CN1812064A - 用于增强半导体器件模塑料的粘着的涂覆 - Google Patents
用于增强半导体器件模塑料的粘着的涂覆 Download PDFInfo
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- CN1812064A CN1812064A CNA2005101319655A CN200510131965A CN1812064A CN 1812064 A CN1812064 A CN 1812064A CN A2005101319655 A CNA2005101319655 A CN A2005101319655A CN 200510131965 A CN200510131965 A CN 200510131965A CN 1812064 A CN1812064 A CN 1812064A
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
样例 | 底漆浓度 | 烘烤条件 | 搭接剪切强度 | 标准差 |
% | ℃×分 | Mpa | ||
裸铜 | No | No | 2.0 | 0.5 |
具有底漆的铜 | 0.02 | 180×10 | 2.4 | 0.6 |
0.1 | 180×10 | 4.1 | 1.0 | |
0.4 | 180×10 | 5.8 | 0.4 | |
2.0 | 180×10 | 10.5 | 0.9 | |
5.0 | 180×3 | 10.5 | 1.0 | |
10.0 | 180×10 | 10.2 | 0.7 | |
Pd钯涂层铜 | 5.0 | 180×3 | 6.4 | 0.2 |
Au金涂层铜 | 5.0 | 180×3 | 6.5 | 0.7 |
样例 | 底漆浓度 | 烘烤条件 | 扣状物的剪切负荷 | 标准差 |
% | ℃×分 | N | ||
裸铜 | None | None | 82.0 | 30 |
涂覆铜I | 10 | 180×3 | 213.8 | 40 |
涂覆铜II | 10 | 200×10 | 281.7 | 10 |
样例 | 底漆浓度 | 烘烤条件 | 扣状物的剪切负荷 | 标准差 |
% | ℃×分 | N | ||
裸铜 | No | No | 82.0 | 30 |
涂覆镍Ni的铜 | 10 | 180×5 | 228.0 | 23 |
涂覆银Ag的铜 | 10 | 180×5 | 254.1 | 13 |
Claims (21)
Applications Claiming Priority (2)
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US11/019,421 | 2004-12-22 | ||
US11/019,421 US7329617B2 (en) | 2004-12-22 | 2004-12-22 | Coating for enhancing adhesion of molding compound to semiconductor devices |
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CN1812064A true CN1812064A (zh) | 2006-08-02 |
CN100383941C CN100383941C (zh) | 2008-04-23 |
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CNB2005101319655A Active CN100383941C (zh) | 2004-12-22 | 2005-12-22 | 用于增强半导体器件模塑料的粘着的涂覆 |
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US (1) | US7329617B2 (zh) |
EP (1) | EP1675172A1 (zh) |
JP (1) | JP4402649B2 (zh) |
KR (1) | KR100685160B1 (zh) |
CN (1) | CN100383941C (zh) |
MY (1) | MY151621A (zh) |
SG (1) | SG123736A1 (zh) |
TW (1) | TWI295091B (zh) |
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PT1568071T (pt) * | 2002-11-29 | 2019-06-17 | Fraunhofer Ges Forschung | Pastilha com camada de separação e camada de suporte e seu processo de fabrico |
DE102005010272A1 (de) * | 2005-03-03 | 2006-09-14 | Infineon Technologies Ag | Halbleiterbauelement sowie Verfahren zum Herstellen eines Halbleiterbauelements |
JP5182915B2 (ja) * | 2007-09-18 | 2013-04-17 | 株式会社ブリヂストン | 導電性エンドレスベルト |
US8432036B2 (en) * | 2009-01-22 | 2013-04-30 | Aculon, Inc. | Lead frames with improved adhesion to plastic encapsulant |
US9313897B2 (en) * | 2012-09-14 | 2016-04-12 | Infineon Technologies Ag | Method for electrophoretically depositing a film on an electronic assembly |
US9303327B2 (en) | 2013-01-10 | 2016-04-05 | Infineon Technologies Ag | Electric component with an electrophoretically deposited film |
US9214440B1 (en) * | 2014-12-17 | 2015-12-15 | Texas Instruments Incorporated | Method for preventing die pad delamination |
US11158772B2 (en) | 2016-05-18 | 2021-10-26 | Lumileds Llc | Lighting assembly and method for manufacturing a lighting assembly |
TWI623049B (zh) * | 2016-11-04 | 2018-05-01 | 英屬開曼群島商鳳凰先驅股份有限公司 | 封裝基板及其製作方法 |
JP6787285B2 (ja) * | 2017-09-20 | 2020-11-18 | トヨタ自動車株式会社 | 半導体装置 |
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US3911475A (en) | 1972-04-19 | 1975-10-07 | Westinghouse Electric Corp | Encapsulated solid state electronic devices having a sealed lead-encapsulant interface |
US4428987A (en) | 1982-04-28 | 1984-01-31 | Shell Oil Company | Process for improving copper-epoxy adhesion |
JPS59197154A (ja) * | 1983-04-22 | 1984-11-08 | Hitachi Ltd | 半導体装置およびその製造法 |
US4862246A (en) | 1984-09-26 | 1989-08-29 | Hitachi, Ltd. | Semiconductor device lead frame with etched through holes |
JP2594142B2 (ja) * | 1988-11-30 | 1997-03-26 | 東芝シリコーン株式会社 | 電子部品の製造方法 |
US5164816A (en) * | 1988-12-29 | 1992-11-17 | Hitachi Chemical Co., Ltd. | Integrated circuit device produced with a resin layer produced from a heat-resistant resin paste |
US4946518A (en) | 1989-03-14 | 1990-08-07 | Motorola, Inc. | Method for improving the adhesion of a plastic encapsulant to copper containing leadframes |
US5122858A (en) | 1990-09-10 | 1992-06-16 | Olin Corporation | Lead frame having polymer coated surface portions |
US5153385A (en) * | 1991-03-18 | 1992-10-06 | Motorola, Inc. | Transfer molded semiconductor package with improved adhesion |
US5516874A (en) | 1994-06-30 | 1996-05-14 | Ibm Corporation | Poly(aryl ether benzimidazoles) |
JP3876944B2 (ja) * | 1997-12-24 | 2007-02-07 | 北興化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
US6369452B1 (en) | 1999-07-27 | 2002-04-09 | International Business Machines Corporation | Cap attach surface modification for improved adhesion |
KR100815314B1 (ko) * | 2000-03-31 | 2008-03-19 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물, 그의 제조 방법, 이것을 사용한 접착필름, 반도체 탑재용 기판 및 반도체 장치 |
US6501158B1 (en) | 2000-06-22 | 2002-12-31 | Skyworks Solutions, Inc. | Structure and method for securing a molding compound to a leadframe paddle |
US7057264B2 (en) * | 2002-10-18 | 2006-06-06 | National Starch And Chemical Investment Holding Corporation | Curable compounds containing reactive groups: triazine/isocyanurates, cyanate esters and blocked isocyanates |
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EP1675172A1 (en) | 2006-06-28 |
JP2006179918A (ja) | 2006-07-06 |
JP4402649B2 (ja) | 2010-01-20 |
MY151621A (en) | 2014-06-30 |
US7329617B2 (en) | 2008-02-12 |
KR20060072068A (ko) | 2006-06-27 |
TWI295091B (en) | 2008-03-21 |
TW200629494A (en) | 2006-08-16 |
CN100383941C (zh) | 2008-04-23 |
US20060131720A1 (en) | 2006-06-22 |
KR100685160B1 (ko) | 2007-02-22 |
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