TW555151U - Flip-chip package - Google Patents

Flip-chip package

Info

Publication number
TW555151U
TW555151U TW91221792U TW91221792U TW555151U TW 555151 U TW555151 U TW 555151U TW 91221792 U TW91221792 U TW 91221792U TW 91221792 U TW91221792 U TW 91221792U TW 555151 U TW555151 U TW 555151U
Authority
TW
Taiwan
Prior art keywords
flip
chip package
package
chip
Prior art date
Application number
TW91221792U
Other languages
Chinese (zh)
Inventor
Chaur-Chin Yang
Sung-Fei Wang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW91221792U priority Critical patent/TW555151U/en
Publication of TW555151U publication Critical patent/TW555151U/en

Links

TW91221792U 2002-12-30 2002-12-30 Flip-chip package TW555151U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91221792U TW555151U (en) 2002-12-30 2002-12-30 Flip-chip package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91221792U TW555151U (en) 2002-12-30 2002-12-30 Flip-chip package

Publications (1)

Publication Number Publication Date
TW555151U true TW555151U (en) 2003-09-21

Family

ID=31975470

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91221792U TW555151U (en) 2002-12-30 2002-12-30 Flip-chip package

Country Status (1)

Country Link
TW (1) TW555151U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104103605A (en) * 2013-04-01 2014-10-15 矽品精密工业股份有限公司 Semiconductor package and fabrication method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104103605A (en) * 2013-04-01 2014-10-15 矽品精密工业股份有限公司 Semiconductor package and fabrication method thereof

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model