SG123651A1 - Fbga and cob package structure for image sensor - Google Patents

Fbga and cob package structure for image sensor

Info

Publication number
SG123651A1
SG123651A1 SG200502546A SG200502546A SG123651A1 SG 123651 A1 SG123651 A1 SG 123651A1 SG 200502546 A SG200502546 A SG 200502546A SG 200502546 A SG200502546 A SG 200502546A SG 123651 A1 SG123651 A1 SG 123651A1
Authority
SG
Singapore
Prior art keywords
fbga
image sensor
package structure
glass substrate
cob package
Prior art date
Application number
SG200502546A
Other languages
English (en)
Inventor
Wen-Kun Yang
Chin-Chen Yang
Wen-Bin Sun
Jui-Hsien Chang
Chun Hui Yu
His-Ying Yuan
Original Assignee
Advanced Chip Eng Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Chip Eng Tech Inc filed Critical Advanced Chip Eng Tech Inc
Publication of SG123651A1 publication Critical patent/SG123651A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Lens Barrels (AREA)
  • Facsimile Heads (AREA)
  • Studio Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
SG200502546A 2005-01-05 2005-03-29 Fbga and cob package structure for image sensor SG123651A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/029,929 US7279782B2 (en) 2005-01-05 2005-01-05 FBGA and COB package structure for image sensor

Publications (1)

Publication Number Publication Date
SG123651A1 true SG123651A1 (en) 2006-07-26

Family

ID=36599480

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200502546A SG123651A1 (en) 2005-01-05 2005-03-29 Fbga and cob package structure for image sensor

Country Status (7)

Country Link
US (1) US7279782B2 (ko)
JP (2) JP2006190956A (ko)
KR (1) KR100724194B1 (ko)
CN (1) CN1801493A (ko)
DE (1) DE102005018990A1 (ko)
SG (1) SG123651A1 (ko)
TW (1) TWI278121B (ko)

