JP7269095B2 - ガラス加工用テープ - Google Patents

ガラス加工用テープ Download PDF

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Publication number
JP7269095B2
JP7269095B2 JP2019100127A JP2019100127A JP7269095B2 JP 7269095 B2 JP7269095 B2 JP 7269095B2 JP 2019100127 A JP2019100127 A JP 2019100127A JP 2019100127 A JP2019100127 A JP 2019100127A JP 7269095 B2 JP7269095 B2 JP 7269095B2
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JP
Japan
Prior art keywords
adhesive layer
glass
tape
adhesive
base film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019100127A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020194905A (ja
Inventor
啓時 横井
侑弘 松原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2019100127A priority Critical patent/JP7269095B2/ja
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to PCT/JP2020/009035 priority patent/WO2020240964A1/ja
Priority to KR1020207037105A priority patent/KR102505643B1/ko
Priority to CN202080003823.3A priority patent/CN112351859B/zh
Priority to SG11202100514UA priority patent/SG11202100514UA/en
Priority to TW109117771A priority patent/TWI743810B/zh
Publication of JP2020194905A publication Critical patent/JP2020194905A/ja
Priority to PH12021550127A priority patent/PH12021550127A1/en
Application granted granted Critical
Publication of JP7269095B2 publication Critical patent/JP7269095B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2019100127A 2019-05-29 2019-05-29 ガラス加工用テープ Active JP7269095B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2019100127A JP7269095B2 (ja) 2019-05-29 2019-05-29 ガラス加工用テープ
KR1020207037105A KR102505643B1 (ko) 2019-05-29 2020-03-04 유리 가공용 테이프
CN202080003823.3A CN112351859B (zh) 2019-05-29 2020-03-04 玻璃加工用胶带
SG11202100514UA SG11202100514UA (en) 2019-05-29 2020-03-04 Tape for glass processing
PCT/JP2020/009035 WO2020240964A1 (ja) 2019-05-29 2020-03-04 ガラス加工用テープ
TW109117771A TWI743810B (zh) 2019-05-29 2020-05-28 玻璃加工用膠帶
PH12021550127A PH12021550127A1 (en) 2019-05-29 2021-01-18 Tape for glass processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019100127A JP7269095B2 (ja) 2019-05-29 2019-05-29 ガラス加工用テープ

Publications (2)

Publication Number Publication Date
JP2020194905A JP2020194905A (ja) 2020-12-03
JP7269095B2 true JP7269095B2 (ja) 2023-05-08

Family

ID=73545917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019100127A Active JP7269095B2 (ja) 2019-05-29 2019-05-29 ガラス加工用テープ

Country Status (7)

Country Link
JP (1) JP7269095B2 (ko)
KR (1) KR102505643B1 (ko)
CN (1) CN112351859B (ko)
PH (1) PH12021550127A1 (ko)
SG (1) SG11202100514UA (ko)
TW (1) TWI743810B (ko)
WO (1) WO2020240964A1 (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258341A (ja) 2009-04-28 2010-11-11 Mitsubishi Plastics Inc ダイシング用粘着シート
JP2012216842A (ja) 2011-03-31 2012-11-08 Furukawa Electric Co Ltd:The ダイシングテープ及び半導体ウエハ加工方法
JP2018166148A (ja) 2017-03-28 2018-10-25 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
JP6535119B1 (ja) 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0235119B2 (ja) * 1982-12-27 1990-08-08 Tokyo Gasu Kk Suiheichokyorisakushinkohoniokerukutsusakuhetsudo
JPH10310749A (ja) * 1997-05-13 1998-11-24 Mitsui Chem Inc 半導体ウエハダイシング用粘着フィルム及び半導体ウエハのダイシング方法
JP4743732B2 (ja) * 1999-04-09 2011-08-10 株式会社カネカ 線材被覆用接着性積層フィルム
JP4358502B2 (ja) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 半導体基板の切断方法
TWI310230B (en) * 2003-01-22 2009-05-21 Lintec Corp Adhesive sheet, method for protecting surface of semiconductor wafer and method for processing work
JP2004273895A (ja) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd 半導体ウエーハの分割方法
JP5519971B2 (ja) * 2008-11-26 2014-06-11 日東電工株式会社 ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP5554118B2 (ja) * 2010-03-31 2014-07-23 古河電気工業株式会社 ウエハ加工用テープ
JP5744434B2 (ja) * 2010-07-29 2015-07-08 日東電工株式会社 加熱剥離シート一体型半導体裏面用フィルム、半導体素子の回収方法、及び半導体装置の製造方法
KR20120068453A (ko) * 2010-12-17 2012-06-27 제일모직주식회사 다이싱 다이 본딩 필름
JP5019657B1 (ja) * 2011-10-27 2012-09-05 古河電気工業株式会社 半導体デバイス加工用粘着テープ
JP5053455B1 (ja) * 2011-10-28 2012-10-17 古河電気工業株式会社 半導体加工用ダイシングテープ
JP2013133464A (ja) * 2011-12-27 2013-07-08 Nitto Denko Corp ガラス板用粘着シート
JP5294358B2 (ja) * 2012-01-06 2013-09-18 古河電気工業株式会社 ウエハ加工用テープ及びこれを使用した半導体装置の製造方法
CN105143380B (zh) * 2013-03-28 2019-05-17 古河电气工业株式会社 粘合带及晶片加工用胶带
JP5607847B1 (ja) * 2013-11-29 2014-10-15 古河電気工業株式会社 半導体加工用粘着テープ
JP6295135B2 (ja) 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム
JP6506744B2 (ja) * 2014-05-12 2019-04-24 デンカ株式会社 半導体検査用の耐熱性粘着シート、及び半導体検査方法
JP6445315B2 (ja) * 2014-12-12 2018-12-26 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
CN107431002B (zh) 2015-03-24 2020-09-11 古河电气工业株式会社 半导体加工用带
JP2017147293A (ja) 2016-02-16 2017-08-24 日立化成株式会社 接着シートとダイシングテープを用いる半導体装置の製造方法
JP6978890B2 (ja) * 2017-10-16 2021-12-08 リンテック株式会社 ダイシングダイボンディングシート及び半導体チップの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258341A (ja) 2009-04-28 2010-11-11 Mitsubishi Plastics Inc ダイシング用粘着シート
JP2012216842A (ja) 2011-03-31 2012-11-08 Furukawa Electric Co Ltd:The ダイシングテープ及び半導体ウエハ加工方法
JP2018166148A (ja) 2017-03-28 2018-10-25 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
JP6535119B1 (ja) 2018-03-28 2019-06-26 古河電気工業株式会社 半導体加工用テープ

Also Published As

Publication number Publication date
KR102505643B1 (ko) 2023-03-06
CN112351859B (zh) 2023-04-11
KR20210015891A (ko) 2021-02-10
WO2020240964A1 (ja) 2020-12-03
JP2020194905A (ja) 2020-12-03
TW202043400A (zh) 2020-12-01
PH12021550127A1 (en) 2021-10-04
CN112351859A (zh) 2021-02-09
SG11202100514UA (en) 2021-02-25
TWI743810B (zh) 2021-10-21

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