SG11202109765QA - Traveling vehicle system - Google Patents

Traveling vehicle system

Info

Publication number
SG11202109765QA
SG11202109765QA SG11202109765QA SG11202109765QA SG 11202109765Q A SG11202109765Q A SG 11202109765QA SG 11202109765Q A SG11202109765Q A SG 11202109765QA SG 11202109765Q A SG11202109765Q A SG 11202109765QA
Authority
SG
Singapore
Prior art keywords
vehicle system
traveling vehicle
traveling
vehicle
Prior art date
Application number
Other languages
English (en)
Inventor
Hidetoshi Fujiwara
Original Assignee
Murata Machinery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Machinery Ltd filed Critical Murata Machinery Ltd
Publication of SG11202109765QA publication Critical patent/SG11202109765QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B61—RAILWAYS
    • B61B—RAILWAY SYSTEMS; EQUIPMENT THEREFOR NOT OTHERWISE PROVIDED FOR
    • B61B13/00—Other railway systems
    • B61B13/12—Systems with propulsion devices between or alongside the rails, e.g. pneumatic systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B61—RAILWAYS
    • B61B—RAILWAY SYSTEMS; EQUIPMENT THEREFOR NOT OTHERWISE PROVIDED FOR
    • B61B3/00—Elevated railway systems with suspended vehicles
    • B61B3/02—Elevated railway systems with suspended vehicles with self-propelled vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical & Material Sciences (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
  • Platform Screen Doors And Railroad Systems (AREA)
  • Transplanting Machines (AREA)
  • Current-Collector Devices For Electrically Propelled Vehicles (AREA)
  • Carriers, Traveling Bodies, And Overhead Traveling Cranes (AREA)
  • Harvester Elements (AREA)
SG11202109765Q 2019-04-03 2020-02-18 Traveling vehicle system SG11202109765QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019071206 2019-04-03
PCT/JP2020/006371 WO2020202856A1 (ja) 2019-04-03 2020-02-18 走行車システム

Publications (1)

Publication Number Publication Date
SG11202109765QA true SG11202109765QA (en) 2021-10-28

Family

ID=72668721

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202109765Q SG11202109765QA (en) 2019-04-03 2020-02-18 Traveling vehicle system

Country Status (9)

Country Link
US (1) US20220161833A1 (de)
EP (1) EP3950457B1 (de)
JP (1) JP7099622B2 (de)
KR (1) KR20210140760A (de)
CN (1) CN113557186B (de)
IL (1) IL286075B1 (de)
SG (1) SG11202109765QA (de)
TW (1) TWI821552B (de)
WO (1) WO2020202856A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024038671A1 (ja) * 2022-08-18 2024-02-22 村田機械株式会社 走行車システム

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE369236B (de) * 1969-12-05 1974-08-12 Alden Self Transit Syst
JP4240843B2 (ja) * 2001-04-27 2009-03-18 村田機械株式会社 有軌道台車システム
JP2003079074A (ja) * 2001-08-31 2003-03-14 Daifuku Co Ltd 搬送設備
KR100520061B1 (ko) * 2002-12-06 2005-10-11 삼성전자주식회사 오버헤드타입 이송장치
US7437425B2 (en) * 2003-09-30 2008-10-14 Emc Corporation Data storage system having shared resource
JP4895079B2 (ja) * 2005-04-20 2012-03-14 村田機械株式会社 天井走行車システム
JP4360361B2 (ja) * 2005-08-18 2009-11-11 村田機械株式会社 搬送車の軌道
JP4265678B2 (ja) 2007-07-05 2009-05-20 株式会社ダイフク 移動体使用の搬送設備
JP5263613B2 (ja) * 2009-05-11 2013-08-14 株式会社ダイフク 物品搬送設備
TW201111257A (en) * 2009-09-30 2011-04-01 Inotera Memories Inc Method for temporarily supplying power
JP5141987B2 (ja) * 2009-12-07 2013-02-13 株式会社ダイフク 物品搬送設備
JP2012001174A (ja) * 2010-06-21 2012-01-05 Murata Machinery Ltd 有軌道台車システム
CN103723516A (zh) * 2013-12-25 2014-04-16 上海集成电路研发中心有限公司 维修车及amhs系统
JP6268639B2 (ja) * 2014-02-27 2018-01-31 三菱重工業株式会社 交差軌道、及び転換装置
JP6278341B2 (ja) * 2015-04-06 2018-02-14 株式会社ダイフク 物品搬送設備
JP6559235B2 (ja) * 2015-05-29 2019-08-14 株式会社安川電機 搬送システム及び搬送設備構築方法
JP6693428B2 (ja) 2017-01-23 2020-05-13 株式会社ダイフク 物品搬送車
JP2018176950A (ja) * 2017-04-11 2018-11-15 村田機械株式会社 走行車システム

Also Published As

Publication number Publication date
IL286075B1 (en) 2024-06-01
JPWO2020202856A1 (ja) 2021-12-23
IL286075A (en) 2021-10-31
TW202045389A (zh) 2020-12-16
WO2020202856A1 (ja) 2020-10-08
KR20210140760A (ko) 2021-11-23
EP3950457B1 (de) 2024-04-10
EP3950457A1 (de) 2022-02-09
US20220161833A1 (en) 2022-05-26
EP3950457A4 (de) 2022-12-28
JP7099622B2 (ja) 2022-07-12
CN113557186B (zh) 2024-02-13
CN113557186A (zh) 2021-10-26
TWI821552B (zh) 2023-11-11

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