SG11202100514UA - Tape for glass processing - Google Patents

Tape for glass processing

Info

Publication number
SG11202100514UA
SG11202100514UA SG11202100514UA SG11202100514UA SG11202100514UA SG 11202100514U A SG11202100514U A SG 11202100514UA SG 11202100514U A SG11202100514U A SG 11202100514UA SG 11202100514U A SG11202100514U A SG 11202100514UA SG 11202100514U A SG11202100514U A SG 11202100514UA
Authority
SG
Singapore
Prior art keywords
tape
glass processing
glass
processing
Prior art date
Application number
SG11202100514UA
Other languages
English (en)
Inventor
Yukihiro Matsubara
Hirotoki Yokoi
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of SG11202100514UA publication Critical patent/SG11202100514UA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
SG11202100514UA 2019-05-29 2020-03-04 Tape for glass processing SG11202100514UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019100127A JP7269095B2 (ja) 2019-05-29 2019-05-29 ガラス加工用テープ
PCT/JP2020/009035 WO2020240964A1 (ja) 2019-05-29 2020-03-04 ガラス加工用テープ

Publications (1)

Publication Number Publication Date
SG11202100514UA true SG11202100514UA (en) 2021-02-25

Family

ID=73545917

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202100514UA SG11202100514UA (en) 2019-05-29 2020-03-04 Tape for glass processing

Country Status (7)

Country Link
JP (1) JP7269095B2 (ko)
KR (1) KR102505643B1 (ko)
CN (1) CN112351859B (ko)
PH (1) PH12021550127A1 (ko)
SG (1) SG11202100514UA (ko)
TW (1) TWI743810B (ko)
WO (1) WO2020240964A1 (ko)

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0235119B2 (ja) * 1982-12-27 1990-08-08 Tokyo Gasu Kk Suiheichokyorisakushinkohoniokerukutsusakuhetsudo
JPH10310749A (ja) * 1997-05-13 1998-11-24 Mitsui Chem Inc 半導体ウエハダイシング用粘着フィルム及び半導体ウエハのダイシング方法
JP4743732B2 (ja) * 1999-04-09 2011-08-10 株式会社カネカ 線材被覆用接着性積層フィルム
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
TWI310230B (en) * 2003-01-22 2009-05-21 Lintec Corp Adhesive sheet, method for protecting surface of semiconductor wafer and method for processing work
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
JP5519971B2 (ja) * 2008-11-26 2014-06-11 日東電工株式会社 ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP5290853B2 (ja) * 2009-04-28 2013-09-18 三菱樹脂株式会社 ダイシング用粘着シート
JP5554118B2 (ja) * 2010-03-31 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
JP5744434B2 (ja) * 2010-07-29 2015-07-08 日東電工株式会社 加熱剥離シート一体型半導体裏面用フィルム、半導体素子の回収方法、及び半導体装置の製造方法
KR20120068453A (ko) * 2010-12-17 2012-06-27 제일모직주식회사 다이싱 다이 본딩 필름
JP5764519B2 (ja) * 2011-03-31 2015-08-19 古河電気工業株式会社 ダイシングテープ及び半導体ウエハ加工方法
JP5019657B1 (ja) * 2011-10-27 2012-09-05 古河電気工業株式会社 半導体デバイス加工用粘着テープ
JP5053455B1 (ja) * 2011-10-28 2012-10-17 古河電気工業株式会社 半導体加工用ダイシングテープ
JP2013133464A (ja) * 2011-12-27 2013-07-08 Nitto Denko Corp ガラス板用粘着シート
JP5294358B2 (ja) * 2012-01-06 2013-09-18 古河電気工業株式会社 ウエハ加工用テープ及びこれを使用した半導体装置の製造方法
CN105143380B (zh) * 2013-03-28 2019-05-17 古河电气工业株式会社 粘合带及晶片加工用胶带
JP5607847B1 (ja) * 2013-11-29 2014-10-15 古河電気工業株式会社 半導体加工用粘着テープ
JP6295135B2 (ja) 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム
JP6506744B2 (ja) * 2014-05-12 2019-04-24 デンカ株式会社 半導体検査用の耐熱性粘着シート、及び半導体検査方法
JP6445315B2 (ja) * 2014-12-12 2018-12-26 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
CN107431002B (zh) 2015-03-24 2020-09-11 古河电气工业株式会社 半导体加工用带
JP2017147293A (ja) 2016-02-16 2017-08-24 日立化成株式会社 接着シートとダイシングテープを用いる半導体装置の製造方法
JP2018166148A (ja) * 2017-03-28 2018-10-25 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
JP6978890B2 (ja) * 2017-10-16 2021-12-08 リンテック株式会社 ダイシングダイボンディングシート及び半導体チップの製造方法
JP6535119B1 (ja) * 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ

Also Published As

Publication number Publication date
KR102505643B1 (ko) 2023-03-06
CN112351859B (zh) 2023-04-11
KR20210015891A (ko) 2021-02-10
WO2020240964A1 (ja) 2020-12-03
JP2020194905A (ja) 2020-12-03
TW202043400A (zh) 2020-12-01
PH12021550127A1 (en) 2021-10-04
CN112351859A (zh) 2021-02-09
JP7269095B2 (ja) 2023-05-08
TWI743810B (zh) 2021-10-21

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