SG123736A1 - Coating for enhancing adhesion of molding compoundto semiconductor devices - Google Patents

Coating for enhancing adhesion of molding compoundto semiconductor devices

Info

Publication number
SG123736A1
SG123736A1 SG200508171A SG200508171A SG123736A1 SG 123736 A1 SG123736 A1 SG 123736A1 SG 200508171 A SG200508171 A SG 200508171A SG 200508171 A SG200508171 A SG 200508171A SG 123736 A1 SG123736 A1 SG 123736A1
Authority
SG
Singapore
Prior art keywords
coating
molding
compoundto
semiconductor devices
enhancing adhesion
Prior art date
Application number
SG200508171A
Other languages
English (en)
Inventor
Li Jianxiong
Chaw Chi Chuen
Tsui Ngai Kin
Liu Ming
Kwan Yiu Fai
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Publication of SG123736A1 publication Critical patent/SG123736A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
SG200508171A 2004-12-22 2005-12-16 Coating for enhancing adhesion of molding compoundto semiconductor devices SG123736A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/019,421 US7329617B2 (en) 2004-12-22 2004-12-22 Coating for enhancing adhesion of molding compound to semiconductor devices

Publications (1)

Publication Number Publication Date
SG123736A1 true SG123736A1 (en) 2006-07-26

Family

ID=35965943

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200508171A SG123736A1 (en) 2004-12-22 2005-12-16 Coating for enhancing adhesion of molding compoundto semiconductor devices

Country Status (8)

Country Link
US (1) US7329617B2 (zh)
EP (1) EP1675172A1 (zh)
JP (1) JP4402649B2 (zh)
KR (1) KR100685160B1 (zh)
CN (1) CN100383941C (zh)
MY (1) MY151621A (zh)
SG (1) SG123736A1 (zh)
TW (1) TWI295091B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003299296A1 (en) * 2002-11-29 2004-06-23 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
DE102005010272A1 (de) * 2005-03-03 2006-09-14 Infineon Technologies Ag Halbleiterbauelement sowie Verfahren zum Herstellen eines Halbleiterbauelements
JP5182915B2 (ja) * 2007-09-18 2013-04-17 株式会社ブリヂストン 導電性エンドレスベルト
US8432036B2 (en) * 2009-01-22 2013-04-30 Aculon, Inc. Lead frames with improved adhesion to plastic encapsulant
US9313897B2 (en) * 2012-09-14 2016-04-12 Infineon Technologies Ag Method for electrophoretically depositing a film on an electronic assembly
US9303327B2 (en) 2013-01-10 2016-04-05 Infineon Technologies Ag Electric component with an electrophoretically deposited film
US9214440B1 (en) * 2014-12-17 2015-12-15 Texas Instruments Incorporated Method for preventing die pad delamination
JP6936254B2 (ja) * 2016-05-18 2021-09-15 ルミレッズ ホールディング ベーフェー 照明アセンブリ及び照明アセンブリの製造方法
TWI623049B (zh) * 2016-11-04 2018-05-01 英屬開曼群島商鳳凰先驅股份有限公司 封裝基板及其製作方法
JP6787285B2 (ja) * 2017-09-20 2020-11-18 トヨタ自動車株式会社 半導体装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3911475A (en) 1972-04-19 1975-10-07 Westinghouse Electric Corp Encapsulated solid state electronic devices having a sealed lead-encapsulant interface
US4428987A (en) 1982-04-28 1984-01-31 Shell Oil Company Process for improving copper-epoxy adhesion
JPS59197154A (ja) * 1983-04-22 1984-11-08 Hitachi Ltd 半導体装置およびその製造法
US4862246A (en) 1984-09-26 1989-08-29 Hitachi, Ltd. Semiconductor device lead frame with etched through holes
JP2594142B2 (ja) * 1988-11-30 1997-03-26 東芝シリコーン株式会社 電子部品の製造方法
US5164816A (en) * 1988-12-29 1992-11-17 Hitachi Chemical Co., Ltd. Integrated circuit device produced with a resin layer produced from a heat-resistant resin paste
US4946518A (en) 1989-03-14 1990-08-07 Motorola, Inc. Method for improving the adhesion of a plastic encapsulant to copper containing leadframes
US5122858A (en) 1990-09-10 1992-06-16 Olin Corporation Lead frame having polymer coated surface portions
US5153385A (en) * 1991-03-18 1992-10-06 Motorola, Inc. Transfer molded semiconductor package with improved adhesion
US5516874A (en) 1994-06-30 1996-05-14 Ibm Corporation Poly(aryl ether benzimidazoles)
JP3876944B2 (ja) * 1997-12-24 2007-02-07 北興化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
US6369452B1 (en) 1999-07-27 2002-04-09 International Business Machines Corporation Cap attach surface modification for improved adhesion
KR100815314B1 (ko) * 2000-03-31 2008-03-19 히다치 가세고교 가부시끼가이샤 접착제 조성물, 그의 제조 방법, 이것을 사용한 접착필름, 반도체 탑재용 기판 및 반도체 장치
US6501158B1 (en) 2000-06-22 2002-12-31 Skyworks Solutions, Inc. Structure and method for securing a molding compound to a leadframe paddle
US7057264B2 (en) * 2002-10-18 2006-06-06 National Starch And Chemical Investment Holding Corporation Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanates

Also Published As

Publication number Publication date
CN1812064A (zh) 2006-08-02
JP2006179918A (ja) 2006-07-06
EP1675172A1 (en) 2006-06-28
US7329617B2 (en) 2008-02-12
CN100383941C (zh) 2008-04-23
US20060131720A1 (en) 2006-06-22
KR20060072068A (ko) 2006-06-27
JP4402649B2 (ja) 2010-01-20
MY151621A (en) 2014-06-30
TW200629494A (en) 2006-08-16
TWI295091B (en) 2008-03-21
KR100685160B1 (ko) 2007-02-22

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