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US20070052827A1 (en) * 2005-09-07 2007-03-08 Omnivision Technologies, Inc. Coated wafer level camera modules and associated methods
US7417221B2 (en) * 2005-09-08 2008-08-26 Gentex Corporation Automotive vehicle image sensor
JP4794283B2 (ja) * 2005-11-18 2011-10-19 パナソニック株式会社 固体撮像装置
CN100483726C (zh) * 2006-07-28 2009-04-29 鸿富锦精密工业（深圳）有限公司 影像感测器封装及其应用的数码相机模组
CN100483725C (zh) * 2006-07-28 2009-04-29 鸿富锦精密工业（深圳）有限公司 影像感测器封装及其应用的数码相机模组
US7566854B2 (en) * 2006-12-08 2009-07-28 Advanced Chip Engineering Technology Inc. Image sensor module
KR100842479B1 (ko) 2006-12-28 2008-07-01 동부일렉트로닉스 주식회사 스캐너의 렌즈계의 오염 방지 방법 및 장치
US7423335B2 (en) * 2006-12-29 2008-09-09 Advanced Chip Engineering Technology Inc. Sensor module package structure and method of the same
CN101285918A (zh) * 2007-04-10 2008-10-15 鸿富锦精密工业（深圳）有限公司 相机模组及其组装方法以及便携式电子装置
KR100867508B1 (ko) * 2007-05-31 2008-11-10 삼성전기주식회사 이미지 센서의 웨이퍼 레벨 패키징 방법
US7911018B2 (en) 2007-10-30 2011-03-22 Panasonic Corporation Optical device and method of manufacturing the same
JP5554957B2 (ja) * 2009-10-09 2014-07-23 オリンパス株式会社 撮像ユニット
TWI425597B (zh) * 2009-12-31 2014-02-01 Kingpak Tech Inc 具有黑色膠體之影像感測器封裝結構
TWM382505U (en) * 2010-01-15 2010-06-11 Cheng Uei Prec Ind Co Ltd Video device
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JP6056186B2 (ja) * 2012-05-08 2017-01-11 株式会社ニコン 撮像素子
US8809984B2 (en) * 2012-08-02 2014-08-19 Larview Technologies Corporation Substrate connection type module structure
CN103780847A (zh) 2012-10-24 2014-05-07 霍尼韦尔国际公司 基于板上芯片的高度集成的成像器
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KR20140126598A (ko) * 2013-04-23 2014-10-31 삼성전자주식회사 반도체 패키지 및 그 제조 방법
US9665757B2 (en) 2014-03-07 2017-05-30 Hand Held Products, Inc. Indicia reader for size-limited applications
JP2016057384A (ja) * 2014-09-08 2016-04-21 株式会社ケンコー・トキナー フィルターユニット
US10049246B2 (en) 2014-12-23 2018-08-14 Hand Held Products, Inc. Mini-barcode reading module with flash memory management
US9543347B2 (en) 2015-02-24 2017-01-10 Optiz, Inc. Stress released image sensor package structure and method
KR102384157B1 (ko) 2015-03-04 2022-04-08 삼성전자주식회사 반도체 패키지 및 그 제조 방법
CN106206625B (zh) * 2015-03-25 2023-11-17 精材科技股份有限公司 一种芯片尺寸等级的感测芯片封装体及其制造方法
CN105120139A (zh) * 2015-09-18 2015-12-02 信利光电股份有限公司 一种摄像模组及其制造方法
US9691637B2 (en) * 2015-10-07 2017-06-27 Nxp Usa, Inc. Method for packaging an integrated circuit device with stress buffer
CN105470213A (zh) * 2015-12-25 2016-04-06 华天科技（西安）有限公司 一次封装成型的光距离传感器封装结构及其制造方法
JP7104711B2 (ja) * 2017-02-04 2022-07-21 ▲寧▼波舜宇光▲電▼信息有限公司 撮像モジュールおよびそのモールド回路基板アセンブリ、回路基板および応用
KR102452688B1 (ko) 2017-09-25 2022-10-11 현대자동차주식회사 이미지 센서 패키지 및 그것의 제조 방법
KR102333727B1 (ko) * 2018-09-21 2021-12-01 닝보 세미컨덕터 인터내셔널 코포레이션 (상하이 브랜치) 이미지 센서 모듈 및 이의 제조 방법
CN109461748B (zh) * 2018-11-05 2021-12-24 中芯集成电路（宁波）有限公司 一种光学元件的封装结构及封装方法
TWI703679B (zh) * 2019-03-26 2020-09-01 勝麗國際股份有限公司 感測器封裝結構
CN109979909A (zh) * 2019-04-30 2019-07-05 烟台艾睿光电科技有限公司 一种wlp器件
CN110416237A (zh) * 2019-07-30 2019-11-05 业成科技（成都）有限公司 光学式影像辨识装置及其制作方法
CN110943077A (zh) * 2019-11-08 2020-03-31 关键禾芯科技股份有限公司 毫米波应用的多颗晶片封装结构

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JPH0670242A (ja) * 1992-08-19 1994-03-11 Olympus Optical Co Ltd 固体撮像装置
JPH0865579A (ja) * 1994-08-23 1996-03-08 Olympus Optical Co Ltd 固体撮像装置
JPH10321826A (ja) * 1997-05-15 1998-12-04 Matsushita Electron Corp 光学的ローパスフィルタ内蔵固体撮像装置及びその製造方法
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Also Published As

Publication number Publication date
US7279782B2 (en) 2007-10-09
CN1801493A (zh) 2006-07-12
KR20060080521A (ko) 2006-07-10
DE102005018990A1 (de) 2006-07-13
US20060145325A1 (en) 2006-07-06
JP2008079321A (ja) 2008-04-03
JP2006190956A (ja) 2006-07-20
KR100724194B1 (ko) 2007-05-31
TW200625660A (en) 2006-07-16
TWI278121B (en) 2007-04-01

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