SG11202110193YA - Method of manufacturing semiconductor device, substrate processing apparatus device, and program - Google Patents

Method of manufacturing semiconductor device, substrate processing apparatus device, and program

Info

Publication number
SG11202110193YA
SG11202110193YA SG11202110193YA SG11202110193YA SG11202110193YA SG 11202110193Y A SG11202110193Y A SG 11202110193YA SG 11202110193Y A SG11202110193Y A SG 11202110193YA SG 11202110193Y A SG11202110193Y A SG 11202110193YA SG 11202110193Y A SG11202110193Y A SG 11202110193YA
Authority
SG
Singapore
Prior art keywords
program
processing apparatus
substrate processing
manufacturing semiconductor
semiconductor device
Prior art date
Application number
SG11202110193YA
Other languages
English (en)
Inventor
Takatomo Yamaguchi
Hidenari Yoshida
Kenji Ono
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Publication of SG11202110193YA publication Critical patent/SG11202110193YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11202110193YA 2019-03-19 2019-03-19 Method of manufacturing semiconductor device, substrate processing apparatus device, and program SG11202110193YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/011456 WO2020188743A1 (ja) 2019-03-19 2019-03-19 半導体装置の製造方法、基板処理装置および記録媒体

Publications (1)

Publication Number Publication Date
SG11202110193YA true SG11202110193YA (en) 2021-10-28

Family

ID=72520731

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202110193YA SG11202110193YA (en) 2019-03-19 2019-03-19 Method of manufacturing semiconductor device, substrate processing apparatus device, and program

Country Status (7)

Country Link
US (1) US11990359B2 (zh)
JP (1) JP7214834B2 (zh)
KR (1) KR20210127738A (zh)
CN (1) CN113597666A (zh)
SG (1) SG11202110193YA (zh)
TW (2) TW202145428A (zh)
WO (1) WO2020188743A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113597666A (zh) 2019-03-19 2021-11-02 株式会社国际电气 半导体装置的制造方法、基板处理装置和存储介质
CN115351020B (zh) * 2022-08-17 2024-05-17 长鑫存储技术有限公司 一种半导体设备自清洁方法、系统及装置
CN117276159A (zh) * 2023-11-17 2023-12-22 合肥晶合集成电路股份有限公司 晶圆运送系统

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1012703A (ja) * 1996-06-21 1998-01-16 Sharp Corp 移換え装置
US5943230A (en) * 1996-12-19 1999-08-24 Applied Materials, Inc. Computer-implemented inter-chamber synchronization in a multiple chamber substrate processing system
JPH10335426A (ja) * 1997-06-05 1998-12-18 Sony Corp 半導体製造装置における基板移載機構
JPH1167678A (ja) * 1997-08-20 1999-03-09 Kokusai Electric Co Ltd 縦型炉
JP2001068425A (ja) * 1999-08-31 2001-03-16 Hitachi Kokusai Electric Inc 半導体熱処理装置及び方法
JP4086146B2 (ja) * 2002-03-26 2008-05-14 株式会社日立国際電気 半導体装置の製造方法および基板処理装置
JP2004006508A (ja) 2002-05-31 2004-01-08 Sharp Corp 基板保持用治具および基板表面処理装置。
JP2007027159A (ja) 2005-07-12 2007-02-01 Hitachi Kokusai Electric Inc 基板処理装置
JP2007311724A (ja) * 2006-05-22 2007-11-29 Sharp Corp 基板搬送方法及び基板処理装置
JP2011060842A (ja) 2009-09-07 2011-03-24 Hitachi Kokusai Electric Inc 基板処理装置、基板保持体、及び半導体装置の製造方法
JP2012174782A (ja) * 2011-02-18 2012-09-10 Hitachi Kokusai Electric Inc 基板処理装置及び半導体装置の製造方法
JP5686487B2 (ja) * 2011-06-03 2015-03-18 株式会社日立国際電気 半導体装置の製造方法、基板処理方法、基板処理装置およびプログラム
KR101215511B1 (ko) * 2012-06-27 2012-12-26 (주)이노시티 프로세스 챔버 및 기판 처리 장치
KR101390474B1 (ko) 2013-04-08 2014-05-07 주식회사 유진테크 기판처리장치
KR101557016B1 (ko) 2013-10-17 2015-10-05 주식회사 유진테크 기판 처리장치
JP6095825B2 (ja) 2016-04-08 2017-03-15 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
JP6710168B2 (ja) 2016-04-19 2020-06-17 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、装置管理コントローラ及びプログラム並びに半導体装置の製造方法
JP6747136B2 (ja) * 2016-07-22 2020-08-26 東京エレクトロン株式会社 基板処理装置
JP6456893B2 (ja) 2016-09-26 2019-01-23 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、記録媒体および基板処理装置
CN113597666A (zh) 2019-03-19 2021-11-02 株式会社国际电气 半导体装置的制造方法、基板处理装置和存储介质

Also Published As

Publication number Publication date
KR20210127738A (ko) 2021-10-22
JP7214834B2 (ja) 2023-01-30
TW202145428A (zh) 2021-12-01
CN113597666A (zh) 2021-11-02
JPWO2020188743A1 (ja) 2021-12-09
WO2020188743A1 (ja) 2020-09-24
US11990359B2 (en) 2024-05-21
TWI761758B (zh) 2022-04-21
TW202101650A (zh) 2021-01-01
US20220005717A1 (en) 2022-01-06

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