KR100566324B1 - 평판표시소자 제조장치의 리프트 핀 모듈 - Google Patents
평판표시소자 제조장치의 리프트 핀 모듈 Download PDFInfo
- Publication number
- KR100566324B1 KR100566324B1 KR1020050038552A KR20050038552A KR100566324B1 KR 100566324 B1 KR100566324 B1 KR 100566324B1 KR 1020050038552 A KR1020050038552 A KR 1020050038552A KR 20050038552 A KR20050038552 A KR 20050038552A KR 100566324 B1 KR100566324 B1 KR 100566324B1
- Authority
- KR
- South Korea
- Prior art keywords
- lift pin
- lift
- pin
- display device
- flat panel
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (4)
- 평판표시소자 제조장치에 설치되어 기판을 승강하게 하는 리프트 핀 모듈에 있어서,상기 리프트 핀 모듈은,챔버 하벽과, 그 하벽에서 소정 거리 이격된 리프트 핀 플레이트에 각각 고정되고 그 사이에 벨로우즈가 마련되는 상, 하부 플랜지 중 상기 하부 플랜지에 수직방향으로 체결되되 다수개로 이루어지며, 최상부 영역에 수용 홈이 형성되는 제1 리프트 핀;상기 제1 리프트 핀의 수용 홈에 수용될 수 있도록 하부 영역에 삽입 돌기가 형성되는 핀 결합구;상기 핀 결합구가 제1 리프트 핀의 수용 홈에서 이탈되는 것을 방지할 수 있도록 마련되는 핀 결합구 고정부재;상기 핀 결합구의 상부 영역에 체결되어 고정되며, 수직 방향으로 마련되는 제2 리프트 핀;으로 이루어진 것을 특징으로 하는 평판표시소자 제조장치의 리프트 핀 모듈.
- 삭제
- 제 1항에 있어서,상기 핀 결합구의 삽입 돌기 면적이 제1 리프트 핀의 수용 홈의 면적보다 작게 마련되는 것을 특징으로 하는 평판표시소자 제조장치의 리프트 핀 모듈.
- 제 3항에 있어서,상기 제1 리프트 핀의 중심에서 제2 리프트 핀의 중심이 1㎜ 내에서 이동하는 것을 특징으로 하는 평판표시소자 제조장치의 리프트 핀 모듈.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050038552A KR100566324B1 (ko) | 2005-05-09 | 2005-05-09 | 평판표시소자 제조장치의 리프트 핀 모듈 |
TW095116472A TWI354824B (en) | 2005-05-09 | 2006-05-09 | Lift pin module of flat panel display manufacturin |
CNB2006100798182A CN100511634C (zh) | 2005-05-09 | 2006-05-09 | 平板显示器制造设备的起模针模块 |
CN2008100857048A CN101308806B (zh) | 2005-05-09 | 2006-05-09 | 平板显示器制造设备的起模针模块 |
CN200810085709A CN100592492C (zh) | 2005-05-09 | 2006-05-09 | 平板显示器制造设备的起模针模块 |
CN2008100857118A CN101261791B (zh) | 2005-05-09 | 2006-05-09 | 平板显示器制造设备的起模针模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050038552A KR100566324B1 (ko) | 2005-05-09 | 2005-05-09 | 평판표시소자 제조장치의 리프트 핀 모듈 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100566324B1 true KR100566324B1 (ko) | 2006-03-31 |
Family
ID=37180121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020050038552A KR100566324B1 (ko) | 2005-05-09 | 2005-05-09 | 평판표시소자 제조장치의 리프트 핀 모듈 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR100566324B1 (ko) |
CN (4) | CN101308806B (ko) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100850239B1 (ko) * | 2007-09-06 | 2008-08-04 | 주식회사 에이디피엔지니어링 | 기판합착장치 |
KR100850240B1 (ko) | 2007-09-06 | 2008-08-04 | 주식회사 에이디피엔지니어링 | 기판합착장치 |
KR100899175B1 (ko) | 2007-09-06 | 2009-05-26 | 주식회사 에이디피엔지니어링 | 기판합착장치 |
KR101312501B1 (ko) * | 2011-03-02 | 2013-10-01 | 엘아이지에이디피 주식회사 | 리프트 핀 모듈 및 이것을 포함하는 평판표시소자 제조장치 |
KR101447888B1 (ko) | 2012-12-21 | 2014-10-08 | 주식회사 테스 | 기판 처리장치 |
