SG11202106472PA - Method for slicing workpiece and wire saw - Google Patents
Method for slicing workpiece and wire sawInfo
- Publication number
- SG11202106472PA SG11202106472PA SG11202106472PA SG11202106472PA SG11202106472PA SG 11202106472P A SG11202106472P A SG 11202106472PA SG 11202106472P A SG11202106472P A SG 11202106472PA SG 11202106472P A SG11202106472P A SG 11202106472PA SG 11202106472P A SG11202106472P A SG 11202106472PA
- Authority
- SG
- Singapore
- Prior art keywords
- wire saw
- slicing
- workpiece
- slicing workpiece
- saw
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0683—Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019004381A JP6969579B2 (ja) | 2019-01-15 | 2019-01-15 | ワークの切断方法及びワイヤソー |
PCT/JP2019/050777 WO2020149125A1 (ja) | 2019-01-15 | 2019-12-25 | ワークの切断方法及びワイヤソー |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202106472PA true SG11202106472PA (en) | 2021-07-29 |
Family
ID=71614327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202106472PA SG11202106472PA (en) | 2019-01-15 | 2019-12-25 | Method for slicing workpiece and wire saw |
Country Status (7)
Country | Link |
---|---|
US (1) | US20220016802A1 (ja) |
JP (1) | JP6969579B2 (ja) |
KR (1) | KR20210113204A (ja) |
CN (1) | CN113226640B (ja) |
DE (1) | DE112019005935T5 (ja) |
SG (1) | SG11202106472PA (ja) |
WO (1) | WO2020149125A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113478665A (zh) * | 2021-07-14 | 2021-10-08 | 山西汇智博科科技发展有限公司 | 一种高精度半导体加工用单线切割机 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3656317B2 (ja) | 1996-03-27 | 2005-06-08 | 信越半導体株式会社 | ワイヤソーによるワーク切断方法及び装置 |
JP2000158319A (ja) * | 1998-11-27 | 2000-06-13 | Fujikoshi Mach Corp | ダイヤモンドワイヤーソー及び切断加工方法 |
JP2002254327A (ja) * | 2001-03-02 | 2002-09-10 | Ngk Insulators Ltd | ワイヤーソー用ソーワイヤーおよびそれを用いた加工方法 |
CN101502945B (zh) * | 2009-03-16 | 2011-04-06 | 浙江工业大学 | 新型线锯 |
JP2011031386A (ja) * | 2009-07-10 | 2011-02-17 | Mitsubishi Chemicals Corp | 電着式固定砥粒ワイヤーおよびこれを用いた結晶スライス方法 |
JP5263536B2 (ja) * | 2009-07-14 | 2013-08-14 | 信越半導体株式会社 | ワークの切断方法 |
JP5045765B2 (ja) * | 2010-01-20 | 2012-10-10 | 信越半導体株式会社 | インゴットの切断方法及びワイヤソー |
CN102225593B (zh) * | 2011-04-29 | 2014-03-05 | 桂林创源金刚石有限公司 | 金刚石线锯装置 |
DE102012201938B4 (de) * | 2012-02-09 | 2015-03-05 | Siltronic Ag | Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben von einem Werkstück |
JP2015147293A (ja) * | 2014-01-09 | 2015-08-20 | 株式会社コベルコ科研 | 被加工物の切断方法 |
JP6272801B2 (ja) * | 2015-07-27 | 2018-01-31 | 信越半導体株式会社 | ワークホルダー及びワークの切断方法 |
JP6402700B2 (ja) * | 2015-10-20 | 2018-10-10 | 信越半導体株式会社 | ワークの切断方法及びワイヤソー |
WO2018203448A1 (ja) * | 2017-05-02 | 2018-11-08 | 信越半導体株式会社 | ワークの切断方法及び接合部材 |
-
2019
- 2019-01-15 JP JP2019004381A patent/JP6969579B2/ja active Active
- 2019-12-25 KR KR1020217020824A patent/KR20210113204A/ko active Search and Examination
- 2019-12-25 SG SG11202106472PA patent/SG11202106472PA/en unknown
- 2019-12-25 WO PCT/JP2019/050777 patent/WO2020149125A1/ja active Application Filing
- 2019-12-25 DE DE112019005935.1T patent/DE112019005935T5/de active Pending
- 2019-12-25 CN CN201980086892.2A patent/CN113226640B/zh active Active
- 2019-12-25 US US17/413,810 patent/US20220016802A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20220016802A1 (en) | 2022-01-20 |
KR20210113204A (ko) | 2021-09-15 |
JP2020110886A (ja) | 2020-07-27 |
DE112019005935T5 (de) | 2021-08-19 |
CN113226640B (zh) | 2023-04-18 |
CN113226640A (zh) | 2021-08-06 |
WO2020149125A1 (ja) | 2020-07-23 |
JP6969579B2 (ja) | 2021-11-24 |
TW202035090A (zh) | 2020-10-01 |
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