US (5) | US6890402B2 (de) |
EP (2) | EP2085181A1 (de) |
KR (1) | KR100876381B1 (de) |
DE (1) | DE60138343D1 (de) |
SG (4) | SG125152A1 (de) |
TW (1) | TW516991B (de) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
PT1098972E (pt) * | 1998-07-22 | 2010-12-14 | Smithkline Beecham Ltd | Proteína semelhante a proteína especificamente neuroendócrina e adnc codificante |
US7217175B2 (en) * | 2001-05-29 | 2007-05-15 | Ebara Corporation | Polishing apparatus and polishing method |
TWI289494B (en) | 2002-01-22 | 2007-11-11 | Multi Planar Technologies Inc | Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution |
WO2004033152A1 (en) * | 2002-10-11 | 2004-04-22 | Semplastics, L.L.C. | Retaining ring for use on a carrier of a polishing apparatus |
US20040102140A1 (en) * | 2002-11-21 | 2004-05-27 | Wood Jeffrey H. | Contour following end effectors for lapping/polishing |
WO2004070806A1 (en) * | 2003-02-10 | 2004-08-19 | Ebara Corporation | Substrate holding apparatus and polishing apparatus |
DE10394257D2 (de) * | 2003-07-09 | 2006-05-18 | Peter Wolters Surface Technolo | Halter für flache Werkstücke, insbesondere Halbleiterwafer zum chemisch-mechanischen Polieren |
JP2005034959A (ja) * | 2003-07-16 | 2005-02-10 | Ebara Corp | 研磨装置及びリテーナリング |
US20050126708A1 (en) * | 2003-12-10 | 2005-06-16 | Applied Materials, Inc. | Retaining ring with slurry transport grooves |
US7118452B2 (en) * | 2004-02-12 | 2006-10-10 | The Boeing Company | Pneumatically actuated flexible coupling end effectors for lapping/polishing |
US7429410B2 (en) * | 2004-09-20 | 2008-09-30 | Applied Materials, Inc. | Diffuser gravity support |
EP2797109B1 (de) | 2004-11-01 | 2018-02-28 | Ebara Corporation | Poliervorrichtung |
DE102005016411B4 (de) * | 2005-04-08 | 2007-03-29 | IGAM Ingenieurgesellschaft für angewandte Mechanik mbH | Vorrichtung zur hochgenauen Oberflächenbearbeitung eines Werkstückes |
US7326105B2 (en) * | 2005-08-31 | 2008-02-05 | Micron Technology, Inc. | Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces |
KR100898793B1 (ko) * | 2005-12-29 | 2009-05-20 | 엘지디스플레이 주식회사 | 액정표시소자용 기판 합착 장치 |
US7527271B2 (en) * | 2006-06-02 | 2009-05-05 | Applied Materials, Inc. | Fast substrate loading on polishing head without membrane inflation step |
US7575504B2 (en) * | 2006-11-22 | 2009-08-18 | Applied Materials, Inc. | Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly |
JP2008177248A (ja) * | 2007-01-16 | 2008-07-31 | Tokyo Seimitsu Co Ltd | 研磨ヘッド用リテーナリング |
DE102007026292A1 (de) * | 2007-06-06 | 2008-12-11 | Siltronic Ag | Verfahren zur einseitigen Politur nicht strukturierter Halbleiterscheiben |
KR100864943B1 (ko) * | 2007-08-09 | 2008-10-23 | 세메스 주식회사 | 기판 세정 장치 |
JP5042778B2 (ja) * | 2007-10-31 | 2012-10-03 | 信越半導体株式会社 | ワーク研磨用ヘッド及びこの研磨ヘッドを備えた研磨装置 |
JP5464843B2 (ja) * | 2007-12-03 | 2014-04-09 | 株式会社半導体エネルギー研究所 | Soi基板の作製方法 |
US20090311945A1 (en) * | 2008-06-17 | 2009-12-17 | Roland Strasser | Planarization System |
JP5390807B2 (ja) * | 2008-08-21 | 2014-01-15 | 株式会社荏原製作所 | 研磨方法および装置 |
US8460067B2 (en) | 2009-05-14 | 2013-06-11 | Applied Materials, Inc. | Polishing head zone boundary smoothing |
CA3077883C (en) | 2010-02-18 | 2024-01-16 | Ncs Multistage Inc. | Downhole tool assembly with debris relief, and method for using same |
JP5648954B2 (ja) * | 2010-08-31 | 2015-01-07 | 不二越機械工業株式会社 | 研磨装置 |
CA3022033A1 (en) | 2010-10-18 | 2011-07-12 | Ncs Multistage Inc. | Tools and methods for use in completion of a wellbore |
KR101775464B1 (ko) * | 2011-05-31 | 2017-09-07 | 삼성전자주식회사 | 화학 기계적 연마 장치의 리테이너 링 |
DE102011082777A1 (de) * | 2011-09-15 | 2012-02-09 | Siltronic Ag | Verfahren zum beidseitigen Polieren einer Halbleiterscheibe |