KR101738986B1 (ko) * | 2015-12-07 | 2017-05-24 | 주식회사 디엠에스 | 리프트 핀 어셈블리를 갖는 기판처리장치 |
US11282738B2 (en) | 2019-12-16 | 2022-03-22 | Samsung Electronics Co., Ltd. | Lift pin module |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103903947B (zh) * | 2012-12-26 | 2016-05-11 | 中微半导体设备(上海)有限公司 | 一种等离子处理器及其运行方法 |
JP2014184998A (ja) * | 2013-03-22 | 2014-10-02 | Dainippon Screen Mfg Co Ltd | 板状被搬送物の受渡方法、受渡装置およびパターン形成装置 |
CN104658957B (zh) * | 2013-11-18 | 2018-03-06 | 北京北方华创微电子装备有限公司 | 顶针机构及等离子体加工设备 |
CN105947676B (zh) * | 2016-06-29 | 2018-01-30 | 武汉华星光电技术有限公司 | 可换式吸附装置 |
CN108010838B (zh) * | 2016-10-27 | 2020-09-04 | 中微半导体设备(上海)股份有限公司 | 等离子体处理装置及硅片温度测量方法 |
CN106582915A (zh) * | 2016-12-31 | 2017-04-26 | 合肥优亿科机电科技有限公司 | 一种超净台自动电极探入装置 |
US12020967B2 (en) * | 2018-07-30 | 2024-06-25 | Ulvac Techno, Ltd. | Substrate lifting apparatus and substrate transferring method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6120609A (en) * | 1996-10-25 | 2000-09-19 | Applied Materials, Inc. | Self-aligning lift mechanism |
-
2005
- 2005-05-09 KR KR1020050038552A patent/KR100566324B1/ko active Pre-grant Review Request
-
2006
- 2006-05-09 CN CN2008100857048A patent/CN101308806B/zh not_active Expired - Fee Related
- 2006-05-09 CN CN2008100857118A patent/CN101261791B/zh not_active Expired - Fee Related
- 2006-05-09 CN CN200810085709A patent/CN100592492C/zh not_active Expired - Fee Related
- 2006-05-09 CN CNB2006100798182A patent/CN100511634C/zh not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100850239B1 (ko) * | 2007-09-06 | 2008-08-04 | 주식회사 에이디피엔지니어링 | 기판합착장치 |
KR100850240B1 (ko) | 2007-09-06 | 2008-08-04 | 주식회사 에이디피엔지니어링 | 기판합착장치 |
KR100899175B1 (ko) | 2007-09-06 | 2009-05-26 | 주식회사 에이디피엔지니어링 | 기판합착장치 |
KR101312501B1 (ko) * | 2011-03-02 | 2013-10-01 | 엘아이지에이디피 주식회사 | 리프트 핀 모듈 및 이것을 포함하는 평판표시소자 제조장치 |
KR101447888B1 (ko) | 2012-12-21 | 2014-10-08 | 주식회사 테스 | 기판 처리장치 |
KR101738986B1 (ko) * | 2015-12-07 | 2017-05-24 | 주식회사 디엠에스 | 리프트 핀 어셈블리를 갖는 기판처리장치 |
CN106971961A (zh) * | 2015-12-07 | 2017-07-21 | 显示器生产服务株式会社 | 具有提升销组件的基板处理装置 |
CN106971961B (zh) * | 2015-12-07 | 2019-12-10 | 显示器生产服务株式会社 | 具有提升销组件的基板处理装置 |
US11282738B2 (en) | 2019-12-16 | 2022-03-22 | Samsung Electronics Co., Ltd. | Lift pin module |
Also Published As
Publication number | Publication date |
---|---|
CN101261953A (zh) | 2008-09-10 |
CN101308806B (zh) | 2011-02-02 |
CN101308806A (zh) | 2008-11-19 |
CN101261791A (zh) | 2008-09-10 |
CN100511634C (zh) | 2009-07-08 |
CN101261791B (zh) | 2011-01-19 |
CN100592492C (zh) | 2010-02-24 |
CN1877806A (zh) | 2006-12-13 |
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