SG11202100703SA - Systems for workpiece processing with plasma - Google Patents

Systems for workpiece processing with plasma

Info

Publication number
SG11202100703SA
SG11202100703SA SG11202100703SA SG11202100703SA SG11202100703SA SG 11202100703S A SG11202100703S A SG 11202100703SA SG 11202100703S A SG11202100703S A SG 11202100703SA SG 11202100703S A SG11202100703S A SG 11202100703SA SG 11202100703S A SG11202100703S A SG 11202100703SA
Authority
SG
Singapore
Prior art keywords
plasma
systems
workpiece processing
workpiece
processing
Prior art date
Application number
SG11202100703SA
Other languages
English (en)
Inventor
Thomas Bolden
James Harroun
Bob Condrashoff
John Guinn
Original Assignee
Nordson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nordson Corp filed Critical Nordson Corp
Publication of SG11202100703SA publication Critical patent/SG11202100703SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32633—Baffles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
SG11202100703SA 2018-07-30 2019-06-10 Systems for workpiece processing with plasma SG11202100703SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862712051P 2018-07-30 2018-07-30
PCT/US2019/036328 WO2020027919A1 (en) 2018-07-30 2019-06-10 Systems for workpiece processing with plasma

Publications (1)

Publication Number Publication Date
SG11202100703SA true SG11202100703SA (en) 2021-02-25

Family

ID=67108144

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202100703SA SG11202100703SA (en) 2018-07-30 2019-06-10 Systems for workpiece processing with plasma

Country Status (6)

Country Link
US (1) US20210287884A1 (ko)
JP (1) JP7451490B2 (ko)
KR (1) KR20210039422A (ko)
CN (1) CN112673450A (ko)
SG (1) SG11202100703SA (ko)
WO (1) WO2020027919A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7261675B2 (ja) * 2019-07-01 2023-04-20 東京エレクトロン株式会社 加熱処理装置及び加熱処理方法

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US6972071B1 (en) * 1999-07-13 2005-12-06 Nordson Corporation High-speed symmetrical plasma treatment system
JP4330315B2 (ja) * 2002-03-29 2009-09-16 東京エレクトロン株式会社 プラズマ処理装置
JP4180304B2 (ja) 2002-05-28 2008-11-12 東京エレクトロン株式会社 処理装置
US7009281B2 (en) * 2003-03-14 2006-03-07 Lam Corporation Small volume process chamber with hot inner surfaces
JP4399452B2 (ja) * 2004-06-15 2010-01-13 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
US7845309B2 (en) 2004-07-13 2010-12-07 Nordson Corporation Ultra high speed uniform plasma processing system
KR100868953B1 (ko) * 2004-10-15 2008-11-17 가부시키가이샤 히다치 고쿠사이 덴키 기판처리장치 및 반도체장치의 제조방법
JP4654738B2 (ja) * 2005-04-05 2011-03-23 パナソニック株式会社 プラズマ処理装置
CN100358097C (zh) 2005-08-05 2007-12-26 中微半导体设备(上海)有限公司 半导体工艺处理系统及其处理方法
US20070266945A1 (en) * 2006-05-16 2007-11-22 Asm Japan K.K. Plasma cvd apparatus equipped with plasma blocking insulation plate
CN101506066B (zh) * 2006-08-22 2012-11-28 诺信公司 用于在处理系统中处理工件的设备和方法
US8603249B2 (en) * 2006-12-11 2013-12-10 Lg Electronics Inc. Lift pin driving device and manufacturing apparatus having same
US20080296261A1 (en) * 2007-06-01 2008-12-04 Nordson Corporation Apparatus and methods for improving treatment uniformity in a plasma process
KR100927375B1 (ko) * 2007-09-04 2009-11-19 주식회사 유진테크 배기 유닛 및 이를 이용하는 배기 조절 방법, 상기 배기 유닛을 포함하는 기판 처리 장치
US7824146B2 (en) * 2007-09-07 2010-11-02 Advanced Technology Development Facility Automated systems and methods for adapting semiconductor fabrication tools to process wafers of different diameters
US20110049100A1 (en) * 2008-01-16 2011-03-03 Charm Engineering Co., Ltd. Substrate holder, substrate supporting apparatus, substrate processing apparatus, and substrate processing method using the same
JP2010171286A (ja) * 2009-01-26 2010-08-05 Hitachi High-Technologies Corp プラズマ処理装置
JP5455462B2 (ja) * 2009-06-23 2014-03-26 株式会社日立ハイテクノロジーズ プラズマ処理装置
US10026436B2 (en) * 2009-07-01 2018-07-17 Nordson Corporation Apparatus and methods for supporting workpieces during plasma processing
JP5851681B2 (ja) * 2009-10-27 2016-02-03 東京エレクトロン株式会社 プラズマ処理装置
US8597462B2 (en) * 2010-05-21 2013-12-03 Lam Research Corporation Movable chamber liner plasma confinement screen combination for plasma processing apparatuses
US9443753B2 (en) 2010-07-30 2016-09-13 Applied Materials, Inc. Apparatus for controlling the flow of a gas in a process chamber
KR101062683B1 (ko) * 2010-09-01 2011-09-06 주성엔지니어링(주) 공정챔버의 측벽을 통하여 공정가스를 분사하고 배출하는 플라즈마 공정장비 및 이를 이용한 기판의 처리방법
US9070536B2 (en) * 2012-04-24 2015-06-30 Applied Materials, Inc. Plasma reactor electrostatic chuck with cooled process ring and heated workpiece support surface
US9948214B2 (en) * 2012-04-26 2018-04-17 Applied Materials, Inc. High temperature electrostatic chuck with real-time heat zone regulating capability
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JP6424726B2 (ja) * 2015-04-27 2018-11-21 株式会社Sumco サセプタ及びエピタキシャル成長装置
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US10679827B2 (en) 2017-01-25 2020-06-09 Applied Materials, Inc. Method and apparatus for semiconductor processing chamber isolation for reduced particles and improved uniformity

Also Published As

Publication number Publication date
JP7451490B2 (ja) 2024-03-18
US20210287884A1 (en) 2021-09-16
WO2020027919A1 (en) 2020-02-06
JP2021532598A (ja) 2021-11-25
CN112673450A (zh) 2021-04-16
KR20210039422A (ko) 2021-04-09

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