US20130078812A1 (en) * | 2011-09-23 | 2013-03-28 | Strasbaugh | Wafer Carrier with Flexible Pressure Plate |
US9176173B2 (en) * | 2011-11-28 | 2015-11-03 | Texas Instruments Incorporated | Method for detecting imperfect mounting of a rod-shaped metallic object in a metallic hollow shaft and a device |
WO2013112764A1 (en) * | 2012-01-25 | 2013-08-01 | Applied Materials, Inc. | Retaining ring monitoring and control of pressure |
US9050700B2 (en) | 2012-01-27 | 2015-06-09 | Applied Materials, Inc. | Methods and apparatus for an improved polishing head retaining ring |
US8931559B2 (en) | 2012-03-23 | 2015-01-13 | Ncs Oilfield Services Canada, Inc. | Downhole isolation and depressurization tool |
CN102672551A (zh) * | 2012-05-22 | 2012-09-19 | 江南大学 | 一种超声波雾化型抛光机 |
JP5976522B2 (ja) * | 2012-05-31 | 2016-08-23 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
US10702972B2 (en) | 2012-05-31 | 2020-07-07 | Ebara Corporation | Polishing apparatus |
US9016675B2 (en) * | 2012-07-06 | 2015-04-28 | Asm Technology Singapore Pte Ltd | Apparatus and method for supporting a workpiece during processing |
US9908718B2 (en) * | 2012-10-19 | 2018-03-06 | Dow Global Technologies Llc | Device, system, and method for lifting and moving formable and/or collapsible parts |
US8998676B2 (en) * | 2012-10-26 | 2015-04-07 | Applied Materials, Inc. | Retaining ring with selected stiffness and thickness |
JP5538601B1 (ja) * | 2013-08-22 | 2014-07-02 | ミクロ技研株式会社 | 研磨ヘッド及び研磨処理装置 |
KR101568177B1 (ko) * | 2014-01-21 | 2015-11-11 | 주식회사 케이씨텍 | 화학 기계적 연마 장치용 캐리어 헤드 및 이에 사용되는 리테이너 링 |
JP6336893B2 (ja) * | 2014-11-11 | 2018-06-06 | 株式会社荏原製作所 | 研磨装置 |
KR102173323B1 (ko) | 2014-06-23 | 2020-11-04 | 삼성전자주식회사 | 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법 |
DE102014212176A1 (de) * | 2014-06-25 | 2015-12-31 | Siemens Aktiengesellschaft | Pulverbettbasiertes additives Fertigungsverfahren und Anlage zur Durchführung dieses Verfahrens |
US10510563B2 (en) * | 2016-04-15 | 2019-12-17 | Taiwan Semiconductor Manufacturing Company Ltd. | Wafer carrier assembly |
JP6447575B2 (ja) * | 2016-05-23 | 2019-01-09 | トヨタ自動車株式会社 | 金属皮膜の成膜方法およびその成膜装置 |
USD839224S1 (en) * | 2016-12-12 | 2019-01-29 | Ebara Corporation | Elastic membrane for semiconductor wafer polishing |
CN108818294A (zh) * | 2018-06-26 | 2018-11-16 | 长江存储科技有限责任公司 | 研磨头、研磨系统及研磨方法 |
US20200055160A1 (en) * | 2018-08-14 | 2020-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing method and apparatus |
KR20200070825A (ko) * | 2018-12-10 | 2020-06-18 | 삼성전자주식회사 | 연마 균일도를 제어할 수 있는 화학 기계적 연마 장치 |
CN110948385B (zh) * | 2019-01-08 | 2020-08-14 | 华海清科股份有限公司 | 一种用于化学机械抛光的弹性膜 |
CN110497545B (zh) * | 2019-08-13 | 2021-06-08 | 安徽晶天新能源科技有限责任公司 | 一种太阳能硅片生产加工工艺 |
US11325223B2 (en) * | 2019-08-23 | 2022-05-10 | Applied Materials, Inc. | Carrier head with segmented substrate chuck |
Citations (3)
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---|---|---|---|---|
US5967885A (en) * | 1997-12-01 | 1999-10-19 | Lucent Technologies Inc. | Method of manufacturing an integrated circuit using chemical mechanical polishing |
WO2000021715A2 (en) * | 1998-10-09 | 2000-04-20 | Speedfam-Ipec Corporation | Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
US6093082A (en) * | 1997-05-23 | 2000-07-25 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
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JPH0569310A (ja) | 1991-04-23 | 1993-03-23 | Mitsubishi Materials Corp | ウエーハの鏡面研磨装置 |
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JP3724869B2 (ja) * | 1995-10-09 | 2005-12-07 | 株式会社荏原製作所 | ポリッシング装置および方法 |
