TW539245U - Flip-chip package substrate - Google Patents

Flip-chip package substrate

Info

Publication number
TW539245U
TW539245U TW91210605U TW91210605U TW539245U TW 539245 U TW539245 U TW 539245U TW 91210605 U TW91210605 U TW 91210605U TW 91210605 U TW91210605 U TW 91210605U TW 539245 U TW539245 U TW 539245U
Authority
TW
Taiwan
Prior art keywords
flip
package substrate
chip package
chip
substrate
Prior art date
Application number
TW91210605U
Other languages
Chinese (zh)
Inventor
Chi-Hsing Hsu
Hsueh-Kuo Liao
Jimmy Hsu
Original Assignee
Via Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Tech Inc filed Critical Via Tech Inc
Priority to TW91210605U priority Critical patent/TW539245U/en
Publication of TW539245U publication Critical patent/TW539245U/en

Links

TW91210605U 2002-07-12 2002-07-12 Flip-chip package substrate TW539245U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91210605U TW539245U (en) 2002-07-12 2002-07-12 Flip-chip package substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91210605U TW539245U (en) 2002-07-12 2002-07-12 Flip-chip package substrate

Publications (1)

Publication Number Publication Date
TW539245U true TW539245U (en) 2003-06-21

Family

ID=29547373

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91210605U TW539245U (en) 2002-07-12 2002-07-12 Flip-chip package substrate

Country Status (1)

Country Link
TW (1) TW539245U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model