SG125108A1 - Assembly comprising a sensor for determining at least one of tilt and height of a substrate, a method therefor and a lithographic projection apparatus - Google Patents

Assembly comprising a sensor for determining at least one of tilt and height of a substrate, a method therefor and a lithographic projection apparatus

Info

Publication number
SG125108A1
SG125108A1 SG200401153A SG200401153A SG125108A1 SG 125108 A1 SG125108 A1 SG 125108A1 SG 200401153 A SG200401153 A SG 200401153A SG 200401153 A SG200401153 A SG 200401153A SG 125108 A1 SG125108 A1 SG 125108A1
Authority
SG
Singapore
Prior art keywords
tilt
substrate
sensor
height
determining
Prior art date
Application number
SG200401153A
Other languages
English (en)
Inventor
Ralph Brinkhof
Marcus Emile Joannes Boonman
Nivelle Martin Jules Marie- De
Original Assignee
Asml Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml Netherlands Bv filed Critical Asml Netherlands Bv
Publication of SG125108A1 publication Critical patent/SG125108A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
    • B60Q3/00—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors
    • B60Q3/70—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors characterised by the purpose
    • B60Q3/74—Arrangement of lighting devices for vehicle interiors; Lighting devices specially adapted for vehicle interiors characterised by the purpose for overall compartment lighting; for overall compartment lighting in combination with specific lighting, e.g. room lamps with reading lamps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034—Leveling
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60N—SEATS SPECIALLY ADAPTED FOR VEHICLES; VEHICLE PASSENGER ACCOMMODATION NOT OTHERWISE PROVIDED FOR
    • B60N3/00—Arrangements or adaptations of other passenger fittings, not otherwise provided for
    • B60N3/02—Arrangements or adaptations of other passenger fittings, not otherwise provided for of hand grips or straps

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SG200401153A 2003-03-11 2004-03-09 Assembly comprising a sensor for determining at least one of tilt and height of a substrate, a method therefor and a lithographic projection apparatus SG125108A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03075704 2003-03-11

Publications (1)

Publication Number Publication Date
SG125108A1 true SG125108A1 (en) 2006-09-29

Family

ID=33515113

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200401153A SG125108A1 (en) 2003-03-11 2004-03-09 Assembly comprising a sensor for determining at least one of tilt and height of a substrate, a method therefor and a lithographic projection apparatus

Country Status (6)

Country Link
US (1) US7113257B2 (ja)
JP (2) JP4166176B2 (ja)
KR (1) KR100623262B1 (ja)
CN (1) CN100520600C (ja)
SG (1) SG125108A1 (ja)
TW (1) TWI234693B (ja)

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TWI553703B (zh) * 2004-11-18 2016-10-11 尼康股份有限公司 A position measuring method, a position control method, a measuring method, a loading method, an exposure method and an exposure apparatus, and a device manufacturing method
US20070262268A1 (en) * 2006-04-27 2007-11-15 Asml Netherlands B.V. Method for imaging a pattern onto a target portion of a substrate
US8896808B2 (en) * 2006-06-21 2014-11-25 Asml Netherlands B.V. Lithographic apparatus and method
US20080151204A1 (en) * 2006-12-21 2008-06-26 Asml Netherlands B.V. Method for positioning a target portion of a substrate with respect to a focal plane of a projection system
JP4930077B2 (ja) * 2007-01-31 2012-05-09 株式会社ニコン 検出装置、露光装置、デバイス製造方法、位置制御装置、位置制御方法、プログラム、及び記録媒体
US8236579B2 (en) * 2007-03-14 2012-08-07 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and systems for lithography alignment
JP2008242218A (ja) * 2007-03-28 2008-10-09 Fujifilm Corp 描画装置及び描画方法
EP2128701A1 (en) * 2008-05-30 2009-12-02 ASML Netherlands BV Method of determining defects in a substrate and apparatus for exposing a substrate in a lithographic process
DE102009037281B4 (de) * 2009-08-12 2013-05-08 Siltronic Ag Verfahren zur Herstellung einer polierten Halbleiterscheibe
JP2011044554A (ja) * 2009-08-20 2011-03-03 Toshiba Corp 露光制御装置および半導体デバイスの製造方法
US8018229B1 (en) * 2010-04-22 2011-09-13 Honeywell International Inc. Structure and method for flex circuit on a chip
JP5890139B2 (ja) * 2011-09-30 2016-03-22 株式会社Ｓｃｒｅｅｎホールディングス 描画装置およびその焦点調整方法
CN103365096B (zh) * 2012-03-27 2015-05-13 上海微电子装备有限公司 用于光刻设备的调焦调平系统及测量方法
CN103365125B (zh) * 2012-04-11 2015-08-26 上海微电子装备有限公司 一种工艺基底边缘场的调平方法
CN102679885B (zh) * 2012-05-22 2014-06-04 江门市蒙德电气股份有限公司 基于机器视觉的管状对象位移识别装置
US9205527B2 (en) * 2012-11-08 2015-12-08 Applied Materials, Inc. In-situ monitoring system with monitoring of elongated region
US10274838B2 (en) * 2013-03-14 2019-04-30 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for performing lithography process in semiconductor device fabrication
JP6253269B2 (ja) * 2013-06-14 2017-12-27 キヤノン株式会社 リソグラフィ装置、リソグラフィ方法、それを用いた物品の製造方法
KR102330321B1 (ko) * 2014-12-12 2021-11-23 에이에스엠엘 네델란즈 비.브이. 기판 모델 파라미터를 계산하고 리소그래피 처리를 제어하기 위한 방법 및 장치
NL2017296A (en) * 2015-08-12 2017-02-16 Asml Netherlands Bv Methods for controlling lithographic apparatus, lithographic apparatus and device manufacturing method
DE102015216438A1 (de) 2015-08-27 2017-03-02 Carl Zeiss Smt Gmbh Sensoranordnung für eine Lithographieanlage, Lithographieanlage und Verfahren zum Betreiben einer Lithographieanlage
WO2017045871A1 (en) 2015-09-15 2017-03-23 Asml Netherlands B.V. Methods for controlling lithographic apparatus, lithographic apparatus and device manufacturing method
JP6952590B2 (ja) * 2017-11-30 2021-10-20 キヤノン株式会社 露光装置、露光方法、および物品の製造方法
US11360395B2 (en) * 2018-03-29 2022-06-14 Asml Netherlands B.V. Control method for a scanning exposure apparatus
JP7167750B2 (ja) * 2019-02-08 2022-11-09 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
CN114111538B (zh) * 2021-11-29 2023-11-28 徐州徐工履带底盘有限公司 链轨节平面度和落差检测工装及其检测方法
CN114734136A (zh) * 2022-04-20 2022-07-12 上海柏楚电子科技股份有限公司 激光加工机床和激光加工方法

