TW592387U - Flip-chip packaging substrate - Google Patents

Flip-chip packaging substrate

Info

Publication number
TW592387U
TW592387U TW91203961U TW91203961U TW592387U TW 592387 U TW592387 U TW 592387U TW 91203961 U TW91203961 U TW 91203961U TW 91203961 U TW91203961 U TW 91203961U TW 592387 U TW592387 U TW 592387U
Authority
TW
Taiwan
Prior art keywords
flip
packaging substrate
chip packaging
chip
substrate
Prior art date
Application number
TW91203961U
Other languages
Chinese (zh)
Inventor
Jr-Shing Shiu
Original Assignee
Via Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Tech Inc filed Critical Via Tech Inc
Priority to TW91203961U priority Critical patent/TW592387U/en
Publication of TW592387U publication Critical patent/TW592387U/en

Links

TW91203961U 2002-03-29 2002-03-29 Flip-chip packaging substrate TW592387U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91203961U TW592387U (en) 2002-03-29 2002-03-29 Flip-chip packaging substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91203961U TW592387U (en) 2002-03-29 2002-03-29 Flip-chip packaging substrate

Publications (1)

Publication Number Publication Date
TW592387U true TW592387U (en) 2004-06-11

Family

ID=34058209

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91203961U TW592387U (en) 2002-03-29 2002-03-29 Flip-chip packaging substrate

Country Status (1)

Country Link
TW (1) TW592387U (en)

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Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model