SG11202009058SA - Substrate lifting apparatus and substrate transferring method - Google Patents

Substrate lifting apparatus and substrate transferring method

Info

Publication number
SG11202009058SA
SG11202009058SA SG11202009058SA SG11202009058SA SG11202009058SA SG 11202009058S A SG11202009058S A SG 11202009058SA SG 11202009058S A SG11202009058S A SG 11202009058SA SG 11202009058S A SG11202009058S A SG 11202009058SA SG 11202009058S A SG11202009058S A SG 11202009058SA
Authority
SG
Singapore
Prior art keywords
substrate
lifting apparatus
transferring method
substrate transferring
substrate lifting
Prior art date
Application number
SG11202009058SA
Other languages
English (en)
Inventor
Katsunori Fujii
Masanori Ito
Original Assignee
Ulvac Techno Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Techno Ltd filed Critical Ulvac Techno Ltd
Publication of SG11202009058SA publication Critical patent/SG11202009058SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11202009058SA 2018-07-30 2019-05-08 Substrate lifting apparatus and substrate transferring method SG11202009058SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018142815 2018-07-30
PCT/JP2019/018355 WO2020026549A1 (ja) 2018-07-30 2019-05-08 基板リフト装置及び基板搬送方法

Publications (1)

Publication Number Publication Date
SG11202009058SA true SG11202009058SA (en) 2020-10-29

Family

ID=69231192

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202009058SA SG11202009058SA (en) 2018-07-30 2019-05-08 Substrate lifting apparatus and substrate transferring method

Country Status (6)

Country Link
US (1) US12020967B2 (ja)
JP (1) JP7111816B2 (ja)
KR (1) KR102451031B1 (ja)
CN (1) CN112514047B (ja)
SG (1) SG11202009058SA (ja)
WO (1) WO2020026549A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7515327B2 (ja) 2020-07-13 2024-07-12 東京エレクトロン株式会社 基板離脱方法及びプラズマ処理装置
JP2022165477A (ja) * 2021-04-20 2022-11-01 日新イオン機器株式会社 ウエハ支持装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3245369B2 (ja) 1996-11-20 2002-01-15 東京エレクトロン株式会社 被処理体を静電チャックから離脱する方法及びプラズマ処理装置
JP3725967B2 (ja) * 1997-06-20 2005-12-14 株式会社日立製作所 静電吸着した試料を離脱する方法
JPH11243137A (ja) * 1998-10-14 1999-09-07 Nec Corp 静電チャック
EP1406472A1 (en) * 2001-07-09 2004-04-07 Ibiden Co., Ltd. Ceramic heater and ceramic joined article
JP2004040047A (ja) * 2002-07-08 2004-02-05 Tokyo Electron Ltd 処理装置及び静電チャックからの被吸着体の脱離方法
TW594297B (en) * 2002-07-19 2004-06-21 Hitachi Ind Co Ltd Substrate assembling device
US7243003B2 (en) * 2002-08-31 2007-07-10 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
JP2004228488A (ja) * 2003-01-27 2004-08-12 Matsushita Electric Ind Co Ltd 基板搬送方法
JP2006303138A (ja) 2005-04-20 2006-11-02 Seiko Epson Corp 半導体製造装置及び半導体装置の製造方法
KR100566324B1 (ko) * 2005-05-09 2006-03-31 주식회사 에이디피엔지니어링 평판표시소자 제조장치의 리프트 핀 모듈
JP4836512B2 (ja) * 2005-07-29 2011-12-14 東京エレクトロン株式会社 基板昇降装置および基板処理装置
JP2008041896A (ja) * 2006-08-04 2008-02-21 Tokyo Electron Ltd 基板検知機構およびそれを用いた基板処理装置
JP2008041969A (ja) * 2006-08-08 2008-02-21 Matsushita Electric Ind Co Ltd 基板の脱離方法
JP4795899B2 (ja) * 2006-08-31 2011-10-19 東京エレクトロン株式会社 基板載置機構および基板受け渡し方法
US8652260B2 (en) * 2008-08-08 2014-02-18 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus for holding semiconductor wafers
KR20110086698A (ko) * 2008-11-12 2011-07-29 에섹 에스에이 테이프로부터 반도체 칩을 탈착 및 제거하기 위한 방법
US8270142B2 (en) 2008-12-10 2012-09-18 Axcelis Technologies, Inc. De-clamping wafers from an electrostatic chuck
US8363378B2 (en) * 2009-02-17 2013-01-29 Intevac, Inc. Method for optimized removal of wafer from electrostatic chuck
JP2010199239A (ja) 2009-02-24 2010-09-09 Tokyo Electron Ltd 被処理基板の除電方法及び基板処理装置
US8313612B2 (en) * 2009-03-24 2012-11-20 Lam Research Corporation Method and apparatus for reduction of voltage potential spike during dechucking
US8797705B2 (en) * 2009-09-10 2014-08-05 Lam Research Corporation Methods and arrangement for plasma dechuck optimization based on coupling of plasma signaling to substrate position and potential
JP5770575B2 (ja) * 2011-09-12 2015-08-26 株式会社アルバック 酸化皮膜の形成方法
JP6342299B2 (ja) 2014-11-04 2018-06-13 株式会社アルバック 基板割れ判定方法
KR20170024215A (ko) * 2015-08-24 2017-03-07 세메스 주식회사 기판 지지 유닛, 기판 처리 장치, 그리고 기판 처리 방법

