SG117430A1 - Method for flip-chip bonding - Google Patents

Method for flip-chip bonding

Info

Publication number
SG117430A1
SG117430A1 SG200300087A SG200300087A SG117430A1 SG 117430 A1 SG117430 A1 SG 117430A1 SG 200300087 A SG200300087 A SG 200300087A SG 200300087 A SG200300087 A SG 200300087A SG 117430 A1 SG117430 A1 SG 117430A1
Authority
SG
Singapore
Prior art keywords
flip
chip bonding
bonding
chip
Prior art date
Application number
SG200300087A
Other languages
English (en)
Inventor
Hans Dr-Ing Hesse
Original Assignee
Hesse & Knipps Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10209915A external-priority patent/DE10209915A1/de
Application filed by Hesse & Knipps Gmbh filed Critical Hesse & Knipps Gmbh
Publication of SG117430A1 publication Critical patent/SG117430A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0601—Structure
    • H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
    • H01L2224/1401—Structure
    • H01L2224/1403—Bump connectors having different sizes, e.g. different diameters, heights or widths
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/731—Location prior to the connecting process
    • H01L2224/73101—Location prior to the connecting process on the same surface
    • H01L2224/73103—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/81201—Compression bonding
    • H01L2224/81205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
SG200300087A 2002-01-11 2003-01-10 Method for flip-chip bonding SG117430A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10201004 2002-01-11
DE10209915A DE10209915A1 (de) 2002-01-11 2002-03-07 Verfahren zum Flip-Chip-Bonden

Publications (1)

Publication Number Publication Date
SG117430A1 true SG117430A1 (en) 2005-12-29

Family

ID=26010921

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200300087A SG117430A1 (en) 2002-01-11 2003-01-10 Method for flip-chip bonding

Country Status (4)

Country Link
US (1) US6946745B2 (fr)
EP (1) EP1328015A3 (fr)
SG (1) SG117430A1 (fr)
TW (1) TWI236753B (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4264388B2 (ja) * 2004-07-01 2009-05-13 富士通株式会社 半導体チップの接合方法および接合装置
TWI246175B (en) * 2004-10-11 2005-12-21 Ind Tech Res Inst Bonding structure of device packaging
CN100521171C (zh) * 2004-10-21 2009-07-29 财团法人工业技术研究院 一种元件的封装接合结构
DE102004062212A1 (de) * 2004-12-23 2006-07-13 Texas Instruments Deutschland Gmbh Elektronische Vorrichtung, Chipkontaktierungsverfahren und Kontaktierungsvorrichtung
US7749806B2 (en) * 2005-09-22 2010-07-06 Chipmos Technologies Inc. Fabricating process of a chip package structure
US8487428B2 (en) * 2007-11-20 2013-07-16 Fujitsu Limited Method and system for providing a reliable semiconductor assembly
DE102014111266A1 (de) * 2014-08-07 2016-02-11 Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG Verfahren zur Herstellung eines induktiven Leitfähigkeitssensors und induktiver Leitfähigkeitssensor
US10879211B2 (en) 2016-06-30 2020-12-29 R.S.M. Electron Power, Inc. Method of joining a surface-mount component to a substrate with solder that has been temporarily secured
US20230084360A1 (en) * 2021-09-10 2023-03-16 Innolux Corporation Electronic device and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3657610A (en) * 1969-07-10 1972-04-18 Nippon Electric Co Self-sealing face-down bonded semiconductor device
EP0841700A2 (fr) * 1996-11-12 1998-05-13 Nec Corporation Assemblage de puces semi-conductrices comportant une puce personnalisable sur une puce de type IC
JPH10335527A (ja) * 1997-05-30 1998-12-18 Nec Corp 半導体装置、半導体装置の実装方法、および半導体装置の製造方法
WO1999056509A1 (fr) * 1998-04-24 1999-11-04 Amerasia International Technology, Inc. Dispositifs a puces a protuberances comprenant une colle conductrice souple
EP0982385A1 (fr) * 1997-05-12 2000-03-01 Fujitsu Limited Adhesif, procede de collage et assemblages de panneaux montes

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS615549A (ja) * 1984-06-20 1986-01-11 Hitachi Micro Comput Eng Ltd 半導体装置
JPH0430544A (ja) * 1990-05-28 1992-02-03 Hitachi Ltd 半導体集積回路装置
DE4105869C2 (de) 1991-02-25 2000-05-18 Edgar Schneider IC-Karte und Verfahren zu ihrer Herstellung
US5386624A (en) 1993-07-06 1995-02-07 Motorola, Inc. Method for underencapsulating components on circuit supporting substrates
FR2722915B1 (fr) * 1994-07-21 1997-01-24 Sgs Thomson Microelectronics Boitier bga a moulage par injection
US5523628A (en) * 1994-08-05 1996-06-04 Hughes Aircraft Company Apparatus and method for protecting metal bumped integrated circuit chips during processing and for providing mechanical support to interconnected chips
DE19527661C2 (de) 1995-07-28 1998-02-19 Optrex Europ Gmbh Elektrische Leiter aufweisender Träger mit einem elektronischen Bauteil und Verfahen zum Kontaktieren von Leitern eines Substrates mit Kontaktwarzen eines elektronischen Bauteils
DE1025587T1 (de) 1997-07-21 2001-02-08 Aguila Technologies Inc Halbleiter-flipchippackung und herstellungsverfahren dafür
US6399178B1 (en) 1998-07-20 2002-06-04 Amerasia International Technology, Inc. Rigid adhesive underfill preform, as for a flip-chip device
AU2165100A (en) 1998-12-07 2000-06-26 Dexter Corporation, The Underfill film compositions
DE10020374A1 (de) 1999-07-02 2001-01-25 Fujitsu Ltd Kopfbaugruppe einer Plattenvorrichtung mit einem Kopf-IC-Chip, der durch Ultraschallbonden an eine Aufhängung montiert ist
US20030129488A1 (en) * 2002-01-09 2003-07-10 Gross Oliver J. Planar battery and method of sealing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3657610A (en) * 1969-07-10 1972-04-18 Nippon Electric Co Self-sealing face-down bonded semiconductor device
EP0841700A2 (fr) * 1996-11-12 1998-05-13 Nec Corporation Assemblage de puces semi-conductrices comportant une puce personnalisable sur une puce de type IC
EP0982385A1 (fr) * 1997-05-12 2000-03-01 Fujitsu Limited Adhesif, procede de collage et assemblages de panneaux montes
JPH10335527A (ja) * 1997-05-30 1998-12-18 Nec Corp 半導体装置、半導体装置の実装方法、および半導体装置の製造方法
WO1999056509A1 (fr) * 1998-04-24 1999-11-04 Amerasia International Technology, Inc. Dispositifs a puces a protuberances comprenant une colle conductrice souple

Also Published As

Publication number Publication date
TW200303079A (en) 2003-08-16
US20030151145A1 (en) 2003-08-14
TWI236753B (en) 2005-07-21
EP1328015A3 (fr) 2003-12-03
EP1328015A2 (fr) 2003-07-16
US6946745B2 (en) 2005-09-20

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