SG11202106829WA - Process for fabricating a substrate for a front-side image sensor - Google Patents

Process for fabricating a substrate for a front-side image sensor

Info

Publication number
SG11202106829WA
SG11202106829WA SG11202106829WA SG11202106829WA SG11202106829WA SG 11202106829W A SG11202106829W A SG 11202106829WA SG 11202106829W A SG11202106829W A SG 11202106829WA SG 11202106829W A SG11202106829W A SG 11202106829WA SG 11202106829W A SG11202106829W A SG 11202106829WA
Authority
SG
Singapore
Prior art keywords
fabricating
substrate
image sensor
side image
sensor
Prior art date
Application number
SG11202106829WA
Other languages
English (en)
Inventor
Walter Schwarzenbach
Ludovic Ecarnot
Damien Massy
Mohamed Nadia Ben
Nicolas Daval
Christophe Girard
Christophe Maleville
Original Assignee
Soitec Silicon On Insulator
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator filed Critical Soitec Silicon On Insulator
Publication of SG11202106829WA publication Critical patent/SG11202106829WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
    • H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
    • H01L21/2652—Through-implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
    • H01L21/3223—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering using cavities formed by hydrogen or noble gas ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
    • H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
    • H01L21/3226—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering of silicon on insulator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1463—Pixel isolation structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)
  • Recrystallisation Techniques (AREA)
SG11202106829WA 2018-12-24 2019-12-23 Process for fabricating a substrate for a front-side image sensor SG11202106829WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1874134A FR3091000B1 (fr) 2018-12-24 2018-12-24 Procede de fabrication d’un substrat pour un capteur d’image de type face avant
PCT/FR2019/053281 WO2020136344A1 (fr) 2018-12-24 2019-12-23 Procede de fabrication d'un substrat pour un capteur d'image de type face avant

Publications (1)

Publication Number Publication Date
SG11202106829WA true SG11202106829WA (en) 2021-07-29

Family

ID=67956837

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202106829WA SG11202106829WA (en) 2018-12-24 2019-12-23 Process for fabricating a substrate for a front-side image sensor

Country Status (10)

Country Link
US (1) US12100727B2 (de)
EP (1) EP3903341B1 (de)
JP (1) JP7392243B2 (de)
KR (1) KR20210104876A (de)
CN (1) CN113228248B (de)
FR (1) FR3091000B1 (de)
IL (1) IL284308B2 (de)
SG (1) SG11202106829WA (de)
TW (1) TWI810422B (de)
WO (1) WO2020136344A1 (de)