US5762539A (en) * | 1996-02-27 | 1998-06-09 | Ebara Corporation | Apparatus for and method for polishing workpiece |
US6595831B1 (en) * | 1996-05-16 | 2003-07-22 | Ebara Corporation | Method for polishing workpieces using fixed abrasives |
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US5941758A (en) * | 1996-11-13 | 1999-08-24 | Intel Corporation | Method and apparatus for chemical-mechanical polishing |
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EP1327498B1 (de) * | 1997-04-08 | 2013-06-12 | Ebara Corporation | Poliervorrichtung |
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KR19990030719A (ko) * | 1997-10-04 | 1999-05-06 | 로버트 에이치. 씨. 챠오 | 씨엠피 장비의 폴리싱 헤드용 리테이너 링 |
EP0923122B1 (de) * | 1997-12-01 | 2011-09-07 | Lucent Technologies Inc. | Chemisch-mechanisches Polierverfahren zur Herstellung eines integrierten Schaltkreises und zugehörige Haltevorrichtung |
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US6419567B1 (en) * | 2000-08-14 | 2002-07-16 | Semiconductor 300 Gmbh & Co. Kg | Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method |
US6527625B1 (en) * | 2000-08-31 | 2003-03-04 | Multi-Planar Technologies, Inc. | Chemical mechanical polishing apparatus and method having a soft backed polishing head |
US9033934B2 (en) * | 2011-09-27 | 2015-05-19 | Shl Group Ab | Medical delivery device with an initial locked state, intermediate priming state and a medicament delivery state |
-
2001
- 2001-07-30 EP EP09005308A patent/EP2085181A1/de not_active Withdrawn
- 2001-07-30 EP EP01117745A patent/EP1177859B1/de not_active Expired - Lifetime
- 2001-07-30 DE DE60138343T patent/DE60138343D1/de not_active Expired - Lifetime
- 2001-07-31 US US09/917,732 patent/US6890402B2/en not_active Expired - Lifetime
- 2001-07-31 TW TW090118572A patent/TW516991B/zh not_active IP Right Cessation
- 2001-07-31 SG SG200501205A patent/SG125152A1/en unknown
- 2001-07-31 KR KR1020010046378A patent/KR100876381B1/ko active IP Right Grant
- 2001-07-31 SG SG200104611-9A patent/SG129989A1/en unknown
- 2001-07-31 SG SG200804145-1A patent/SG157258A1/en unknown
-
2004
- 2004-10-26 US US10/972,579 patent/US20050072527A1/en not_active Abandoned
-
2007
- 2007-10-15 US US11/907,590 patent/US20080047667A1/en not_active Abandoned
- 2007-10-30 US US11/979,019 patent/US20080066862A1/en not_active Abandoned
-
2008
- 2008-06-10 US US12/136,424 patent/US7897007B2/en not_active Expired - Fee Related
-
2014
- 2014-07-31 SG SG10201706765QA patent/SG10201706765QA/en unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6093082A (en) * | 1997-05-23 | 2000-07-25 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
US5967885A (en) * | 1997-12-01 | 1999-10-19 | Lucent Technologies Inc. | Method of manufacturing an integrated circuit using chemical mechanical polishing |
WO2000021715A2 (en) * | 1998-10-09 | 2000-04-20 | Speedfam-Ipec Corporation | Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
Also Published As
Publication number | Publication date |
---|---|
KR100876381B1 (ko) | 2008-12-29 |
EP2085181A1 (de) | 2009-08-05 |
EP1177859A2 (de) | 2002-02-06 |
US20080047667A1 (en) | 2008-02-28 |
US20020017365A1 (en) | 2002-02-14 |
KR20020010881A (ko) | 2002-02-06 |
EP1177859B1 (de) | 2009-04-15 |
SG157258A1 (en) | 2009-12-29 |
US20050072527A1 (en) | 2005-04-07 |
US20080066862A1 (en) | 2008-03-20 |
US6890402B2 (en) | 2005-05-10 |
US7897007B2 (en) | 2011-03-01 |
TW516991B (en) | 2003-01-11 |
SG129989A1 (en) | 2007-03-20 |
US20080299880A1 (en) | 2008-12-04 |
DE60138343D1 (de) | 2009-05-28 |
SG10201706765QA (en) | 2017-09-28 |
EP1177859A3 (de) | 2003-10-15 |
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