Also Published As

Publication number Publication date
WO2020026549A1 (ja) 2020-02-06
KR102451031B1 (ko) 2022-10-06
US12020967B2 (en) 2024-06-25
CN112514047B (zh) 2024-05-03
CN112514047A (zh) 2021-03-16
JPWO2020026549A1 (ja) 2021-02-25
KR20210021558A (ko) 2021-02-26
JP7111816B2 (ja) 2022-08-02
US20230163010A1 (en) 2023-05-25

Similar Documents

Publication Publication Date Title
EP3852403C0 (en) COMMUNICATION METHOD AND DEVICE
SG10201706446VA (en) An Apparatus and Method for Transferring Electronic Devices
EP3580778A4 (en) APPARATUS AND METHOD FOR STACKING SEMICONDUCTOR DEVICES
SG10201911998QA (en) Substrate processing method and substrate processing apparatus
EP3817453C0 (en) COMMUNICATION METHOD AND DEVICE
SG10201908830SA (en) Pre-alignment apparatus and method
SG11202007852YA (en) Substrate cleaning device and substrate cleaning method
GB201917734D0 (en) Method, substrate and apparatus
TWI800551B (zh) 用以將基板平坦化之裝置及方法
EP3461075A4 (en) GATEWAY DEVICE AND TRANSMISSION PROCEDURE
GB201803295D0 (en) Communication apparatus and method
EP3525566C0 (en) SUBSTRATE INSPECTION DEVICE AND METHOD FOR COMPENSATING SUBSTRATE DISTORTION THEREFROM
SG11202009058SA (en) Substrate lifting apparatus and substrate transferring method
EP3489620C0 (en) SUBSTRATE INSPECTION APPARATUS AND RELATED METHOD
SG11202005897RA (en) Communication apparatus and communication method
PL3476782T3 (pl) Przyrząd do przenoszenia przedmiotów oraz sposób
EP3642386C0 (en) DEVICE AND METHOD FOR SUBSTRATE PROCESSING
SG10202008685UA (en) Etching apparatus and etching method
EP3969127C0 (en) ROPE LOWERING DEVICE AND CORRESPONDING LOWERING METHOD
RS64170B1 (sr) Postupak i uređaj za prenos odmotača
SG10201905253RA (en) Teaching apparatus and teaching method for substrate transfer system
SG10201906216RA (en) Substrate cleaning device and substrate cleaning method
SG10202012718VA (en) Substrate processing apparatus and substrate processing method
KR102274622B9 (ko) 기판 검사 장치 및 기판 검사 방법
SG10201906930VA (en) Etching method and etching apparatus