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3171322B2 (ja) * 1997-03-11 2001-05-28 日本電気株式会社 Ｓｏｉ基板およびその製造方法
US6548382B1 (en) * 1997-07-18 2003-04-15 Silicon Genesis Corporation Gettering technique for wafers made using a controlled cleaving process
US6083324A (en) 1998-02-19 2000-07-04 Silicon Genesis Corporation Gettering technique for silicon-on-insulator wafers
JP2000349264A (ja) * 1998-12-04 2000-12-15 Canon Inc 半導体ウエハの製造方法、使用方法および利用方法
DE10131249A1 (de) 2001-06-28 2002-05-23 Wacker Siltronic Halbleitermat Verfahren zur Herstellung eines Films oder einer Schicht aus halbleitendem Material
FR2845523B1 (fr) * 2002-10-07 2005-10-28 Procede pour realiser un substrat par transfert d'une plaquette donneuse comportant des especes etrangeres, et plaquette donneuse associee
JP4910275B2 (ja) 2004-09-21 2012-04-04 ソニー株式会社 固体撮像素子及びその製造方法
FR2890489B1 (fr) 2005-09-08 2008-03-07 Soitec Silicon On Insulator Procede de fabrication d'une heterostructure de type semi-conducteur sur isolant
US20080070340A1 (en) 2006-09-14 2008-03-20 Nicholas Francis Borrelli Image sensor using thin-film SOI
JP2010010615A (ja) * 2008-06-30 2010-01-14 Sumco Corp 固体撮像素子用シリコン基板およびその製造方法
JP2010062452A (ja) 2008-09-05 2010-03-18 Sumco Corp 半導体基板の製造方法
JP2010114409A (ja) 2008-10-10 2010-05-20 Sony Corp Ｓｏｉ基板とその製造方法、固体撮像装置とその製造方法、および撮像装置
FR2938119B1 (fr) * 2008-10-30 2011-04-22 Soitec Silicon On Insulator Procede de detachement de couches semi-conductrices a basse temperature
JP2010258083A (ja) * 2009-04-22 2010-11-11 Panasonic Corp Ｓｏｉウェーハ、その製造方法および半導体装置の製造方法
JP5420968B2 (ja) * 2009-05-07 2014-02-19 信越化学工業株式会社 貼り合わせウェーハの製造方法
JP2011014673A (ja) * 2009-07-01 2011-01-20 Panasonic Corp Ｓｏｉ基板とその製造方法およびそれを用いた固体撮像装置の製造方法
US8614112B2 (en) 2010-10-01 2013-12-24 Omnivision Technologies, Inc. Method of damage-free impurity doping for CMOS image sensors
FR2974944B1 (fr) * 2011-05-02 2013-06-14 Commissariat Energie Atomique Procédé de formation d'une fracture dans un matériau
FR2983342B1 (fr) 2011-11-30 2016-05-20 Soitec Silicon On Insulator Procede de fabrication d'une heterostructure limitant la formation de defauts et heterostructure ainsi obtenue
JP5696081B2 (ja) * 2012-03-23 2015-04-08 株式会社東芝 固体撮像装置
US8736006B1 (en) 2013-03-14 2014-05-27 Taiwan Semiconductor Manufacturing Company, Ltd. Backside structure for a BSI image sensor device
CN103794471A (zh) * 2014-01-14 2014-05-14 上海新储集成电路有限公司 一种化合物半导体衬底的制备方法
WO2016081313A1 (en) * 2014-11-18 2016-05-26 Sunedison Semiconductor Limited A method of manufacturing high resistivity semiconductor-on-insulator wafers with charge trapping layers
FR3061802B1 (fr) 2017-01-11 2019-08-16 Soitec Substrat pour capteur d'image de type face avant et procede de fabrication d'un tel substrat
EP3410486B1 (de) * 2017-06-02 2022-08-24 ams AG Resonanzhohlraumbildsensor
US20190027576A1 (en) * 2017-07-21 2019-01-24 Qualcomm Incorporated Composite channel metal-oxide-semiconductor field effect transistor (mosfet)
CN108598105B (zh) 2018-06-26 2020-10-13 矽照光电（厦门）有限公司 一种柔性有源彩色显示模块生产方法

Also Published As

Publication number Publication date
IL284308B2 (en) 2024-03-01
TW202101545A (zh) 2021-01-01
US20220059603A1 (en) 2022-02-24
TWI810422B (zh) 2023-08-01
KR20210104876A (ko) 2021-08-25
CN113228248A (zh) 2021-08-06
WO2020136344A1 (fr) 2020-07-02
FR3091000B1 (fr) 2020-12-04
EP3903341B1 (de) 2023-01-18
IL284308B1 (en) 2023-11-01
US12100727B2 (en) 2024-09-24
JP2022515096A (ja) 2022-02-17
FR3091000A1 (fr) 2020-06-26
JP7392243B2 (ja) 2023-12-06
CN113228248B (zh) 2024-10-01
EP3903341A1 (de) 2021-11-03
IL284308A (en) 2021-08-31

Similar Documents

Publication Publication Date Title
ZA202005040B (en) Processes for producing optical effects layers
GB201811539D0 (en) Fabrication process for a/m/x materials
GB202006556D0 (en) A cover for a camera
SG10201902421UA (en) Image sensor
SG11202101776XA (en) Process for fabricating a cfet device
IL278858A (en) Array characteristics for a hybrid image sensor
HUE061342T2 (hu) Eljárás fólia elõállítására
GB201804929D0 (en) Process for oxidising a substrate
EP3886170A4 (de) Substrat für einen bildsensor
EP3882939A4 (de) Verfahren zur herstellung eines sensors
HUE064895T2 (hu) Eljárás palbociklib elõállítására
SG11202009447XA (en) Process for transferring a layer
GB2574619B (en) Image sensor
IL284308A (en) Process for manufacturing a substrate for a front image sensor
EP3811864C0 (de) System zur erfassung eines fusssohlenbildes
IL287793A (en) A method to create a film
SG11202109934RA (en) Process for fabricating a semiconductor-on-insulator substrate
GB201812983D0 (en) Method for aligning an image sensor for a lens
GB201915639D0 (en) A sensor
GB201913288D0 (en) A sensor
EP3749623C0 (de) Verfahren zur modifizierung einer festen oberfläche
GB201821129D0 (en) A sensor
EP3835033A4 (de) Verfahren zur herstellung eines sensors durch drucken
EP3492980A4 (de) Verfahren zur herstellung eines bildscanners
CA194740S (en) Frame for cameras