SG11202111369UA - Mounting device - Google Patents
Mounting deviceInfo
- Publication number
- SG11202111369UA SG11202111369UA SG11202111369UA SG11202111369UA SG11202111369UA SG 11202111369U A SG11202111369U A SG 11202111369UA SG 11202111369U A SG11202111369U A SG 11202111369UA SG 11202111369U A SG11202111369U A SG 11202111369UA SG 11202111369U A SG11202111369U A SG 11202111369UA
- Authority
- SG
- Singapore
- Prior art keywords
- mounting device
- mounting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
- B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
- B25J13/088—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices with position, velocity or acceleration sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/04—Gripping heads and other end effectors with provision for the remote detachment or exchange of the head or parts thereof
- B25J15/0408—Connections means
- B25J15/0441—Connections means having vacuum or magnetic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/04—Gripping heads and other end effectors with provision for the remote detachment or exchange of the head or parts thereof
- B25J15/0466—Gripping heads and other end effectors with provision for the remote detachment or exchange of the head or parts thereof with means for checking exchange completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/12—Programme-controlled manipulators characterised by positioning means for manipulator elements electric
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Human Computer Interaction (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019076886 | 2019-04-15 | ||
PCT/JP2020/016294 WO2020213567A1 (ja) | 2019-04-15 | 2020-04-13 | 実装装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202111369UA true SG11202111369UA (en) | 2021-11-29 |
Family
ID=72837902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202111369UA SG11202111369UA (en) | 2019-04-15 | 2020-04-13 | Mounting device |
Country Status (7)
Country | Link |
---|---|
US (1) | US20220216078A1 (ko) |
JP (1) | JP7228932B2 (ko) |
KR (1) | KR102651709B1 (ko) |
CN (1) | CN113711340A (ko) |
SG (1) | SG11202111369UA (ko) |
TW (1) | TWI744850B (ko) |
WO (1) | WO2020213567A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022157830A1 (ja) * | 2021-01-19 | 2022-07-28 | 株式会社新川 | 半導体装置の製造装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0951007A (ja) * | 1995-08-09 | 1997-02-18 | Mitsubishi Electric Corp | ダイボンド装置および半導体装置の製造方法 |
JPH09283990A (ja) * | 1996-04-10 | 1997-10-31 | Toshiba Corp | マウントヘッド及びボンディング装置 |
JPH11297764A (ja) * | 1998-04-14 | 1999-10-29 | Ricoh Co Ltd | ボンディングツール及びそれを用いた半導体チップのボンディング方法 |
CN1278823C (zh) * | 1999-10-29 | 2006-10-11 | 松下电器产业株式会社 | 吸附式吸管和利用其安装零部件的方法及装置 |
JP3700135B2 (ja) * | 2003-04-11 | 2005-09-28 | 日本航空電子工業株式会社 | ボンディング装置 |
JP4381866B2 (ja) * | 2003-09-16 | 2009-12-09 | Juki株式会社 | 電子部品搭載ヘッド |
JP2007200914A (ja) | 2005-12-26 | 2007-08-09 | Murata Mfg Co Ltd | 部品実装ヘッドおよび部品実装装置 |
CN101689512B (zh) * | 2007-06-28 | 2012-04-04 | 雅马哈发动机株式会社 | 元件移载装置 |
TWI398931B (zh) | 2009-07-03 | 2013-06-11 | Wecon Automation Corp | 驅動裝置及固晶機 |
KR101044622B1 (ko) * | 2011-01-14 | 2011-06-29 | 주식회사 아이. 피. 에스시스템 | 반도체 칩 본딩장치 |
JP5953069B2 (ja) | 2012-02-29 | 2016-07-13 | ファスフォードテクノロジ株式会社 | ダイボンダ |
WO2014080472A1 (ja) * | 2012-11-21 | 2014-05-30 | 富士機械製造株式会社 | 電子回路部品装着ヘッド |
JP5912143B2 (ja) * | 2014-03-04 | 2016-04-27 | 株式会社新川 | ボンディング装置 |
CN107409490B (zh) * | 2015-02-24 | 2019-10-01 | 株式会社富士 | 元件安装机 |
JP6385888B2 (ja) | 2015-05-14 | 2018-09-05 | キヤノンマシナリー株式会社 | リニアモータ構造 |
JP2017041532A (ja) | 2015-08-20 | 2017-02-23 | アピックヤマダ株式会社 | チップ剥離装置、およびチップ剥離方法 |
JP6573813B2 (ja) * | 2015-09-30 | 2019-09-11 | ファスフォードテクノロジ株式会社 | ダイボンダおよび半導体装置の製造方法 |
US10910248B2 (en) * | 2016-01-06 | 2021-02-02 | Shinkawa Ltd. | Electronic component mounting apparatus |
TWI632626B (zh) * | 2016-01-06 | 2018-08-11 | 日商新川股份有限公司 | Electronic parts processing unit |
-
2020
- 2020-04-01 TW TW109111353A patent/TWI744850B/zh active
- 2020-04-13 SG SG11202111369UA patent/SG11202111369UA/en unknown
- 2020-04-13 US US17/603,938 patent/US20220216078A1/en active Pending
- 2020-04-13 KR KR1020217036729A patent/KR102651709B1/ko active IP Right Grant
- 2020-04-13 CN CN202080028929.9A patent/CN113711340A/zh active Pending
- 2020-04-13 WO PCT/JP2020/016294 patent/WO2020213567A1/ja active Application Filing
- 2020-04-13 JP JP2021514937A patent/JP7228932B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TWI744850B (zh) | 2021-11-01 |
CN113711340A (zh) | 2021-11-26 |
JP7228932B2 (ja) | 2023-02-27 |
KR102651709B1 (ko) | 2024-03-28 |
KR20210144899A (ko) | 2021-11-30 |
US20220216078A1 (en) | 2022-07-07 |
TW202040725A (zh) | 2020-11-01 |
JPWO2020213567A1 (ko) | 2020-10-22 |
WO2020213567A1 (ja) | 2020-10-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA186074S (en) | Device mount | |
GB2583998B (en) | Securing device | |
SG11202110089XA (en) | Attachment device | |
CA191964S (en) | Securing device | |
LT3536459T (lt) | Montavimo aparatas | |
SG11202005070UA (en) | Mounting device | |
SG11202111369UA (en) | Mounting device | |
SG11202105735WA (en) | Mounting device | |
GB202113171D0 (en) | Acoustofluidic device | |
GB2589545B (en) | Device | |
PL3792416T3 (pl) | Przyrząd mocujący | |
CA186047S (en) | Vaping device | |
GB201904274D0 (en) | Attachment device | |
GB202318772D0 (en) | Photochemsitry device | |
HUE061472T2 (hu) | Vérelválasztó készülék | |
GB201914708D0 (en) | Securing device | |
GB201914242D0 (en) | Dispencing Device | |
GB201911709D0 (en) | Device | |
IL268561A (en) | A self-learning tool | |
GB201906023D0 (en) | Securing device | |
GB201909957D0 (en) | Device | |
FI12484U1 (fi) | Pölynpoistolaite | |
GB201908195D0 (en) | Aerosol-provision device | |
GB201904007D0 (en) | Securing device | |
GB201906882D0 (en) | Nanorobotic device |