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US4999669A (en) * 1988-07-18 1991-03-12 Nikon Corporation Levelling device in an exposure apparatus
EP1037117A2 (en) * 1999-03-08 2000-09-20 Asm Lithography B.V. Off-axis levelling in lithographic projection apparatus
US6245585B1 (en) * 1998-09-04 2001-06-12 Nec Corporation Method of providing levelling and focusing adjustments on a semiconductor wafer

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US5523193A (en) * 1988-05-31 1996-06-04 Texas Instruments Incorporated Method and apparatus for patterning and imaging member
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NL9100410A (nl) * 1991-03-07 1992-10-01 Asm Lithography Bv Afbeeldingsapparaat voorzien van een focusfout- en/of scheefstandsdetectie-inrichting.
US5229872A (en) * 1992-01-21 1993-07-20 Hughes Aircraft Company Exposure device including an electrically aligned electronic mask for micropatterning
JP3275368B2 (ja) * 1992-07-09 2002-04-15 株式会社ニコン 露光方法及び装置
WO1997033205A1 (en) * 1996-03-06 1997-09-12 Philips Electronics N.V. Differential interferometer system and lithographic step-and-scan apparatus provided with such a system
JPH10116877A (ja) * 1996-10-14 1998-05-06 Canon Inc 面位置検出装置および方法、それを用いた露光方式、ならびにデバイス製造方法
JP2000505958A (ja) * 1996-12-24 2000-05-16 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ ２個の物品ホルダを有する二次元バランス位置決め装置及びこの位置決め装置を有するリソグラフ装置
DE69711929T2 (de) 1997-01-29 2002-09-05 Micronic Laser Systems Ab Taeb Verfahren und gerät zur erzeugung eines musters auf einem mit fotoresist beschichteten substrat mittels fokusiertem laserstrahl
SE509062C2 (sv) 1997-02-28 1998-11-30 Micronic Laser Systems Ab Dataomvandlingsmetod för en laserskrivare med flera strålar för mycket komplexa mikrokolitografiska mönster
WO1998040791A1 (en) 1997-03-10 1998-09-17 Koninklijke Philips Electronics N.V. Positioning device having two object holders
JPH11186129A (ja) * 1997-12-19 1999-07-09 Nikon Corp 走査型露光方法及び装置
US7023521B2 (en) * 1999-04-13 2006-04-04 Nikon Corporation Exposure apparatus, exposure method and process for producing device
AU2001279126A1 (en) * 2000-07-31 2002-02-13 Silicon Valley Group Inc In-situ method and apparatus for end point detection in chemical mechanical polishing
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999669A (en) * 1988-07-18 1991-03-12 Nikon Corporation Levelling device in an exposure apparatus
US6245585B1 (en) * 1998-09-04 2001-06-12 Nec Corporation Method of providing levelling and focusing adjustments on a semiconductor wafer
EP1037117A2 (en) * 1999-03-08 2000-09-20 Asm Lithography B.V. Off-axis levelling in lithographic projection apparatus

Also Published As

Publication number Publication date
JP2004343066A (ja) 2004-12-02
KR20040080350A (ko) 2004-09-18
TW200426534A (en) 2004-12-01
CN100520600C (zh) 2009-07-29
US7113257B2 (en) 2006-09-26
JP2008016860A (ja) 2008-01-24
CN1550914A (zh) 2004-12-01
US20040257545A1 (en) 2004-12-23
KR100623262B1 (ko) 2006-09-18
JP4347373B2 (ja) 2009-10-21
TWI234693B (en) 2005-06-21
JP4166176B2 (ja) 2008-10-15

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